Polyimide film for preparing graphite film, high-thermal-conductivity graphite film prepared from polyimide film and preparation method thereof

A polyimide film, high thermal conductivity graphite technology, applied in chemical instruments and methods, inorganic chemistry, non-metallic elements, etc., can solve the problems of high market price of graphene oxide, low foaming efficiency, low strength, etc. Good appearance integrity, promotion of film foaming, excellent performance

Pending Publication Date: 2021-09-07
ANHUI GUOFENG PLASTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, domestic enterprises generally use the thermal imidization method to prepare polyimide films. Because the polyimide films prepared by the thermal imidization method have low foaming efficiency or even no foaming at high temperature, even if they can be graphitized to obtain graphite film, also requires a higher graphitization temperature, and graphite film has disadvantages such as low thermal conductivity, poor appearance, and low strength.
[0006] Chinese patent CN106832923B catalyzes high-temperature foaming of the film by doping calcium-containing compounds in the polyimide film. Although this me

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Preparation of polyacrylonitrile / polyamic acid solution:

[0039] Under a nitrogen atmosphere, add 4,4'-diaminodiphenyl ether and polyacrylonitrile powder (the number average molecular weight of polyacrylonitrile is 50,000) into N,N-dimethylformamide, stir for 20 minutes and then add homobenzene Tetraformic dianhydride, stirred and reacted at -20°C for 12 hours, to obtain a polyacrylonitrile / polyamic acid solution with a solid content of 25wt% and a viscosity of 3000 poise; wherein, the mass of polyacrylonitrile powder is 4,4'-diamino 5% of the mass sum of diphenyl ether and pyromellitic dianhydride, and the molar ratio of 4,4'-diaminodiphenyl ether to pyromellitic dianhydride is 1:1.

[0040] Preparation of polyimide film:

[0041] Cast the polyacrylonitrile / polyamic acid solution prepared above onto a glass plate, dry at 60°C for 60 minutes, at 80°C for 60 minutes, at 120°C for 60 minutes, and then at 220°C, 250°C, and 280°C , 310°C, 340°C, and 370°C for thermal imi...

Embodiment 2

[0046] Preparation of polyacrylonitrile / polyamic acid solution:

[0047] Under nitrogen atmosphere, add 4,4'-diaminodiphenyl ether, p-phenylenediamine and polyacrylonitrile powder (the number average molecular weight of polyacrylonitrile is 100000) into N,N-dimethylacetamide, stir After 20 minutes, 3,3',4,4'-biphenyltetracarboxylic dianhydride was added, and the reaction was stirred at -10°C for 10 hours to obtain a polyacrylonitrile / polyamic acid solution with a solid content of 25 wt% and a viscosity of 2800 poise; , the mass of polyacrylonitrile powder is 10% of the sum of mass of 4,4'-diaminodiphenyl ether, p-phenylenediamine, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 4,4 The molar ratio of '-diaminodiphenyl ether, p-phenylenediamine, and 3,3',4,4'-biphenyltetracarboxylic dianhydride is 7:3:10.

[0048] Preparation of polyimide film:

[0049] Cast the polyacrylonitrile / polyamic acid solution prepared above onto a glass plate, dry at 60°C for 60 minutes, at 80°C for ...

Embodiment 3

[0054] Preparation of polyacrylonitrile / polyamic acid solution:

[0055] Under nitrogen atmosphere, add 4,4'-diaminodiphenyl ether, 4,4'-diaminobenzophenone and polyacrylonitrile powder (the number average molecular weight of polyacrylonitrile is 150000) into dimethyl sulfoxide , after stirring for 20 minutes, add pyromellitic dianhydride and 3,3',4,4'-biphenyltetracarboxylic dianhydride, stir and react at 0°C for 8 hours, and obtain a polypropylene with a solid content of 20wt% and a viscosity of 2200 poise Nitrile / polyamic acid solution; wherein, the quality of polyacrylonitrile powder is 4,4'-diaminodiphenyl ether, 4,4'-diaminobenzophenone, pyromellitic dianhydride, 3,3', 15% of the mass sum of 4,4'-biphenyltetracarboxylic dianhydride, 4,4'-diaminodiphenyl ether, 4,4'-diaminobenzophenone, pyromellitic dianhydride, 3,3 The molar ratio of ',4,4'-biphenyltetracarboxylic dianhydride is 8:2:5:5.

[0056] Preparation of polyimide film:

[0057] Cast the polyacrylonitrile / polya...

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Abstract

The invention discloses a polyimide film for preparing a graphite film. The polyimide film is prepared by performing film forming and thermal imidization on a polyacrylonitrile/polyamide acid solution, the invention further discloses a high-thermal-conductivity graphite film prepared from the polyimide film and a preparation method of the high-thermal-conductivity graphite film, and the preparation method comprises the following steps: S1, carbonizing the polyimide film at high temperature to obtain a polyimide carbonized film; and S2, carrying out high-temperature graphitization on the polyimide carbonized film to obtain the high-thermal-conductivity graphite film. According to the preparation method, the polyacrylonitrile/polyamide acid solution is adopted as a raw material, the polyimide film is prepared through a thermal imidization method, the graphite film can be prepared through over-carbonization and graphitization, and the prepared graphite film has high thermal conductivity, high strength, good appearance integrity and excellent performance.

Description

technical field [0001] The invention relates to the technical field of film preparation, in particular to a polyimide film used for preparing a graphite film, a high thermal conductivity graphite film prepared by the polyimide film and a preparation method thereof. Background technique [0002] In recent years, electronic products such as mobile phones and tablet computers have been continuously developed in the direction of miniaturization and thinning, and the assembly density of electronic components has increased sharply. In order to ensure that the equipment can work stably for a long time, the heat generated during Timely escape, which puts forward very high requirements on the heat dissipation efficiency of heat dissipation materials. [0003] Artificial graphite film is one of the most advanced heat dissipation materials developed and applied in recent years. It is a high thermal conductivity material with a multilayer graphene structure. The thermal conductivity of...

Claims

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Application Information

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IPC IPC(8): C01B32/205
CPCC01B32/205
Inventor 史恩台孙善卫陈铸红方超潘成
Owner ANHUI GUOFENG PLASTIC
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