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Nanoparticle copper paste suitable for high-precision direct-writing 3D printing, preparation and application thereof

A 3D printing, nanoparticle technology, applied in heat treatment equipment, cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, etc., can solve problems such as easy oxidation, reduce costs and improve adhesion performance, the effect of good electrical conductivity

Active Publication Date: 2021-09-07
西湖未来智造(杭州)科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a nanoparticle copper paste suitable for high-precision direct writing 3D printing, its preparation and use, using triarylphosphine and trialkylphosphine compounds as reducing agents and preparing copper nanoparticles to contain epoxy The oil-soluble paste of resin solves the problem that the nano-particle copper paste is easily oxidized during the preparation and storage process, improves the conductivity of the nano-particle copper paste, and makes it suitable for high-precision direct writing 3D printing

Method used

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  • Nanoparticle copper paste suitable for high-precision direct-writing 3D printing, preparation and application thereof
  • Nanoparticle copper paste suitable for high-precision direct-writing 3D printing, preparation and application thereof
  • Nanoparticle copper paste suitable for high-precision direct-writing 3D printing, preparation and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Weigh 8g of bisphenol A type epoxy resin, dissolve it in 15g of butyl acetate solvent, heat it to 80°C and keep it for 1 hour until it is completely dissolved to obtain the preliminary carrier; weigh 1g of acid anhydride curing agent, add it to the preliminary carrier, Use a high-speed disperser for high-speed dispersion, heat it to 30-35°C and age for 2 hours to obtain an organic carrier; weigh 70g of 100-200nm copper powder, 5g of reducing agent triphenylphosphine, and non-conductive filler nano-graphene powder 0.2g, 0.8g of 50nm silicon dioxide powder; fully mix with the organic carrier in a mixer, and then use a high-speed disperser to disperse at a high speed to obtain a uniform initial slurry; process the initial slurry on a three-roll machine Roll rolling for 6 times until the fineness of <1μm is reached, and then filter through a 10μm filter to obtain the finished copper paste A.

Embodiment 2

[0046] Weigh 6g of E-44 epoxy resin, dissolve it in 10g of polyethylene glycol solvent, heat it to 80°C and keep it for 1 hour until it is completely dissolved to obtain the preliminary carrier; weigh 0.5g of polythiol curing agent, add it to the preliminary carrier In the process, use a high-speed disperser to disperse at a high speed, heat it to 30-35°C and age for 2 hours after dispersing evenly, to obtain an organic carrier; weigh 70g of copper powder with a thickness of 500-600nm, 5g of reducing agent trioctylphosphine, and non-conductive filler nano-graphite olefin powder 0.2g, 50nm silicon dioxide powder 0.8g; fully mix with the organic carrier in a mixer, and then use a high-speed disperser to disperse at a high speed to obtain a uniform initial slurry; put the initial slurry on three rolls Rolling machine for 6 times until the fineness of <1μm is reached, and then filtered through a filter screen of 10μm to obtain the finished copper paste B.

Embodiment 3

[0048] Weigh 5g of biphenyl oxygen-type epoxy resin, dissolve it in 7g of diethylene glycol ether acetate solvent, heat to 80°C for 1 hour, until completely dissolved to obtain a preliminary carrier; weigh 0.5g of dicyandiamide curing agent, Add it to the preliminary carrier, disperse at a high speed with a high-speed disperser, heat it to 30-35°C for 2 hours after dispersing evenly, and obtain an organic carrier; weigh 70g of copper powder with a thickness of 1-2μm, and the reducing agent tri-p-methylphenylphosphine 5g; fully mix with the organic carrier in a mixer, and then use a high-speed disperser to disperse at a high speed to obtain a uniform primary slurry; roll the primary slurry 6 times on a three-roll machine to achieve a fineness of <1 μm degree, and then filtered through a 10 μm filter to obtain the finished copper paste C.

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Abstract

The present invention provides a nanoparticle copper paste suitable for high-precision direct-writing 3D printing and the preparation and application thereof. A triaryl phosphine or trialkyl phosphine compound is adopted as a copper powder protective agent, and copper nanoparticles are prepared into the oil-soluble paste containing the epoxy resin, so that the problem that the nanoparticle copper paste is prone to being oxidized in the preparation and storage process is solved, the conductivity of the nano-particle copper paste is improved, and the nano-particle copper paste is suitable for the high-precision direct-writing 3D printing.

Description

technical field [0001] The invention relates to a conductive paste, in particular to a nano-particle copper paste suitable for high-precision direct writing 3D printing, its preparation and use. Background technique [0002] Compared with the traditional process, the metal 3D printing process has shown incomparable advantages in shortening the development and realization cycle of new products, forming more complex structures efficiently, realizing integration, lightweight design, and achieving excellent mechanical properties. . At present, in the field of metal 3D printing technology, silver nanoparticles are the most widely used. This is because silver nanoparticles have the characteristics of easy sintering, high electrical conductivity, and oxidation resistance, which make them perform well in metal 3D printing. However, as the raw material of metal 3D printing, silver material has a fatal flaw: high price, which greatly limits the development and application of metal 3D...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B1/16H01B13/00B33Y70/10B33Y80/00
CPCH01B1/22H01B1/16H01B13/00H01B13/0016B33Y70/10B33Y80/00B33Y10/00B22F1/054B22F1/056B22F1/05B22F1/107B22F10/10B22F5/12B22F2998/10C22C1/05C08K2003/085C08K5/50C08K5/0025C08K3/08C08K3/04C08K3/042C08K3/34C08K3/36C08K2201/005C08K2201/011B22F3/10C08L63/00B22F1/07C22C1/0425B22F10/34B22F1/0545B22F2301/10B22F2302/256B22F2302/40B22F2302/45B22F2304/054B22F2304/056B22F2304/058
Inventor 周南嘉陈小朋
Owner 西湖未来智造(杭州)科技发展有限公司
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