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Thermocuring solvent-free polyurethane adhesive and preparation method thereof

A solvent-free polyurethane and adhesive technology, used in polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve the problems of inconvenient operation, low viscosity, environmental pollution, etc. The effect of simplicity, great application prospects and economic value

Pending Publication Date: 2021-10-01
武汉海翎化学工业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, most solvent-free polyurethane adhesives are two-component, using high-functional polyols as curing agents, and polyurethane prepolymers and high-functional polyols need to be mixed for use, which is inconvenient to use, and the two-component Adhesive viscosity is generally not high, low viscosity and inconvenient operation limit its wider application
And some one-component polyurethane adhesives that do not need to be cured mostly add organic solvents. Only after the solvent volatilizes can they achieve better bonding strength. The volatilization of solvents in this process will pollute the environment and cause adverse effects on human health.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0023] According to the technical scheme of the present invention, a specific heat-curing type solvent-free polyurethane adhesive preparation method comprises:

[0024] (1) Add 40-50 parts by mass of polytetrahydrofuran (PTMG), 4-7 parts by mass of ethylene glycol amine, 20-30 parts by mass of diisocyanate, and 0.1-0.2 parts by mass of dibutyltin dilaurate into a three-necked flask, Turn on nitrogen protection, and react for one hour at 60°C, 70°C, and 80°C under mechanical stirring;

[0025] (2) Add 4-8 parts by mass of temperature-sensitive curing agent to the reaction system that completed step (1), and react for one hour;

[0026] (3) Cool down the reaction system after step (2) to 30°C, add 0.1-0.2 parts of a free radical initiator, mix evenly and discharge to obtain the thermosetting solvent-free polyurethane adhesive;

[0027] in:

[0028] Preferably, the dosage of each raw material is: 20 parts by mass of diisocyanate, 44 parts by mass of polytetrahydrofuran PTMG, 4 ...

Embodiment 1

[0035] Heat-cure, solvent-free polyurethane adhesives are prepared by the following process:

[0036] (1) 44 parts by mass of PTMG with a molecular weight of 1000 and 5 parts by mass of ethylene glycol amine were vacuum dehydrated at 110°C, and then added with 5 parts by mass of MDI, 15 parts by mass of TDI, and 0.1 part by mass of dibutyltin dilaurate In the three-necked flask, turn on the nitrogen protection, and react for one hour at 60°C, 70°C, and 80°C under mechanical stirring;

[0037] (2) Add 4 mass parts of temperature-sensitive curing agent hydroxyethyl acrylate to the reaction system completed in (1), and react for one hour;

[0038] (3) Cool the reaction system completed in (2) to 30° C., add 0.1 part by mass of the initiator azobisisobutyronitrile, mix uniformly and discharge, and obtain the heat-curable solvent-free polyurethane adhesive.

Embodiment 2

[0040] Heat-cure, solvent-free polyurethane adhesives are prepared by the following procedure:

[0041] (1) 44 parts by mass of PTMG with a molecular weight of 1000 and 5 parts by mass of ethylene glycol amine were vacuum dehydrated at 110°C, and then mixed with 5 parts by mass of solid MDI, 10 parts by mass of TDI, 5 parts by mass of liquefied MDI, dilauric acid Add 0.1 parts by mass of dibutyltin into a three-necked flask, turn on nitrogen protection, and react under mechanical stirring at 60°C, 70°C, and 80°C for one hour each;

[0042] (2) Add 5 parts by mass of temperature-sensitive curing agent hydroxyethyl methacrylate to the reaction system completed in (1), and react for one hour;

[0043] (3) Cool the reaction system completed in (2) to 30° C., add 0.2 parts by mass of dibenzoyl peroxide as an initiator, mix evenly and discharge, to obtain the heat-curable solvent-free polyurethane adhesive.

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PUM

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Abstract

The invention discloses a thermocuring type solvent-free polyurethane adhesive and a preparation method thereof. The polyurethane adhesive is prepared from the following raw material components in parts by mass: 20 to 30 parts by mass of diisocyanate, 40 to 50 parts by mass of polytetrahydrofuran, 4 to 7 parts by mass of ethylene glycol amine, 4 to 8 parts by mass of a temperature-sensitive curing agent, 0.1 to 0.2 part by mass of dibutyltin dilaurate and 0.1 to 0.2 part by mass of a free radical initiator. The polyurethane adhesive disclosed by the invention is a solvent-free single-component adhesive, and has excellent bonding strength and thermal stability.

Description

technical field [0001] The invention relates to the technical field of thermosetting materials, in particular to the technical field of thermosetting polyurethane materials. Background technique [0002] In recent years, with the continuous improvement of people's awareness of environmental protection and the continuous promulgation of relevant national laws and regulations, the introduction of a series of policies by the environmental protection department on energy conservation and emission reduction and the implementation of organic solvent discharge charging methods have made solvent-free composite technology gain rapid development. promotion and development. From the perspective of industrial production and use, the solvent-free lamination technology represented by many advantages such as green environmental protection, safety, low cost, and high quality has been favored by the majority of flexible packaging practitioners. Of course, as a solvent-free polyurethane adhe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/16C08G18/66C08G18/48C08G18/32C08G18/67
CPCC09J175/16C08G18/4854C08G18/3275C08G18/6688C08G18/672C08G2170/00
Inventor 高建明李瑞海黄桐
Owner 武汉海翎化学工业有限公司