Thermocuring solvent-free polyurethane adhesive and preparation method thereof
A solvent-free polyurethane and adhesive technology, used in polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve the problems of inconvenient operation, low viscosity, environmental pollution, etc. The effect of simplicity, great application prospects and economic value
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[0023] According to the technical scheme of the present invention, a specific heat-curing type solvent-free polyurethane adhesive preparation method comprises:
[0024] (1) Add 40-50 parts by mass of polytetrahydrofuran (PTMG), 4-7 parts by mass of ethylene glycol amine, 20-30 parts by mass of diisocyanate, and 0.1-0.2 parts by mass of dibutyltin dilaurate into a three-necked flask, Turn on nitrogen protection, and react for one hour at 60°C, 70°C, and 80°C under mechanical stirring;
[0025] (2) Add 4-8 parts by mass of temperature-sensitive curing agent to the reaction system that completed step (1), and react for one hour;
[0026] (3) Cool down the reaction system after step (2) to 30°C, add 0.1-0.2 parts of a free radical initiator, mix evenly and discharge to obtain the thermosetting solvent-free polyurethane adhesive;
[0027] in:
[0028] Preferably, the dosage of each raw material is: 20 parts by mass of diisocyanate, 44 parts by mass of polytetrahydrofuran PTMG, 4 ...
Embodiment 1
[0035] Heat-cure, solvent-free polyurethane adhesives are prepared by the following process:
[0036] (1) 44 parts by mass of PTMG with a molecular weight of 1000 and 5 parts by mass of ethylene glycol amine were vacuum dehydrated at 110°C, and then added with 5 parts by mass of MDI, 15 parts by mass of TDI, and 0.1 part by mass of dibutyltin dilaurate In the three-necked flask, turn on the nitrogen protection, and react for one hour at 60°C, 70°C, and 80°C under mechanical stirring;
[0037] (2) Add 4 mass parts of temperature-sensitive curing agent hydroxyethyl acrylate to the reaction system completed in (1), and react for one hour;
[0038] (3) Cool the reaction system completed in (2) to 30° C., add 0.1 part by mass of the initiator azobisisobutyronitrile, mix uniformly and discharge, and obtain the heat-curable solvent-free polyurethane adhesive.
Embodiment 2
[0040] Heat-cure, solvent-free polyurethane adhesives are prepared by the following procedure:
[0041] (1) 44 parts by mass of PTMG with a molecular weight of 1000 and 5 parts by mass of ethylene glycol amine were vacuum dehydrated at 110°C, and then mixed with 5 parts by mass of solid MDI, 10 parts by mass of TDI, 5 parts by mass of liquefied MDI, dilauric acid Add 0.1 parts by mass of dibutyltin into a three-necked flask, turn on nitrogen protection, and react under mechanical stirring at 60°C, 70°C, and 80°C for one hour each;
[0042] (2) Add 5 parts by mass of temperature-sensitive curing agent hydroxyethyl methacrylate to the reaction system completed in (1), and react for one hour;
[0043] (3) Cool the reaction system completed in (2) to 30° C., add 0.2 parts by mass of dibenzoyl peroxide as an initiator, mix evenly and discharge, to obtain the heat-curable solvent-free polyurethane adhesive.
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