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Polyimide self-repairing material based on hydrogen bonds and preparation method thereof

A self-healing material, polyimide technology, applied in the field of polymer materials, can solve problems affecting material performance, uneven temperature distribution, etc.

Pending Publication Date: 2021-10-12
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in recent years, with the continuous progress of intelligence and informatization, in the application of materials, due to the influence of complex environments such as stress concentration and uneven temperature distribution, a large number of defects are formed inside the material, which in turn affects the performance of the material and safety. coefficient and life

Method used

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  • Polyimide self-repairing material based on hydrogen bonds and preparation method thereof
  • Polyimide self-repairing material based on hydrogen bonds and preparation method thereof
  • Polyimide self-repairing material based on hydrogen bonds and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] (1) Synthesis of soft-segment EM based on hydrogen bond self-healing: First, 0.1mol 2,2'-(ethylenedioxy)diethylamine was dispersed in 100mL of ultra-dry N,N dimethylacetamide. Inject argon, and stir at -10°C for 30 minutes. Then, 0.1 mol of dicyclohexylmethane-4,4′-diisocyanate was dispersed in 20 mL of ultra-dry N,N dimethylacetamide. Then, the dicyclohexylmethane-4,4'-diisocyanate solution was slowly dropped into the reactor and continued to react for 5 hours to obtain a soft segment EM dispersion with hydrogen bond self-healing.

[0033] (2) Synthesis of polyamic acid (PAA): Firstly, at -10°C, under argon atmosphere, 0.1mol 2,2'-(ethylenedioxy)diethylamine was completely dispersed in 100mL of N,N dimethyl In the acetamide solution, equimolar 4,4-diaminodiphenyl ether was added in 4 times, and reacted for 8 hours after the addition, the solution was brown and viscous, and polyamic acid (PAA) was obtained.

[0034] (3) In an argon atmosphere at -10°C, equal volumes o...

Embodiment 2

[0036] (1) Synthesis of soft-segment EM based on hydrogen bond self-healing: First, 0.1mol 2,2'-(ethylenedioxy)diethylamine was dispersed in 100mL of ultra-dry N,N dimethylacetamide. Inject argon, and stir at -5°C for 30 min. Then, 0.1 mol of dicyclohexylmethane-4,4′-diisocyanate was dispersed in 20 mL of ultra-dry N,N dimethylacetamide. Then, the dicyclohexylmethane-4,4'-diisocyanate solution was slowly dropped into the reactor and continued to react for 8 hours to obtain a soft segment EM dispersion with hydrogen bond self-healing.

[0037] (2) Synthesis of polyamic acid (PAA): Firstly, at -5°C, under argon atmosphere, 0.1mol 2,2'-(ethylenedioxy)diethylamine was completely dispersed in 100mL of N,N dimethyl In the acetamide solution, equimolar 4,4-diaminodiphenyl ether was added in 3 times, and reacted for 15 hours after the addition, the solution was brown and viscous, and polyamic acid (PAA) was obtained.

[0038] (3) In an argon atmosphere at -5°C, equal volumes of poly...

Embodiment 3

[0040](1) Synthesis of soft-segment EM based on hydrogen bond self-healing: First, 0.1mol 2,2'-(ethylenedioxy)diethylamine was dispersed in 100mL of ultra-dry N,N dimethylacetamide. Inject argon, and stir at -10°C for 30 minutes. Then, 0.1 mol of dicyclohexylmethane-4,4′-diisocyanate was dispersed in 20 mL of ultra-dry N,N dimethylacetamide. Then, the dicyclohexylmethane-4,4'-diisocyanate solution was slowly dropped into the reactor and continued to react for 10 hours to obtain a soft segment EM dispersion with hydrogen bond self-healing.

[0041] (2) Synthesis of polyamic acid (PAA): Firstly, at -10°C, under argon atmosphere, 0.1mol 2,2'-(ethylenedioxy)diethylamine was completely dispersed in 100mL of N,N dimethyl To the acetamide solution, add equimolar 4,4-diaminodiphenyl ether in 3-4 times, react for 12 hours after the addition, the solution is brown and viscous, and polyamic acid (PAA) is obtained.

[0042] (3) In an argon atmosphere at -10°C, equal volumes of polyamic ...

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Abstract

The invention discloses a polyimide self-repairing material based on hydrogen bonds and a preparation method of the polyimide self-repairing material. The preparation method comprises the following steps: reacting a 2, 2 '-(ethylenedioxy) diethylamine material with a dicyclohexylmethane-4, 4'-diisocyanate material to generate a soft-segment polymer with a self-repairing function, then reacting p-phenylenediamine with 4, 4-diaminodiphenyl ether to generate polyamide acid, and then reacting PAA with amino groups with the soft-segment polymer with the self-repairing function to obtain a polyamide acid material with hydrogen bond repairing function, and carrying out dehydration treatment on the polyamide acid material to obtain the polyimide material with the self-repairing function. Through analysis, the material is successfully prepared and has the strength of a traditional polyimide material and a self-repairing effect, and very favorable conditions are created for popularization and application of the polyimide material.

Description

technical field [0001] The invention belongs to the field of polymer materials with both structure and function. More specifically, it relates to a polyimide self-repairing material based on hydrogen bonds and its synthesis method, which will be used in electromagnetic shielding materials, mechanical engineering in the future Materials and anti-radiation materials have broad application prospects. Background technique [0002] Polyimide is a kind of polymer containing imide ring in the main chain. Because of its outstanding strength, radiation resistance, high temperature resistance, easy processing, radiation resistance and other properties, it is used in high temperature resistant coatings, aerospace, waterproof fabrics There are very important applications in the fields of fiber and optoelectronic materials. However, in recent years, with the continuous progress of intelligence and informatization, in the application of materials, due to the influence of complex environm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G81/00C08G73/10C08G18/75C08G18/32C08G18/83
CPCC08G81/00C08G73/1003C08G73/105C08G73/1082C08G18/758C08G18/3228C08G18/833
Inventor 冯奕钰俞慧涛陈灿张志兴封伟
Owner TIANJIN UNIV
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