A radiation-hardened sic device structure based on distributed capacitance
A radiation hardening, device structure technology, applied in electrical components, semiconductor devices, circuits, etc., can solve problems such as catastrophic accidents, failures, and inability to meet the requirements of aerospace applications in electronic systems, and achieve the effect of improving the ability to resist single particles
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[0019] Taking the MOSFET device as an example, the basic structure of the present invention is compared with the traditional structure such as figure 1 . The main structure Including, a SiC substrate 101 of the first doping type, a SiC epitaxial layer 102 of the first doping type grown on the substrate, a well 103 of the second doping type implanted in the epitaxial layer, and implanted in the well Formed first doping type source 104, second doping type ohmic contact region 105, gate oxide layer 111, metal or polycrystalline gate 110, isolation dielectric layer 112, and metal source on the SiC epitaxial surface 120, and the metal drain 130 will be connected to the bottom. There is no essential difference in appearance between the above structure and the traditional MOSFET, but the only difference lies in the highly doped region 106 of the second doping type distributed in the low doping epitaxial layer 102 of the first doping type. The above two doping types can be interch...
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