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Process for producing cathode copper through electrolytic refining of low-grade copper anode plate

A copper anode plate, electrolytic refining technology, applied in the direction of photography process, photography auxiliary process, improvement of process efficiency, etc., can solve the problem of inability to meet the electrolytic refining treatment of high arsenic and low copper content anode plate, and achieve excellent technical and economic indicators , The effect of high quality product, high product rate and stable process control

Pending Publication Date: 2021-10-29
JINCHUAN GROUP LIMITED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the technical conditions of the electrolysis process and the additive system under the above-mentioned low-impurity raw material conditions cannot meet the electrolytic refining treatment of high-arsenic, high-nickel, and low-copper anode plates, and propose a highly targeted, process-controlled Stable process with high product quality and high rate

Method used

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  • Process for producing cathode copper through electrolytic refining of low-grade copper anode plate
  • Process for producing cathode copper through electrolytic refining of low-grade copper anode plate

Examples

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Effect test

Embodiment 1

[0019] A process for producing cathode copper by electrolytic refining of low-grade copper anode plates, the composition of the electrolytic solution used in the electrolytic refining is: H 2 SO 4 : 190g / L; Ni 2+ : 10g / L; As: 10g / L; Cu 2+ : 42g / L; Additives are ADT, gelatin, thiourea and hydrochloric acid, the amount of ADT added is 10g / t.Cu, the amount of 12 degree gelatin added is 20g / t.Cu; the amount of thiourea added is 60g / t.Cu, The amount of hydrochloric acid added is 200ml / t.Cu, and the ratio of thiourea to 12-degree gelatin is 2.5:1.

[0020] Electrolyte temperature is 62°C, current density: 270A / m 2 , The cell pressure of the electrolytic cell: 0.28V, the center distance of the same pole: 105mm, and the cycle volume of a single cell is 30L / min cell.

[0021] The specifications of high arsenic, high nickel and low copper anode plates are 1000×960×48mm, the weight is 375kg / piece, and the chemical composition (see Table 1).

[0022] Table 1 Anode Plate Chemical Comp...

Embodiment 2

[0028] A process for producing cathode copper by electrolytic refining of low-grade copper anode plates, the composition of the electrolytic solution used in the electrolytic refining is: H 2 SO 4 : 195g / L; Ni 2+ : 12g / L; As: 13g / L; Cu 2+ : 44g / L; the additives are ADT, gelatin, thiourea and hydrochloric acid, the amount of ADT added is 12g / t.Cu, the amount of 12 degree gelatin added is 30g / t.Cu; the amount of thiourea added is 50g / t.Cu, The added amount of hydrochloric acid is 250ml / t.Cu, and the ratio of added amount of thiourea to 12 degree gelatin is 1.67:1.

[0029] Electrolyte temperature is 63°C, current density: 275A / m 2 , The tank voltage of the electrolyzer: 0.30V, the center distance of the same pole: 105mm, and the circulation volume of a single tank is 30L / min.

[0030] The specifications of high arsenic, high nickel and low copper anode plates are 1000×960×48mm, the weight is 375kg / piece, and the chemical composition (see Table 3).

[0031] Table 3 Anode Pla...

Embodiment 3

[0037] A process for producing cathode copper by electrolytic refining of low-grade copper anode plates, the composition of the electrolytic solution used in the electrolytic refining is: H 2 SO 4 : 200g / L; Ni 2+ : 14g / L; As: 14g / L; Cu 2+ : 46g / L; Additives are ADT, gelatin, thiourea and hydrochloric acid, the amount of ADT added is 15g / t.Cu, the amount of 12 degree gelatin added is 25g / t.Cu; the amount of thiourea added is 55g / t.Cu, The added amount of hydrochloric acid is 300ml / t.Cu, and the ratio of added amount of thiourea to 12 degree gelatin is 2.2:1.

[0038] Electrolyte temperature is 64°C, current density: 300A / m 2 , The cell voltage of the electrolytic cell: 0.31V, the center distance of the same pole: 105mm, and the circulation volume of a single cell is 35L / min. cell.

[0039] The specifications of the high arsenic, high nickel and low copper anode plates are 1000×960×48mm, the weight is 375kg / piece, and the chemical composition (see Table 5).

[0040] Table 5...

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Abstract

The invention discloses a process for producing cathode copper by electrolytic refining of a low-grade copper anode plate. The process is as follows: electrolyte adopted by electrolytic refining comprises the following components: 190-200g / L of H2SO4, less than or equal to 15g / L of Ni<2+>, less than or equal to 15g / L of As, and 42-46 g / L of Cu<2+>; the additives are ADT, gelatin, thiourea and hydrochloric acid, the addition amount of the ADT is 10-15 g / t.Cu, and the addition amount of the gelatin is 20-30 g / t.Cu; and the addition amount of the thiourea is 50-60 g / t.Cu, the addition amount of the hydrochloric acid is 200-300 ml / t.Cu, the temperature of the electrolyte is 62-64 DEG C, and the circulation amount of a single tank is 30-35 L / min. The process is stable in process control and high in high-quality product rate of products, the purpose that the process adapts to raw materials is achieved, and good conditions are created for widening copper raw material purchasing channels and reducing cost and increasing benefits of enterprises.

Description

technical field [0001] The invention belongs to the field of cathode copper production and relates to a process for producing cathode copper by electrolytic refining of low-grade anode plates. Background technique [0002] The electrolytic refining process of low-impurity and high-grade anode plates has been very mature. The technical conditions of the main electrolytic process, such as the copper content of the electrolyte, the nickel content of the electrolyte, the arsenic content of the electrolyte, the circulation rate of a single tank, and the temperature, etc. not tall. The additive system consists of three additives: gelatin, thiourea, and hydrochloric acid. Under low impurity conditions, 7-degree gelatin can fully meet the quality control requirements of cathode copper. [0003] With the increasingly tight supply of copper raw materials and the complexity of raw material composition, the supply of low-grade, high-impurity copper concentrate and blister copper has be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25C1/12
CPCC25C1/12Y02P10/20
Inventor 杨国红张素霞李睿孙尚礼景玉红屈海军
Owner JINCHUAN GROUP LIMITED
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