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After-treatment agent for inhibiting growth of tin whiskers and preparation method of after-treatment agent

A post-treatment agent and tin whisker technology, which is applied to the post-treatment agent and its preparation for the growth of tin whiskers in tin alloys, inhibits the field of tin plating, can solve the problems of damage release, mechanical damage, electronic short circuit, etc., and achieve release compression Effects of stress, slow growth, and improved weldability

Active Publication Date: 2021-10-29
海宁市科泰克金属表面技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The presence of tin whiskers can cause two serious problems in electronic assemblies: they can cause electronic shorts, and they can disrupt the release from their underlying layers, causing mechanical damage
[0011] 2. The residual stress of the coating after electroplating leads to the growth of tin whiskers

Method used

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  • After-treatment agent for inhibiting growth of tin whiskers and preparation method of after-treatment agent
  • After-treatment agent for inhibiting growth of tin whiskers and preparation method of after-treatment agent
  • After-treatment agent for inhibiting growth of tin whiskers and preparation method of after-treatment agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Weigh 10 g of N-octadecyl phosphite and 25 g of tris(N-octadecyl) phosphite into a beaker, add 965 g of high-boiling alkane solvent in proportion to the mass, and heat the solution in the beaker to 10°C , fully stirred with a stirrer for 2 hours, and filtered the stirred solution with 1 μm filter paper to obtain a post-treatment agent.

Embodiment 2

[0047] Weigh 20g of N-octadecylphosphite and 45g of tris(N-octadecyl)phosphite and add them to the beaker, add 965g of high-boiling alkane solvent in proportion to the mass, and heat the solution in the beaker to 10°C , fully stirred with a stirrer for 4 hours, and filtered the stirred solution with 1 μm filter paper to obtain a post-treatment agent.

[0048] performance measurement

[0049] Apply the post-treatment agent obtained in the following tin plating process:

[0050] 1. Specific electroplating process

[0051] Degreasing→pickling→activation→pre-soaking→electroplating→post-treatment (use 100% stock solution)

[0052] After degreasing with KOH solution of 150-250g / L (the calibration analysis content is 208g / L), use H 2 SO 4 Carry out pickling (the addition of concentrated sulfuric acid is 40-60mL / L, and the calibration addition is 50mL); use 200-400mL / L (the calibration addition is 310mL / L) of S-7025 (rust removal activator) for activation; After the sample to be ...

Embodiment 1 Embodiment 2

[0070]

[0071] Note: the post-treatment agent in the application is not used in the process not in the comparative example.

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PUM

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Abstract

The invention discloses an after-treatment agent for inhibiting the growth of tin whiskers and a preparation method of the after-treatment agent. The after-treatment agent is characterized by comprising the following components in percentage by mass: 0.1-20wt% of long-chain alkane phosphorous acid with not less than 4 carbon atoms; 0.1-20wt% of long-chain alkane phosphite with not less than 4 carbon atoms; and the balance of an alkane solvent with a high boiling point. According to the after-treatment agent for inhibiting the growth of the tin whiskers and the preparation method of the after-treatment agent, the process is simple, the preparation cost is low, and the growth rate of the whiskers can be effectively inhibited.

Description

technical field [0001] The invention relates to the technical field of metal surface treatment, in particular to a post-treatment agent for inhibiting the growth of tin whiskers in tin plating and tin alloys and a preparation method thereof. Background technique [0002] Whiskers are micro-nano short fibers grown from high-purity single crystals. The microscopic shape is hair-like, which can grow naturally from the solid surface, also known as "intrinsic whiskers". [0003] Whiskers grow on many metals, the most common ones are tin, cadmium, zinc, antimony, indium, etc. Whiskers can even grow on tin-lead alloys sometimes, but the occurrence rate is small. In general, whiskering tends to occur on relatively soft and ductile materials, especially low melting point metals. [0004] Tin whisker is a common phenomenon in electronic products and equipment. [0005] The shape of the tin whiskers is irregular, some of them are centered, and the outer surface of the tin whiskers i...

Claims

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Application Information

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IPC IPC(8): C25D5/48C25D3/32
CPCC25D5/48C25D3/32C25D5/60
Inventor 孙沈良黄海宾
Owner 海宁市科泰克金属表面技术有限公司
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