Piezoelectric ceramic ultra-high filling silicone rubber composite ink material for ink direct writing printing and preparation method and application of piezoelectric ceramic ultra-high filling silicone rubber composite ink material
A piezoelectric ceramic and silicone rubber technology, applied in the field of 3D printing polymer materials, can solve the problems of poor ink support, limited research and development, difficult to control the viscosity of printing ink, etc., to achieve low manufacturing costs, expand molding methods, and expand preparation effect of the pathway
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0069] In this embodiment, a piezoelectric ceramic super-filled silicone rubber composite ink material used for ink direct writing printing, its raw materials mainly include the following components in parts by weight:
[0070] Silicone rubber resin 200 parts,
[0071] 800 parts of piezoelectric ceramic filler,
[0072] 400 parts of solvent;
[0073] Wherein, the silicone rubber resin is selected as polydimethylsiloxane rubber,
[0074] The piezoelectric ceramic filler is selected as barium titanate,
[0075] Described solvent is selected as ethyl acetate;
[0076] The preparation method of the above-mentioned piezoelectric ceramic super-filled silicone rubber composite ink material for ink direct-writing printing comprises the following steps:
[0077] (1) Under normal temperature conditions, after adding piezoelectric ceramic fillers to the solvent and fully mixing, it is used as a mixed liquid for subsequent use;
[0078] (2) After adding silicone rubber resin to the m...
Embodiment 2
[0086] In this embodiment, a piezoelectric ceramic highly filled silicone rubber composite ink material for ink direct writing, its raw materials mainly include the following components in parts by weight:
[0087] Silicone rubber resin 100 parts,
[0088] 900 parts of piezoelectric ceramic filler,
[0089] 500 parts of solvent;
[0090] Wherein, the silicone rubber resin is selected as polydimethylsiloxane rubber,
[0091] The piezoelectric ceramic filler is selected as barium titanate,
[0092] Described solvent is selected as ethyl acetate;
[0093] The preparation method of the above-mentioned piezoelectric ceramic highly filled silicone rubber composite ink material for ink direct writing comprises the following steps:
[0094] (1) Under normal temperature conditions, after adding piezoelectric ceramic fillers to the solvent and fully mixing, it is used as a mixed liquid for subsequent use;
[0095] (2) After adding silicone rubber resin to the mixed solution obtained ...
Embodiment 3
[0102] In this embodiment, a piezoelectric ceramic highly filled silicone rubber composite ink material for ink direct writing, its raw materials mainly include the following components in parts by weight:
[0103] Silicone rubber resin 300 parts,
[0104] 700 parts of piezoelectric ceramic filler,
[0105] 350 parts of solvent;
[0106] Wherein, the silicone rubber resin is selected as polydimethylsiloxane rubber,
[0107] The piezoelectric ceramic filler is selected as barium titanate,
[0108] Described solvent is selected as ethyl acetate;
[0109] The preparation method of the above-mentioned piezoelectric ceramic highly filled silicone rubber composite ink material for ink direct writing comprises the following steps:
[0110] (1) Under normal temperature conditions, after adding piezoelectric ceramic fillers to the solvent and fully mixing, it is used as a mixed liquid for subsequent use;
[0111] (2) After adding silicone rubber resin to the mixed solution obtaine...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
viscosity | aaaaa | aaaaa |
density | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com