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Low-temperature-resistant stretchable flexible hot melt adhesive and preparation method thereof

A low-temperature-resistant, hot-melt adhesive technology, applied in adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve complex problems, achieve enhanced flexibility and stretchability, wide application prospects, and improve uniformity degree of effect

Active Publication Date: 2021-12-10
广东省鹰飞塑胶有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the low-temperature-resistant hot-melt adhesives in the prior art have certain low-temperature resistance and softness, with the continuous development of hot-melt adhesives, the environment in which they are applied is becoming more and more complicated. higher requirement

Method used

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  • Low-temperature-resistant stretchable flexible hot melt adhesive and preparation method thereof
  • Low-temperature-resistant stretchable flexible hot melt adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A flexible hot-melt adhesive resistant to low temperature and stretchable, which is composed of the following components in parts by weight: 100 parts of butyl rubber, 36 parts of silicone modified epoxy resin, 18 parts of polymethyl methacrylate, syndiotactic poly 6 parts of styrene-polyethylene block copolymer, 10 parts of paraffin wax, 2 parts of organic ultraviolet light absorber and 20 parts of talcum powder.

[0029] In this embodiment, the silicone-modified epoxy resin is prepared by condensation reaction of bisphenol-propane epoxy resin and dimethylpolysiloxane.

[0030] The preparation method of above-mentioned flexible hot-melt adhesive comprises the following steps:

[0031] S1: Weigh each raw material according to the weight of the configuration, first heat the base resin and silicone-modified epoxy resin to 110°C-120°C, melt and stir for 60-100min, then add 70% of the filler, continue to stir and mix, Obtain primary mixture;

[0032] S2: Add polymethyl me...

Embodiment 2

[0035] A flexible hot-melt adhesive resistant to low temperature and stretchable, which is composed of the following components in parts by weight: 100 parts of butyl rubber, 48 parts of silicone modified epoxy resin, 24 parts of polymethyl methacrylate, syndiotactic poly 8 parts of styrene-polyethylene block copolymer, 20 parts of paraffin wax, 4 parts of organic ultraviolet light absorber and 30 parts of talcum powder;

[0036] In this embodiment, the silicone-modified epoxy resin is prepared by condensation reaction of bisphenol-propane epoxy resin and dimethyl polysiloxane.

[0037] The preparation method of above-mentioned flexible hot-melt adhesive comprises the following steps:

[0038] S1: Weigh each raw material according to the weight of the configuration, first heat the base resin and silicone-modified epoxy resin to 110°C-120°C, melt and stir for 60-100min, then add 70% of the filler, continue to stir and mix, Obtain primary mixture;

[0039] S2: Add polymethyl m...

Embodiment 3

[0042] A low temperature resistant and stretchable flexible hot melt adhesive, which consists of the following components in parts by weight: 100 parts of butyl rubber, 42 parts of silicone modified epoxy resin, 21 parts of polymethyl methacrylate, syndiotactic poly 7 parts of styrene-polyethylene block copolymer, 15 parts of paraffin wax, 3 parts of organic ultraviolet light absorber and 25 parts of talcum powder;

[0043] In this embodiment, the silicone-modified epoxy resin is prepared by condensation reaction of bisphenol-propane epoxy resin and dimethyl polysiloxane.

[0044] The preparation method of above-mentioned flexible hot-melt adhesive comprises the following steps:

[0045] S1: Weigh each raw material according to the weight of the configuration, first heat the base resin and silicone-modified epoxy resin to 110°C-120°C, melt and stir for 60-100min, then add 70% of the filler, continue to stir and mix, Obtain primary mixture;

[0046]S2: Add polymethyl methacry...

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Abstract

The invention discloses a low-temperature-resistant stretchable flexible hot melt adhesive and a preparation method thereof, and relates to the technical field of hot melt adhesives. The key point of the technical scheme is that the low-temperature-resistant stretchable flexible hot melt adhesive is composed of the following components in parts by weight: 100 parts of base resin, 60-80 parts of a tackifier, 10-20 parts of a regulator, 2-4 parts of a plastic additive and 20-30 parts of a filler, wherein the basic resin is butyl rubber; the tackifier is a mixture of organic silicon modified epoxy resin, polymethyl methacrylate, syndiotactic polystyrene and a polyethylene block copolymer; and the plastic additive is an ultraviolet light absorber. According to the low-temperature-resistant hot melt adhesive, secondary modification of the organic silicon modified epoxy resin is realized, the flexibility and the tensile property of the low-temperature-resistant hot melt adhesive in a low-temperature environment are effectively enhanced, and the low-temperature-resistant hot melt adhesive has a wider application prospect; and the tensile property is up to 260% at the temperature of -50 DEG C.

Description

technical field [0001] The invention relates to the technical field of hot-melt adhesives, in particular to a low-temperature-resistant and stretchable flexible hot-melt adhesive and a preparation method thereof. Background technique [0002] Hot melt adhesive is a kind of plastic adhesive, which is in a solid state at room temperature, and can be quickly bonded after heating and melting. Hot melt adhesive has been developed rapidly in many fields, especially in printing, packaging and other industries, it has been replaced by hot melt adhesive Nailed and threaded, and began to be used in construction, aircraft, ships and automotive interior decoration and other fields. As the temperature changes, the performance of hot melt adhesives also changes. When the temperature rises to a certain high temperature or drops to a certain low temperature, the performance of hot melt adhesives will decrease, weaken the bonding strength of the material, and ultimately affect the strength o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/22C09J11/08C09J11/04
CPCC09J123/22C09J11/08C09J11/04C08L63/00C08L33/12C08L53/00C08L25/06C08K3/34
Inventor 刘雄英
Owner 广东省鹰飞塑胶有限公司
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