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Scheme for reducing spraying cost of three-dimensional circuit through laser etching and chemical polishing

A chemical polishing and laser etching technology, which is applied in liquid chemical plating, laser welding equipment, coating, etc., can solve the problems that the thickness of spraying is very thick, affects the appearance quality of products, and increases the cost of spraying, so as to improve the smoothness , Yield rate improvement, the effect of improving yield rate

Pending Publication Date: 2021-12-10
SHANGHAI SHENZHI OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a solution to reduce the cost of three-dimensional circuit spraying by laser etching and chemical polishing, and solves the problem that the product manufactured by the three-dimensional circuit process has a high rate of defective spraying when the circuit is on the first-level appearance surface. The thickness of spraying is required to be very thick, which not only affects the appearance quality of the product but also seriously increases the cost of spraying

Method used

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  • Scheme for reducing spraying cost of three-dimensional circuit through laser etching and chemical polishing
  • Scheme for reducing spraying cost of three-dimensional circuit through laser etching and chemical polishing
  • Scheme for reducing spraying cost of three-dimensional circuit through laser etching and chemical polishing

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Embodiment 1

[0037] Such as Figure 1-6 As shown, the embodiment of the present invention provides a solution for reducing the cost of three-dimensional line spraying through laser etching and chemical polishing, including the following specific process steps:

[0038] Step 1. Line laser forming and deep etching: In order to ensure the smoothness and etching depth of the plastic line area after laser processing and etching, as well as the subsequent plating performance of electroless plating, the selection of laser equipment and light source:

[0039] a. Choose a light source with a relatively short wavelength and relatively light thermal expansion effect, such as green light, blue light or violet laser light source;

[0040] b. Select a small spot diameter of 0.03mm or less in order to better control the smoothness of the scanning area;

[0041] c. When using a fiber laser light source, in order to prevent plastic expansion and too rough problems caused by the thermal effect of the spot,...

Embodiment 2

[0052] Line laser shaping and deep etching methods include:

[0053] A. Cold light source method: In order to ensure the smoothness and etching depth of the plastic circuit area after laser processing and etching, as well as the plating performance of the subsequent electroless plating, the choice of laser light source, when using the three-dimensional circuit process on the ordinary plastic surface, green light , blue light or purple light is a better choice, the degree of bulge around the spot caused by its thermal effect is significantly smaller than that of red light laser light source. When using green light, blue light or purple light source, the spot bulge caused by its thermal effect is smaller than that of red light, and it is easier to achieve the depth and smoothness of laser etching.

[0054] B. Small-diameter spot method: Using a slightly smaller spot diameter such as 0.03mm will significantly improve the smoothness of the laser scanning area. At the same time, th...

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Abstract

The invention provides a scheme for reducing the spraying cost of a three-dimensional circuit through laser etching and chemical polishing, and relates to the field of three-dimensional circuits on plastic surfaces and subsequent spraying manufacturing processes. According to the technical scheme, the spraying yield can be greatly increased when a plating layer area is arranged on a first-level appearance face, the spraying thickness is remarkably reduced, the spraying frequency can be controlled to be four times of coating and four times of baking, the grinding necessity is reduced or even completely eliminated, and the seamless spraying effect can be realized by controlling the actual spraying thickness to be about 60-90 microns. According to a traditional plastic component three-dimensional circuit process, seven times of coating and seven times of baking are needed for circuit seamless spraying, multiple times of grinding are additionally needed, and the thickness of a sprayed coating reaches about 150 micrometers. The spraying cost can be greatly reduced by increasing the yield and reducing the spraying thickness and the spraying steps.

Description

technical field [0001] The invention relates to the field of spraying manufacturing technology of three-dimensional lines on plastic surfaces, in particular to a scheme for reducing the cost of spraying three-dimensional lines by laser etching and chemical polishing. Background technique [0002] Laser direct structuring is a method of adding special metal complexes to plastic particles, and then activating and decomposing the metal complexes by laser forming to form fine metal particles, and then performing electroless nickel plating and copper plating around these metal particles. The manufacturing process of the surface manufacturing circuit of the structural part. The latest technology of three-dimensional circuit of plastic parts can realize the roughening and molding of ordinary plastic surface by laser, combined with chemical pretreatment and activation, and finally realize the three-dimensional circuit on the surface of plastic with nickel-plated copper and other met...

Claims

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Application Information

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IPC IPC(8): C23F3/04C23F3/06C23C18/20B23K26/362B23K26/60B23K26/70
CPCC23F3/04C23F3/06C23C18/2013C23C18/2053B23K26/362B23K26/60B23K26/70
Inventor 陈设高亢刘强
Owner SHANGHAI SHENZHI OPTOELECTRONICS TECH CO LTD