Component adjusting method and device for acidic copper electroplating replenishing solution or electroplating replenishing solution of insoluble anode

Abstract

The invention discloses a component adjusting method for an acidic copper electroplating solution or electroplating replenishing solution of an insoluble anode. The method comprises the following steps that a first electrolytic bath and a second electrolytic bath are arranged, the first electrolytic bath is divided into a first electrolytic anode area and a first electrolytic cathode area, and the second electrolytic bath is divided into a second electrolytic anode area, a second component adjusting area and a second electrolytic cathode area; the first electrolytic anode area and the second component adjusting area are connected through a pipeline and a pump, so that electrolyte in the first electrolytic anode area flows into the second component adjusting area; the first electrolysis anode is a copper-containing electrode; the electrolyte A and the electrolyte D comprise sulfuric acid and / or copper sulfate; and the electrolyte A and the electrolyte D are respectively added into the first electrolytic anode area and the second component adjusting area. The electroplating liquid or the electroplating replenishing liquid with different copper sulfate concentrations and sulfuric acid concentrations can be rapidly obtained through flexible mixing and proportioning of the electrolyte A and the electrolyte D. The invention further discloses a component adjusting device for the acidic copper electroplating solution or the electroplating replenishing solution of the insoluble anode.

Description

technical field [0001] The invention belongs to the field of copper electroplating technology for insoluble anodes, in particular to a method and device for adjusting the composition of an acidic electroplating copper plating solution or electroplating replenishment solution for insoluble anodes. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on a metal surface using the principle of an electrolytic cell. The existing acidic copper sulfate electroplating process can be mainly divided into two processes: soluble anode and insoluble anode. [0003] Soluble anodic copper plating process, as its name implies, refers to the type of process in which the anode will gradually dissolve during the electrochemical reaction of electroplating. A common soluble anode material is phosphor copper. During the electroplating process, the copper ions in the electroplating solution are reduced to metal copper on the surface of the...

AI Technical Summary

Problems solved by technology

[0013] The disadvantage of using copper oxide to supplement copper ions in this process is that copper oxide, which is more expensive than metal copper, must be continuously added during the electroplating process to continuously dissolve it into the electroplating solution to supplement the copper ion concentration of the electroplating solution. Only in this way can the electroplating process continue to be carried out, resulting in increased production costs

However, due to the presence of ferric ions in the electroplating solution, it will have a negative effect on the metal copper on the cathodic plating, destroy the formed electroplating layer, and then affect the electroplating quality

[0022] In the above two common insoluble anodic copper plating processes, although different methods are used to replenish copper ions when the concentration of copper ions in the electroplating solution on the production line is continuously reduced, both methods are due to their own defects. Production Bring many quality impacts, so it is necessary to improve the method for supplementing electroplating solution copper ions in the insoluble anodic electroplating copper process

Images