Circuit board, and manufacturing method and application thereof
A production method and circuit board technology, which is applied in the fields of printed circuit manufacturing, printed circuit, and secondary treatment of printed circuit, etc., can solve the problems of increasing the haze of the circuit board, affecting the permeability and aesthetics of the circuit board, and improving the service life , to ensure the effect of stability and reliability
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Example Embodiment
[0121] Example 1
[0122] S0, a circuit carrier glass plate, the glass plate sequentially through the cleaning solution a weak base (pH 7.1) spray cleaning, roller cleaning, high purity water rinsing, air dried, and the drying process, the standby.
[0123] Sl, the surface of a glass sheet by sputtering copper layer a magnetron sputtering process, a thickness of 10 nm, process conditions: Power density is the sputtering 2kw / cm 2 , Argon gas pressure is 0.6 Pa, temperature of the carrier board 150 ℃;
[0124] The surface of the copper film layer 1 by acidic copper plating layer 2, a thickness of 5 m, the process conditions are as follows: pH value of 3, CuSO 4 At a concentration of 20g / L, H 2 SO 4 At a concentration of 160g / L, chlorine ion concentration of 100 ppm, a temperature of 30 ℃.
[0125] S2, the photoresist coating a copper film layer 2, 10 m in thickness, designed to meet customer requirements film line exposure in an exposure machine, an exposure energy of 30mj / c...
Example Embodiment
[0131] Example 2
[0132] S0, a ceramic circuit board as the carrier, the ceramic plate sequentially through the weak acid washing solution (pH 6.2) spray cleaning, roller cleaning, high purity water rinsing, air dried, and the drying process, the standby.
[0133] Sl, the surface of a ceramic plate by sputtering magnetron sputtering process copper-nickel alloy film, having a thickness of 20 nm, process conditions: Power density is the sputtering 3kw / cm 2 , Argon gas pressure of 0.7 Pa, a temperature of the carrier board 150 ℃;
[0134] By acidic copper electroplating process on the surface layer of copper-nickel alloy layer, a thickness of 10 m, the process conditions are as follows: pH value of 4, CuSO 4 At a concentration of 30g / L, H 2 SO 4 At a concentration of 140g / L, chloride ion concentration of 80ppm, a temperature of 30 deg.] C;
[0135] S2, a resist is applied on the copper layer, having a thickness of 10 m, designed to meet customer requirements film line exposure...
Example Embodiment
[0140] Example 3
[0141] Substantially the same as in Example 1, except comprising:
[0142] S0, carrier of the PET;
[0143] After the end of the etching step S2, to obtain a circuit pattern.
[0144] S3 will then fill in the non-blue gum line area, the photoresist on the line region photoresist removal step, mechanical tearing resist tearing manner, and the circuit board as to baking at temperature 150 ℃ 5 minutes.
[0145] In the circuit board using SMT technology obtained, bonded to the LED lamp, made into a LED display. Permeability of the board more than 90%, the film strength of the anti-pull 1N, LED lamp beads within each square meter more than 10,000, more than 7,000 lumens brightness, the overall resolution of the display can be increased to P10 levels; oxidation life of up to 3 years; yield up to 98%.
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Abstract
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Application Information
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