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Circuit board, and manufacturing method and application thereof

A production method and circuit board technology, which is applied in the fields of printed circuit manufacturing, printed circuit, and secondary treatment of printed circuit, etc., can solve the problems of increasing the haze of the circuit board, affecting the permeability and aesthetics of the circuit board, and improving the service life , to ensure the effect of stability and reliability

Active Publication Date: 2021-12-21
深圳市顺华智显技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the anti-oxidation paint belongs to polymer colloid. After spraying on glass, ceramics and other circuit boards, the haze of the circuit board will increase, which will affect the permeability and aesthetics of the circuit board.

Method used

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  • Circuit board, and manufacturing method and application thereof
  • Circuit board, and manufacturing method and application thereof
  • Circuit board, and manufacturing method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0122] S0, using a glass plate as a circuit carrier, spraying the glass plate with a weak alkali cleaning solution (pH 7.1), cleaning with a rolling brush, rinsing with high-purity water, air-drying, and drying for subsequent use.

[0123] S1, a copper film layer 1 is sputtered on one surface of the glass plate by a magnetron sputtering process, the thickness is 10nm, and the process conditions are: the power density of the sputtering power supply is 2kw / cm 2 , the argon pressure is 0.6Pa, and the circuit board carrier temperature is 150°C;

[0124] On the surface of the copper film layer 1, the copper film layer 2 is electroplated by an acidic electroplating process, the thickness is 5 μm, and the process conditions are: pH value is 3, CuSO 4 Concentration is 20g / L, H 2 SO 4 The concentration is 160g / L, the chloride ion concentration is 100ppm, and the temperature is 30°C.

[0125] S2, Coating photoresist on the copper film layer 2 with a thickness of 10μm, designing a fil...

Embodiment 2

[0132] S0, the ceramic board is used as the circuit carrier, and the ceramic board is sprayed and cleaned with a weak acid cleaning solution (pH 6.2), washed with a rolling brush, rinsed with high-purity water, air-dried and dried, and used for standby.

[0133] S1, a copper-nickel alloy film layer is sputtered on one surface of the ceramic plate by magnetron sputtering process, the thickness is 20nm, and the process conditions are: sputtering power density 3kw / cm 2 , the pressure of argon gas is 0.7Pa, and the temperature of the circuit board carrier is 150°C;

[0134] On the surface of the copper-nickel alloy film layer, the copper film layer is electroplated by an acidic electroplating process, the thickness is 10 μm, and the process conditions are: pH value is 4, CuSO 4 Concentration is 30g / L, H 2 SO 4 The concentration is 140g / L, the chloride ion concentration is 80ppm, and the temperature is 30°C;

[0135] S2, Coating photoresist on the copper film layer with a thickn...

Embodiment 3

[0141] Basically the same as Example 1, the differences include:

[0142] The carrier in S0 is PET;

[0143] A circuit pattern is obtained after the etching process in S2 is completed.

[0144] After the blue glue is filled in the non-circuit area in S3, the photoresist on the circuit area is removed, and the photoresist is removed by mechanical tearing, and the circuit board is baked at a temperature of 150°C 5 minutes.

[0145] Using SMT technology on the circuit board obtained above, the LED lamp beads are attached to make an LED display screen. The transparency of the circuit board can reach more than 90%, the pull-out resistance of the film layer is 1N, the number of LED lamp beads per square meter is more than 10,000, the brightness is more than 7000 lumens, and the resolution of the overall display can be increased to P10 level; anti-oxidation life can reach more than 3 years; good product rate can reach more than 98%.

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Abstract

The invention provides a circuit board, and a manufacturing method and application thereof. The method comprises the following steps: sequentially forming a seed layer and a copper film layer on a bearing body of the circuit board; manufacturing a circuit pattern on the circuit board; filling blue gel in a non-circuit area of the circuit pattern; forming an anti-oxidation layer on the surface of the circuit area of the circuit pattern; and removing the filled blue gel to obtain the anti-oxidation circuit board. According to the scheme, the anti-oxidation function can be realized, so that the service life of the circuit board can be prolonged, and the working stability and reliability of the circuit board are ensured.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of circuit boards, in particular to a circuit board and its manufacturing method and application. Background technique [0002] With the development of screen technology, LED (Light Emitting Diode, LED) advertising screen has gradually become a modern mainstream display device due to its advantages of bright colors, wide dynamic range, high brightness, long life and stable and reliable operation. In order to ensure the service life of the LED advertising screen and improve the working stability, it is necessary to carry out anti-oxidation treatment on the circuit board, one of the core components of the LED advertising screen. [0003] In the prior art, the circuit board is generally subjected to anti-oxidation treatment by directly spraying an anti-oxidation paint on the circuit board. However, the anti-oxidation paint is a polymer colloid. After spraying on glass, ceramics and ot...

Claims

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Application Information

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IPC IPC(8): H05K3/28H05K3/12C25D7/00C25D3/48C25D3/46C25D3/38C25D3/30C25D3/12C23F1/02C23C28/02C23C14/35C23C14/20C23C14/18
CPCH05K3/282H05K3/1216C23C28/023C23C14/35C23C14/185C23C14/205C25D3/38C25D7/00C23F1/02C25D3/48C25D3/46C25D3/12C25D3/30
Inventor 伏学保伏南川吴贵华陈旺寿
Owner 深圳市顺华智显技术有限公司
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