Compositions of trithiocyanuric acid or derivative thereof or product thereof
A technology of thiocyanuric acid and its derivatives, which is applied in the direction of layered products, metal layered products, glass/slag layered products, etc. It can solve the problem of poor high temperature resistance, performance that cannot meet the requirements of printed circuit boards, and peel strength. Insufficient and other problems, to achieve the effect of increasing the bonding force, realizing the peel strength, and optimizing the peel strength
Pending Publication Date: 2021-12-24
无锡宏仁电子材料科技有限公司
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AI Technical Summary
Problems solved by technology
[0003] Aiming at the deficiencies of the above-mentioned prior art, the present invention provides thiocyanic acid or its derivative composition and its products, the purpose is to solve the problem that the existing products made of polyphenylene ether and polyolefin composition still have Certain properties cannot meet the special requirements of printed circuit boards, such as technical problems of poor high temperature resistance and insufficient peel strength
Method used
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Examples
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Effect test
Embodiment 1
[0045] The bromine-containing flame retardant system thiocyanate composition provided in this example is shown in Table 1.
Embodiment 2
[0047] The halogen-free flame retardant system thiocyanate composition provided in this example is shown in Table 1.
Embodiment 3
[0049] The composition of the bromine-containing flame retardant system thiocyanate derivative provided in this example is shown in Table 1.
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The invention belongs to the technical field of electronic materials, and particularly relates to a composition of trithiocyanuric acid or a derivative thereof. The composition comprises modified polyphenyl ether, a hydrocarbon resin, a cross-linking agent, a peroxide initiator, a flame retardant, a spherical silicon dioxide filler and trithiocyanuric acid or a derivative thereof. The invention also provides another technical scheme, namely a product prepared according to the composition of trithiocyanuric acid or a derivative thereof, wherein the product comprises a prepreg, a copper-clad plate or a printed circuit board. According to the invention, the trithiocyanuric acid derivative is added into the existing polyphenyl ether and polyolefin composition, so that the basic electrical requirements of the polyphenyl ether and polyolefin composition are ensured, the heat resistance of the printed circuit board and other products is further improved, and the peel strength of the printed circuit board and other products is optimized.
Description
technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to thiocyanic acid or its derivative composition and its products. Background technique [0002] The arrival of the 5G communication era has brought information transmission into the era of high frequency and high speed, and puts forward higher requirements for the dielectric properties of the substrate. In order to increase the transmission speed of signals and reduce the loss during signal transmission, copper clad laminates are required to have extremely low dielectric constant and dielectric loss tangent. In order to achieve the strict dielectric requirements, we usually choose to use resin materials with non-polar chemical structure when designing the formulation, so as to avoid the occurrence of polar groups such as hydroxyl, anhydride, amine and epoxy groups in the resin system. High-frequency high-speed copper-clad laminate formulations usually use ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): C08L71/12C08L23/08C08L25/10C08K5/378C08J5/24C08K7/14B32B17/02B32B15/14B32B15/20B32B7/12B32B37/06B32B37/10
CPCC08L71/126C08J5/24B32B5/02B32B15/14B32B15/20B32B7/12B32B37/06B32B37/10C08L2201/08C08J2371/12C08J2423/08C08J2425/10C08K5/378C08K7/14C08L23/083C08L25/10
Inventor 杨佳奇
Owner 无锡宏仁电子材料科技有限公司



