Modified epoxy resin adhesive and application thereof in hard mica plate

An epoxy resin glue, epoxy resin technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of low cutting accuracy, brittle mica board, and many debris, and improve the adhesion. The effect of knot strength, increased wettability and adhesion

Active Publication Date: 2021-12-24
湖北晟特新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the problems that the mica board prepared by traditional epoxy resin becomes brittle after curing, it is easy to degrade at high temperature, it has a large smoke and odor at high temperature, it is easy to fry when cutting, there are many chips, and the cutting accuracy is not high, etc., to provide a Epoxy glue for mica boards

Method used

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  • Modified epoxy resin adhesive and application thereof in hard mica plate
  • Modified epoxy resin adhesive and application thereof in hard mica plate
  • Modified epoxy resin adhesive and application thereof in hard mica plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Put 60kg of epoxy resin, 12kg of epoxy-terminated phenyl silicone oil, 27kg of liquid phenolic resin, 5kg of polyvinyl formal, and 84kg of toluene into the reaction kettle, start stirring and heating, and keep warm at 105°C for 1.5h to make the materials Completely dissolve and mix evenly, turn on the cooling water to cool down the material, when the temperature of the material drops to 27°C±3°C, add 126kg of methanol and 2.5kg of γ-glycidyl etheroxypropyltrimethoxysilane into the reaction kettle, continue stirring for 30min, put The material is modified epoxy resin glue.

Embodiment 2

[0028] Put 55kg of epoxy resin, 16kg of epoxy-terminated phenyl silicone oil, 30kg of liquid phenolic resin, 8kg of polyvinyl formal, and 84kg of toluene into the reaction kettle, start stirring and heating, and keep warm at 105°C for 1.5h to make the materials Completely dissolve and mix evenly, turn on the cooling water to cool down the material, when the temperature of the material drops to 27°C±3°C, add 126kg of methanol and 3kg of β-(3,4 epoxycyclohexyl)ethyltrimethoxysilane to the reaction kettle, continue Stir for 30 minutes, and discharge to obtain the modified epoxy resin glue.

Embodiment 3

[0030] Put 50kg of epoxy resin, 21kg of epoxy-terminated phenyl silicone oil, 30kg of liquid phenolic resin, 7.5kg of polyvinyl formal, and 84kg of toluene into the reaction kettle, start stirring and heating, and keep warm at 105°C for 1.5h. The material is completely dissolved and mixed evenly, and the cooling water is turned on to cool the material. When the temperature of the material drops to 27°C±3°C, add 126kg of methanol and 5kg of glycidoxypropylmethyldiethoxysilane into the reaction kettle, and continue stirring for 30min. The modified epoxy resin glue is obtained by discharging the material.

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PUM

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Abstract

The invention discloses a modified epoxy resin adhesive and an application thereof in a hard mica plate. The modified epoxy resin adhesive comprises the following components in parts by weight: 40 to 80 parts of epoxy resin, 10 to 21 parts of epoxy-terminated phenyl silicone oil, 20 to 40 parts of phenolic resin, 0.5 to 5 parts of a silane coupling agent, 3 to 8 parts of polyvinyl formal acetaldehyde, and 100 to 220 parts of a diluent. The epoxy resin adhesive overcomes the problems that a mica plate prepared from traditional epoxy resin is fragile after being cured, easy to degrade at high temperature, large in high-temperature smoke and peculiar smell, easy to crack during cutting, more in chippings, low in cutting precision and the like, and the epoxy resin adhesive for the mica plate is provided.

Description

technical field [0001] The invention relates to the field of electrical insulating materials, in particular to a modified epoxy resin glue and a docking method. Background technique [0002] Epoxy resin is a general term for compounds containing two or more epoxy groups in a molecule, and is one of the three most commonly used thermosetting resin materials in modern industry. Due to the advantages of high mechanical strength, good bonding performance, chemical stability, excellent electrical insulation performance, wide curing temperature range and corrosion resistance, epoxy resin is widely used in chemical industry, electronic packaging, plastics, coating industry, machinery, etc. , national defense and large water conservancy projects and civil construction industries and many other aspects. [0003] Mica paper is made from mica ore, which is chemically or hydraulically crushed and pulped. The mica board is made of mica paper through gluing machine gluing, drying, cutti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J183/06C09J161/06C09J11/06C09J11/08B32B7/12B32B19/00B32B37/12B32B37/06B32B37/10
CPCC09J163/00C09J11/06C09J11/08B32B7/12B32B19/00B32B37/12B32B37/06B32B37/10C08L83/06C08L61/06C08L29/14C08K5/5435
Inventor 潘渡江周华群李俊杨磊付映林
Owner 湖北晟特新材料有限公司
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