Preparation method of industrial grade card of Internet of Things

An Internet of Things and industrial technology, applied in the field of electronic information, can solve the problems of low pass rate, poor corrosion resistance, complicated process, etc., and achieve the effect of improving efficiency, reducing production cost and increasing corrosion resistance.

Inactive Publication Date: 2021-12-24
新恒汇电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the mainstream IoT card substrates are basically realized based on double-layer boards made of PCB boards. This method is cumbersome and costly. The prepared PCB substrate IoT cards have poor corrosion resistance and low hardness. Deformation leads to lower pass rate

Method used

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  • Preparation method of industrial grade card of Internet of Things
  • Preparation method of industrial grade card of Internet of Things
  • Preparation method of industrial grade card of Internet of Things

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] The preparation method of the described IoT industrial grade card specifically comprises the following steps:

[0046] (1) Surface cleaning

[0047] Choose 194 copper foil with a thickness of 203 microns as the substrate, and clean the substrate to remove oil and surface impurities. Cleaning adopts acid cleaning agent and alkaline cleaning agent in sequence, and the cleaning speed is 1.5 m / min. The acidic cleaning agent uses acetic acid aqueous solution, and the alkaline cleaning agent uses sodium bicarbonate aqueous solution.

[0048] (2) Press dry film

[0049] A photosensitive dry film is hot-pressed on the surface of the cleaned substrate; the temperature for pressing the dry film is: 120°C, the pressure is 0.6kg, and the transmission speed is 2.5 m / min.

[0050] (3) Exposure

[0051] Design CAD drawings according to the required pattern and shape, import the drawings into the laser direct writing equipment, place the substrate after the dried film on the direct...

Embodiment 2

[0064] The preparation method of the described IoT industrial grade card specifically comprises the following steps:

[0065] (1) Surface cleaning

[0066] Choose 194 copper foil with a thickness of 203 microns as the substrate, and clean the substrate to remove oil and surface impurities. Cleaning uses acidic cleaning agent and alkaline cleaning agent in sequence, and the cleaning speed is 1 m / min. The acidic cleaning agent uses acetic acid aqueous solution, and the alkaline cleaning agent uses sodium bicarbonate aqueous solution.

[0067] (2) Press dry film

[0068] A photosensitive dry film is hot-pressed on the surface of the cleaned substrate; the temperature for pressing the dry film is: 110°C, the pressure is 0.8kg, and the transmission speed is 2 m / min.

[0069] (3) Exposure

[0070] Design CAD drawings according to the required pattern and shape, import the drawings into the laser direct writing equipment, place the substrate after the dried film on the direct wri...

Embodiment 3

[0083] The preparation method of the described IoT industrial grade card specifically comprises the following steps:

[0084] (1) Surface cleaning

[0085] Choose 194 copper foil with a thickness of 203 microns as the substrate, and clean the substrate to remove oil and surface impurities. Cleaning adopts acid cleaning agent and alkaline cleaning agent in sequence, and the cleaning speed is 2 m / min. The acidic cleaning agent uses acetic acid aqueous solution, and the alkaline cleaning agent uses sodium bicarbonate aqueous solution.

[0086] (2) Press dry film

[0087] A photosensitive dry film is hot-pressed on the surface of the cleaned substrate; the temperature for pressing the dry film is: 130°C, the pressure is 0.4kg, and the transmission speed is 3 m / min.

[0088] (3) Exposure

[0089] Design CAD drawings according to the required pattern and shape, import the drawings into the laser direct writing equipment, place the substrate after the dried film on the direct wri...

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Abstract

The invention relates to a preparation method of an Internet of Things industrial grade card, and belongs to the technical field of electronic information. The method comprises the following steps: (1) performing surface cleaning; (2) pressing a dry film; (3) exposing; (4) developing; (5) etching; (6) electroplating; (7) cutting off; (8) inspecting; and (9) packaging. A copper foil is adopted as a base material, then according to product drawing design, etching processing is carried out by utilizing a high-precision etching lead frame and a laser direct writing technology according to a drawing style, then a bare copper product can be produced through exposure and development, and then the product is obtained through an electroplating process, nickel-palladium-gold electroplating on the surface, cutting, inspection and packaging. The Internet of Things industrial grade card prepared by the method is low in cost, high in corrosion resistance, high in hardness and high in plastic package qualification rate.

Description

technical field [0001] The invention relates to a method for preparing an industrial-grade card for the Internet of Things, and belongs to the technical field of electronic information. Background technique [0002] The English name of the Internet of Things is "The Internet of Things". From this name, it can be seen that the Internet of Things is the "Internet of Things Connected". This has two meanings: first, the core and foundation of the Internet of Things is still the Internet, which is a network that extends and expands on the basis of the Internet; second, its user end extends and extends to any item and item , for information exchange and communication. Therefore, the definition of the Internet of Things is to connect any item to the Internet according to the agreed agreement through radio frequency identification (RFID) devices, infrared sensors, global positioning systems, laser scanners and other information sensing equipment for information exchange and communi...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L23/495G06F30/39
CPCH01L21/4821H01L21/4828H01L23/49582G06F30/39
Inventor 朱林李景健赵耀军陈志龙马伟凯刘旭李明城田康健
Owner 新恒汇电子股份有限公司
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