Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Spherical inorganic particles with surface bumps and method for preparing same

A technology of inorganic particles and small particles, which is applied in the direction of chemical instruments and methods, other chemical processes, polishing compositions containing abrasives, etc., can solve problems such as particle agglomeration, shape or property changes, and achieve improved grinding speed and grinding Excellent efficiency and the effect of increasing the contact area

Active Publication Date: 2022-01-04
BEAD ORIGIN INC +1
View PDF21 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that agglomeration of particles may occur during storage, so the shape or properties may change

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Spherical inorganic particles with surface bumps and method for preparing same
  • Spherical inorganic particles with surface bumps and method for preparing same
  • Spherical inorganic particles with surface bumps and method for preparing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0118] In 160 ml of solvent mixed with ethylene glycol (99%) and water at a volume ratio of 100:100, add 2 g of poly(N-isopropylacrylamide) (Poly(N-isopropylacrylamide)) (Aldrich) company, Mw: 30,000) as a self-assembled surfactant and stirred using a magnetic stirrer. After confirming complete dissolution, add 2 g of Aldrich Corporation (Aldrich Corporation) cerium nitrate hexahydrate (Cerium nitrate hexahydrate) (Ce(NO 3 ) 3 ·6H 2 O) as a cerium precursor and dissolved to prepare a cerium precursor solution.

[0119] The cerium precursor solution was added to a liquid-phase reactor maintained at a temperature, and a synthesis reaction was performed at a temperature ranging from 90° C. to 140° C. for about 165 minutes. After the reaction was completed, the cerium oxide particle solution obtained was centrifuged at 4000rpm for 1 hour and 30 minutes using a centrifugal separator, and the precipitate was separated, and then repeated 3 times with water (H 2 O) A process of wa...

Embodiment 2

[0121] In 180ml of water, 2.4g of poly(N-isopropylacrylamide) (Poly(N-isopropylacrylamide)) (Austria) with molecular weight different from that of the user in Example 1 was added to an aqueous solution of 2.4g of cerium chloride (Cerium chloride). (Aldrich Company, Mw: 85,000), and stirred at 70° C. to 90° C. for 6 hours to carry out the reaction. Thereafter, separation and washing were carried out in the same manner as in Example 1 above to obtain ceria particles having spherical bumps.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle sizeaaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The inorganic particles according to the present invention are formed by agglomeration of crystalline and amorphous small particles, and are spherical and exhibit a smooth surface. The spherical appearance, low crystallinity and narrow particle size distribution of the inorganic particles are more favorable for reducing scratch defects in chemical mechanical polishing (CMP) engineering. In addition, the small particles on the surface of the inorganic particles provide more active sites and have an excellent removal rate, and thus are advantageous for use as a new generation of CMP polishing material.

Description

technical field [0001] This application claims priority based on Korean Patent Application No. 10-2020-0023993 filed on February 27, 2020, and all the contents disclosed in the documents of the corresponding Korean Patent Application are incorporated as a part of this specification. [0002] The present invention relates to a spherical inorganic particle with surface bumps and a preparation method thereof, more specifically to a spherical inorganic particle with surface bumps formed and controlled surface charges and a preparation method thereof. Background technique [0003] Inorganic particles are used in various fields as raw materials or final products, especially in a wide range of chemical catalysis, biology, semiconductor engineering, tempered glass processing, and the like. [0004] The process of synthesizing such inorganic particles is very diverse, and the synthesis method is divided into a method of assembling atoms (bottom up) and a method of reducing the size o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14
CPCC09K3/1409C09K3/1463C09K3/1436C09G1/02
Inventor 南在度金娜演朴璘暻黃義晳金东学
Owner BEAD ORIGIN INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products