Copper alloy strip and preparation method thereof

Abstract

The invention discloses a copper alloy strip, which is characterized in that the copper alloy comprises the following components in percentage by mass: 0.1 to 1.2 weight percent of Cr, 0.01 to 0.1 weight percent of X, 0.1 to 1.0 weight percent of M and the balance of Cu and inevitable impurities, wherein X is selected from at least one of Si and Ti, and M is selected from at least one of Zn, Sn and Ag. According to the copper alloy strip provided by the invention, the tensile strength reaches 550 MPa or above, the electric conductivity reaches 70% IACS or above, the internal stress is 35 MPa or below, the high tensile strength and good electric conductivity are kept, meanwhile, the low internal stress is achieved, and the development trend and performance requirements of miniaturization, multi-functionalization, small temperature rise and fast heat dissipation of a new generation of ultra-large scale integrated chip etching type lead frame can be met.

Description

technical field [0001] The invention belongs to the technical field of copper alloys, and in particular relates to a copper alloy strip and a preparation method thereof. Background technique [0002] With the rapid development of chip technology, lead frames for chips have put forward higher and higher requirements for the comprehensive performance of copper alloy strips. Chips are developing in the direction of miniaturization, multi-functionality, and ultra-large-scale integration. The lead frame for chip packaging is getting smaller and smaller. In order to ensure high reliability support for the chip, the chip lead frame has a higher strength. Requirements; chips are developing towards ultra-large-scale integration, and higher and higher requirements for heat dissipation are also put forward. It is required that the conductivity of the copper alloy strip used for chip packaging should reach more than 70% IACS; as the pin spacing is getting smaller and smaller, the chip ...

AI Technical Summary

Problems solved by technology

[0003] The high-performance copper alloy strips commonly used for etching lead frames for chip packaging are mainly CuCrSnZn-based and CuFeP-based copper alloys, including C18045, C19210, C19400 and other alloy systems and their improved products, such as Furukawa’s EFTEC64T and EFTEC64T- C, although the performance in terms of strength can still meet the needs of use, but there is a lack of control over the internal stress of the finished product, and there is a gap in etching performance

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