High-cohesiveness anti-cracking epoxy powder composition and preparation method thereof

Abstract

The invention relates to a high-cohesiveness anti-cracking epoxy powder composition and a preparation method thereof, and belongs to the technical field of electronic component packaging materials. The high-cohesiveness anti-cracking epoxy powder composition comprises, by mass, 10%-20% of polyaromatic epoxy resin, 15%-25% of self-made special epoxy resin, 10%-15% of a curing agent, 3%-5% of a polyaromatic curing agent, 0.1%-2% of an accelerant, 0-50% of a filler, 0.3-2% of a specially treated coupling agent, 0.3-3% of a levelling agent and 0.5-5% of pigment. According to the composition, the self-made special epoxy resin is matched with the polyaromatic epoxy resin, and meanwhile, the specially treated coupling agent is used for activating the filler, so that the adhesion between the epoxy powder composition and a chip substrate can be remarkably improved; the water absorption rate is reduced, the toughness is improved, the anti-cracking performance of the encapsulated electronic component in a severe environment is improved, and the composition is mainly applied to the aspect of electronic component encapsulation.

Description

technical field [0001] The invention belongs to the technical field of packaging materials for electronic components, in particular to a high-adhesive anti-cracking epoxy powder composition and a preparation method thereof. Background technique [0002] With the development of science and technology, the safety and reliability requirements of electronic components are constantly increasing, which also puts forward higher and higher requirements for the packaging materials of electronic components. Especially with the continuous expansion of the application field, under high temperature and high humidity, the encapsulation material outside the electronic components is easily bonded weakly, resulting in delamination between the encapsulation material and the chip substrate. After water vapor enters the layer, it will cause chip corrosion and affect the electrical performance. Moreover, under high temperature environment, the water vapor in the layer will generate great expansi...

AI Technical Summary

Problems solved by technology

Especially with the continuous expansion of the application field, under high temperature and high humidity, the encapsulation material outside the electronic components is easily bonded weakly, resulting in delamination between the encapsulation material and the chip substrate. After water vapor enters the layer, it will cause chip corrosion and affect the electrical performance, and in the high temperature environment, the water vapor in the layer will generate great expansion and internal stress, causing the product to crack or even explode, which greatly affects the reliability of the product

[0003] The resin composition used in the current packaging materials is mainly composed of epoxy resin, filler, curing agent and other additives. Due to the limitation of the process, the epoxy resin currently used is basically a solid resin, and the softening point is generally 60-100°C Among them, such as solid bisphenol A epoxy resin, o-cresol novolac epoxy resin, etc., this greatly limits the choice of resins, and some resins with high adhesiveness and high toughness cannot be applied

[0004] In order to improve the adhesion, coupling agents are generally added to the current packaging materials, such as KH560, KH570, etc. The addition of coupling agents can improve the adhesion between the resin and the filler, the resin composition and the chip substrate, but The current method of use is to add directly or spray into the components in the form of atomization and spraying, the coupling effect is not good, thus affecting the bonding effect of the composition

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