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Circuit board

A technology for circuit boards and circuit patterns, applied in the directions of printed circuits, printed circuits, printed circuit manufacturing, etc., can solve the problems of reduced adhesion of circuit patterns and insulating layers, etc.

Pending Publication Date: 2022-02-11
LG INNOTEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Therefore, when the surface roughness of the circuit pattern is reduced, there is an effect of preventing the reduction of the transmission loss, but there is a problem that the adhesion between the circuit pattern and the insulating layer is reduced

Method used

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Embodiment Construction

[0029] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the spirit and scope of the present invention are not limited to a part of the described embodiments, and can be implemented in various other forms, and one or more of the elements of the embodiments may be selected within the spirit and scope of the present invention combined and replaced.

[0030] In addition, unless otherwise defined and described, the terms (including technical and scientific terms) used in the embodiments of the present invention can be understood as having the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs, and terms such as Those defined in commonly used dictionaries can be interpreted as having meanings consistent with their meanings in the context of the related art.

[0031] In addition, terms used in the embodiments of the present invention are us...

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Abstract

A circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed above the top surface of or below the bottom surface of the insulating layer; and a buffer layer disposed between the insulating layer and the circuit pattern, the buffer layer comprising carbon atoms, nitrogen atoms, oxygen atoms, silicon atoms, sulfur atoms, and metal atoms, wherein: the ratio of the carbon atoms to the metal atoms ((carbon atom / copper atom)*100) is 5-7; the ratio of the nitrogen atoms to the metal atoms ((nitrogen atom / copper atom)*100) is 1.5-7; the ratio of the oxygen atoms to the metal atoms ((oxygen atom / copper atom)*100) is 1.1-1.9; and the ratio of the silicon atoms to the metal atoms ((silicon atom / copper atom)*100) is 0.5-0.9; and the ratio of the sulfur atoms to the metal atoms ((sulfur atom / copper atom)*100) is 0.5-1.5.

Description

technical field [0001] The invention relates to a circuit board. Background technique [0002] A printed circuit board (PCB) is formed by printing a circuit wiring pattern at an electrically insulating substrate using a conductive material such as copper, and thus the PCB refers to a board just before electronic components are mounted thereon. That is, in order to densely mount various types of electronic components on a flat surface, the PCB refers to a circuit board having a flat surface on which the mounting position of each component is fixed and the circuit pattern of the connecting components is fixed printed. [0003] Generally, as a surface processing method for a circuit pattern included in the above-described PCB, an organic solderability preservative (OSP) method, an electrolytic nickel / gold method, an electrolytic nickel / gold-cobalt alloy method, an electroless nickel / gold plating method, Palladium / gold method, etc. [0004] In this case, the surface processin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38H05K1/09
CPCH05K3/388H05K1/09H05K3/38H05K3/389H05K1/0242H05K1/113H05K2201/0209H05K2201/0212H05K1/11H05K1/18
Inventor 金勇锡李东华
Owner LG INNOTEK CO LTD