Nickel-based brazing filler metal ring and preparation method thereof
A technology of nickel-based brazing filler metal, which is applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of high brittleness, hard nickel-based brazing filler metal ring, easy to break and fall off, and achieve large fineness , Combining the effects of increased strength and excellent elasticity
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[0043] see figure 2 , further, the preparation method provided by the invention comprises the following steps:
[0044] S10: Obtain toughening fiber 1, nickel-based solder and lead-free glass powder 2 in parts by mass;
[0045] S20: Dissolving the toughening fiber 1 in acetone, ultrasonically dispersing for 10-15 minutes; adding epoxy resin, nickel-based solder and lead-free glass powder 2, and stirring evenly to obtain a slurry;
[0046] S30: Obtain the steel rod 3, coat the surface of the steel rod with dimethyl silicone oil, uniformly press-coat the slurry on the surface of the steel rod, dry, sinter, strip, and cut to obtain the nickel-based solder ring 4.
[0047] Wherein, the drying temperature is 100-120° C., and the drying time is 1-1.5 hours; the sintering temperature is 650-700° C., and the sintering time is 1.5-2 hours.
[0048] In the embodiment of the present invention, the dough-like slurry is press-coated on the surface of the steel bar, and then dried, sinte...
Embodiment 1
[0050] This embodiment provides a nickel-based solder ring, which includes the following components in parts by mass: 0.5 parts by mass of toughening fiber; 10 parts by mass of lead-free glass powder; and 89.5 parts by mass of nickel-based solder.
[0051] Wherein, the toughening fiber is carbon fiber, and the length of the toughening fiber is 2mm-3mm.
[0052] Lead-free glass powder is B 2 o 3 -SnO-ZnO, the particle size of the glass powder is 300-500 mesh.
[0053] The nickel-based solder is BNi-1, and the particle size of the nickel-based solder is 200 mesh to 300 mesh.
[0054] This embodiment also provides a method for preparing the above-mentioned nickel-based solder ring, comprising the following steps:
[0055] S10: Obtain toughening fiber, lead-free glass powder and nickel-based solder according to parts by mass;
[0056] S20: Dissolving the toughening fiber in acetone, and ultrasonically dispersing it for 10 minutes; adding epoxy resin, lead-free glass powder and...
Embodiment 2
[0060] This embodiment provides a nickel-based solder ring, which includes the following components in parts by mass: 2 parts by mass of toughening fiber; 16 parts by mass of lead-free glass powder; and 82 parts by mass of nickel-based solder.
[0061] Wherein, the toughening fiber is polyester fiber, and the length of the toughening fiber is 2mm-3mm.
[0062] Lead-free glass powder is B 2 o 3 -SnO-ZnO and B 2 o 3 -BaO-ZnO, the particle size of the glass powder is 300-500 mesh.
[0063] The nickel-based solder is BNi-1 and BNi-2, and the particle size of the nickel-based solder is 200 mesh to 300 mesh.
[0064] This embodiment also provides a method for preparing the above-mentioned nickel-based solder ring, comprising the following steps:
[0065] S10: Obtain toughening fiber, lead-free glass powder and nickel-based solder according to parts by mass;
[0066] S20: Dissolving the toughening fiber in acetone, ultrasonically dispersing for 12 minutes; adding epoxy resin, l...
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