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Adhesive composition, adhesive sheet, laminate, and printed wiring board

A composition and adhesive technology, applied in the direction of adhesive types, printed circuit parts, graft polymer adhesives, etc., can solve the problem of strong adhesion of adhesive layers and insufficient heat-resistant adhesion problems such as good adhesion, low dielectric properties, and excellent flame retardancy and adhesion resistance

Pending Publication Date: 2022-02-22
TOYO TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent Document 4 has problems such as insufficient heat-resistant adhesiveness and strong adhesion of the adhesive layer.

Method used

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  • Adhesive composition, adhesive sheet, laminate, and printed wiring board
  • Adhesive composition, adhesive sheet, laminate, and printed wiring board
  • Adhesive composition, adhesive sheet, laminate, and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0160] Mix 80 parts by mass of CO-1, 20 parts by mass of OPE-2St 2200, 3 parts by mass of polycarbodiimide V-09GB, 10 parts by mass of epoxy resin HP-7200H and an organic solvent (methylcyclohexane / toluene=80 / 20(v / v)) to obtain a mixed solution. 10 parts by mass of flame-retardant filler OP-935 was mixed into the obtained mixed solution to obtain an adhesive composition. Table 1 shows the compounding ratio, adhesive strength, solder heat resistance, electrical characteristics, and flame retardancy. In addition, the organic solvent (methylcyclohexane / toluene=80 / 20 (v / v)) was adjusted so that the solid content concentration would be 20% by mass.

Embodiment 2～23

[0162] The kind and ratio of the resin used were changed as shown in Table 1, and Examples 2-23 were implemented by the method similar to Example 1. Table 1 shows adhesive strength, solder heat resistance, electrical characteristics, and flame retardancy. In addition, the organic solvent (methylcyclohexane / toluene=80 / 20 (v / v)) was adjusted so that the solid content concentration would be 20% by mass.

[0163] [Table 1]

[0164]

Embodiment 24

[0170] Mix 80 parts by mass of CO-1, 20 parts by mass of OPE-2St 2200, 3 parts by mass of polycarbodiimide V-09GB, 10 parts by mass of epoxy resin HP-7200H and an organic solvent (methylcyclohexane / toluene=80 / 20(v / v)) to obtain a mixed solution. 10 parts by mass of hydrophobic silica R972 was mixed into the obtained mixed solution to obtain an adhesive composition. Table 3 shows the compounding ratio, adhesive strength, solder heat resistance, electrical characteristics, and sticking resistance. In addition, the organic solvent (methylcyclohexane / toluene=80 / 20 (v / v)) was adjusted so that the solid content concentration would be 20% by mass.

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Abstract

[Problem] To provide an adhesive composition that has excellent adhesiveness with respect to both metal substrates and various resin substrates such as those made of polyimides, and that also has exceptional solder heat resistance, low dielectric characteristics, and flame-retardance or tack resistance. [Solution] An adhesive composition containing an acid-modified polyolefin (a), an oligophenylene ether (b) that has a number-average molecular weight of 3000 or less, an epoxy resin (c), and a polycarbodiimide (2), the adhesive composition furthermore containing a flame retarder (e) and / or an inorganic filler (f).

Description

technical field [0001] The present invention relates to an adhesive composition. More specifically, it refers to an adhesive composition for bonding a resin substrate and a resin substrate or a metal substrate. In particular, it is related with the adhesive composition for flexible printed wiring boards (it abbreviates as FPC hereafter), and the adhesive sheet, laminated body, and printed wiring board containing the same. Background technique [0002] Flexible printed circuit boards (FPCs) are widely used for mounting electronic circuit boards in narrow and complicated interiors due to their excellent flexibility and their ability to cope with the multifunctionalization and miniaturization of computers (PCs) and mobile phones. In recent years, with the development of miniaturization, light weight, high density, and high power of electronic equipment, and with the popularity of these, the performance requirements for circuit boards (electronic circuit substrates) are getting...

Claims

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Application Information

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IPC IPC(8): C09J123/00B32B27/00B32B27/18B32B27/32B32B27/34B32B27/38C09J7/35C09J7/38C09J11/04C09J11/06C09J123/26C09J151/06C09J163/00H05K1/03
CPCB32B27/00B32B27/38H05K1/03B32B27/18C09J11/04C09J123/00B32B27/34B32B27/32C09J7/38C09J151/06C09J11/06C09J123/26C09J163/00C09J7/35C08L51/06C08L63/00
Inventor 园田辽川楠哲生
Owner TOYO TOYOBO CO LTD
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