Two-step packaging method of flexible piezoelectric fiber composite material

Abstract

The invention discloses a two-step packaging method of a flexible piezoelectric fiber composite material, which comprises the following steps of wiping and cleaning an interdigital electrode or a planar electrode to be packaged and a piezoelectric fiber composite layer or a piezoelectric fiber array adhered to a viscous polymeric membrane by using absolute ethyl alcohol, adding a polymer glue solution between overlapping and aligning with the effective area of the lower electrode, forming a first-step packaging piece, sequentially placing a heat-conducting metal layer, a buffer layer, the first-step packaging piece, the buffer layer and the heat-conducting metal layer to form a first-step packaging combined piece, carrying out vacuum, pressurization and heating, then separating, repeating the above operations with an upper electrode to complete two-step packaging, and acquiring the flexible piezoelectric fiber composite material. Integrated forming packaging of the flexible piezoelectric fiber composite material can be achieved, the method is simple, short in time and efficient, high stability and high driving sensing performance are achieved, and meanwhile, interdigital electrodes or planar electrodes of different sizes can be selected for integrated packaging according to the use requirements of the flexible piezoelectric fiber composite material.

Description

technical field [0001] The invention relates to the technical field of packaging of flexible piezoelectric fiber composite materials, in particular to a two-step packaging method of flexible piezoelectric fiber composite materials. Background technique [0002] The flexible piezoelectric fiber composite material is composed of piezoelectric ceramic fibers and epoxy resin and other polymers. Its structure is a sandwich sandwich composed of upper and lower polyimide planar electrodes or interdigitated electrodes covered with piezoelectric fiber composite layers. structure, the middle layer of piezoelectric fiber composite layer is made of unidirectional rectangular piezoelectric ceramic fibers and epoxy resin and other high molecular polymers arranged alternately, and is packaged as a whole. This material overcomes the problems of high brittleness and poor toughness of traditional piezoelectric ceramic materials. Problems, with good flexibility and stiffness, are widely used i...

AI Technical Summary

Problems solved by technology

But at present, there are few packaging methods for flexible piezoelectric fiber composite materials. The current method is one-step packaging by a hot press, but it has obvious disadvantages, such as poor packaging stability and difficult electrode alignment. It is more difficult for the packaging of large-scale and micro-scale flexible piezoelectric fiber composites

For example, the publication number is CN110767799B, and the patent name is: A packaging method for interdigitated electrode-type piezoelectric fiber composite materials, mainly for the packaging of flexible piezoelectric fiber composite materials of medium and suitable size. Small size electrodes are less difficult to align, but the middle layer The piezoelectric fiber composite layer is easy to slide during the alignment process, which is time-consuming and inefficient. If the size of the piezoelectric fiber composite layer is large, it will be more difficult to manually align the upper and lower electrodes with the middle piezoelectric fiber composite layer, and at the same time, the upper and lower electrodes will be dislocated during hot pressing. The degree will increase, affecting product performance and lower yield

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