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Polyimide precursor, polyimide, polyimide film and preparation method and application thereof

A technology of polyimide precursor and polyimide film, which is applied in the field of polyimide, can solve the problems of polyimide material performance difference, film thermal performance and mechanical performance degradation, etc.

Pending Publication Date: 2022-03-01
CHINA PETROLEUM & CHEM CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are many types of dianhydride and diamine monomers, and the source of raw materials is wide. Different combinations of monomers can be polymerized to obtain polyimide materials with different structures, resulting in differences in the performance of polyimide materials.
But at the same time, because this type of molecular structure has a certain influence on the stability of the molecular chain, the thermal and mechanical properties of the resulting film will be reduced.

Method used

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  • Polyimide precursor, polyimide, polyimide film and preparation method and application thereof
  • Polyimide precursor, polyimide, polyimide film and preparation method and application thereof
  • Polyimide precursor, polyimide, polyimide film and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] 1. Stock solution preparation: 2.56kg 4,4'-diamino-2,2'-bistrifluoromethylbiphenyl and 0.67kg 2,2-bis(4-aminophenyl)hexafluoropropane at 25°C Stir and dissolve in 31.05kg N,N-dimethylacetamide (DMAc), after complete dissolution, add 0.88kg 2,3,3',4'-biphenyltetracarboxylic dianhydride and 1.37kg 1,2,3 , 4-cyclobutanetetracarboxylic dianhydride (CBDA), fully stirred for 24 hours to obtain a polyimide precursor. The polyimide precursor is filtered through 5 μm and 0.5 μm filter membranes in sequence, and then degassed under reduced pressure to obtain a polyimide film-forming stock solution.

[0070] 2. Cast film formation: The film-forming stock solution is extruded through the film head, and the wet film thickness is controlled to 500 μm, and cast on a smooth steel belt to form a film.

[0071] 3. Pre-baking treatment: The film-forming stock solution is passed through a heating furnace at 85°C under a nitrogen flowing atmosphere to remove most of the solvent to obtain a...

Embodiment 2

[0075] 1. Stock solution preparation: Dissolve 3.20kg of 4,4'-diamino-2,2'-bistrifluoromethylbiphenyl in 30.37kg of N-methylpyrrolidone (NMP) with stirring at 25°C. , add 0.59kg 2,3,3',4'-biphenyltetracarboxylic dianhydride and 1.57kg 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA), stir well for 24 hours to obtain polyamide Imine precursors. The polyimide precursor is filtered through 5 μm and 0.5 μm filter membranes in sequence, and then degassed under reduced pressure to obtain a polyimide film-forming stock solution.

[0076] 2. Cast film formation: The film-forming stock solution is extruded through the film head, and the wet film thickness is controlled to 500 μm, and cast on a smooth steel belt to form a film.

[0077] 3. Pre-baking treatment: The film-forming stock solution is passed through a heating furnace at 85°C under a nitrogen flowing atmosphere to remove most of the solvent to obtain a self-supporting polyamic acid film.

[0078] 4. Thermal imidization:...

Embodiment 3

[0081] 1. Stock solution preparation: Dissolve 3.52kg of 4,4'-diamino-2,2'-bis(trifluoromethoxy)-p-diaminobenzidine in 33.15kg of N,N-dimethyl In acetamide (DMAC), after completely dissolving, add 1.15kg 2,3,3',4'-biphenyltetracarboxylic dianhydride and 1.18kg 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA ), fully stirred to obtain the polyimide precursor after 24 hours. The polyimide precursor is filtered through 5 μm and 0.5 μm filter membranes in sequence, and then degassed under reduced pressure to obtain a polyimide film-forming stock solution.

[0082] 2. Cast film formation: The film-forming stock solution is extruded through the film head, and the wet film thickness is controlled to 500 μm, and cast on a smooth steel belt to form a film.

[0083] 3. Pre-baking treatment: The film-forming stock solution is passed through a heating furnace at 85°C under a nitrogen flowing atmosphere to remove most of the solvent to obtain a self-supporting polyamic acid film.

...

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Abstract

The invention discloses a polyimide precursor, polyimide, a colorless transparent polyimide film, and a preparation method and application thereof. The polyimide precursor contains at least one of a structural unit shown in a formula (1), a structural unit shown in a formula (2), a structural unit shown in a formula (3) and a structural unit shown in a formula (4), and at least one of a structural unit shown in a formula (5), a structural unit shown in a formula (6), a structural unit shown in a formula (7) and a structural unit shown in a formula (8), in the formula, R1 and R2 are respectively and independently fluorine-containing aromatic residues containing at least one carbon six-membered ring, and R1 and R2 are the same or different. The light transmittance of the polyimide film is greater than 85%, the glass transition temperature is greater than 350 DEG C, and the water absorption is less than 1%.

Description

technical field [0001] The invention relates to the field of polyimide, in particular to a polyimide precursor, polyimide and colorless and transparent polyimide film, as well as its preparation method and application. Background technique [0002] Polyimide is a kind of polymer with excellent comprehensive performance, which has excellent heat resistance, low temperature resistance, self-lubrication, radiation resistance and flame retardancy, as well as excellent mechanical properties and dielectric properties , Widely used in aerospace, microelectronics, solar cells, high temperature filtration, machinery, separation membranes and OLEDs and other fields. It is worth mentioning that with the rapid development of flexible electronics and flexible display technology, transparent PI film has become the preferred material for flexible display device substrates due to its excellent high temperature resistance, good mechanical properties and excellent chemical resistance. . [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18G09F9/30C08L79/08
CPCC08G73/1075C08G73/1042C08G73/1039C08G73/1007C08J5/18G09F9/301C08J2379/08
Inventor 崔晶张培斌刘京妮孙旭阳陈雪
Owner CHINA PETROLEUM & CHEM CORP
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