Directional heat-conducting fin and preparation method thereof, and semiconductor heat dissipation device

A technology of directional thermal conductivity and thermal conductivity filler, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, chemical instruments and methods, etc. It can solve problems such as poor fluidity, difficult extrusion processing, and affecting the uniformity of thermal conductivity, etc., reaching a viscosity range Wide, directional, high uniformity effect

Pending Publication Date: 2022-03-04
GUANGDONG SUQUN NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Baolima Technology Co., Ltd. published the patent CN100548099C, which uses a superconducting magnetic field and applies a certain frequency of vibration to make the carbon fiber with a high filling amount oriented along the direction of the magnetic field in the high-viscosity composition. Since the densities of the added alumina and carbon fiber fillers are respectively 3.8 times and 2 times the density of the silicone resin matrix, after the vibration is applied, it will cause the filler to settle, causing the overall composition to be uneven, and ultimately affect the uniformity of thermal conductivity
In addition, the high price and operating costs of superconducting magnets increase the cost
Dexerials Co., Ltd. announced CN107004651A, CN108463882A and CN109891577A. This method is to use the extrusion method to orient the carbon fiber along the extrusion method. We have found through our experiments that in order to prepare a high thermal conductivity sheet, when the mass ratio of the filled carbon fiber to the resin When it is greater than 1.3, the viscosity of the composition is large, the fluidity becomes poor, and it is difficult to extrude and process
In addition, when molding in a hollow m

Method used

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  • Directional heat-conducting fin and preparation method thereof, and semiconductor heat dissipation device
  • Directional heat-conducting fin and preparation method thereof, and semiconductor heat dissipation device
  • Directional heat-conducting fin and preparation method thereof, and semiconductor heat dissipation device

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0043] Example 1

[0044] This embodiment provides an orientation molding device, see figure 1 and figure 2 This orientation molding device includes:

[0045] The cylindrical rotor 2 is fixed to the center axis of the rotor 2, and the rotating shaft 5 is a motor one 6, and the motor one 6 is rotated by the rotating shaft 5; the drum 2 is set; There is a shaft symmetrical as a load zone 1, the loading zone 1 is two sector cylindrical regions, the two sector cylindrical regions to be symmetrically disposed of the center axis of the drum. The bottom side of the drum 2 of the charge zone 1 is provided with a drum opening;

[0046] The sleeve 3 is provided insulated a sandwich, and the inner charge is charged. The sleeve 3 is arranged outside the drum 2, and in the present embodiment, a gap 14 is provided between the sleeve 2 and the sleeve 3, and the gap 14 has a spacing of 0.1 to 5 mm. The drum 2 can be rotated inside the sleeve 3, and the sleeve 3 side of the sleeve opening is provi...

Example Embodiment

[0051] Example 2

[0052] This embodiment provides a method of preparing a directed thermally conductive sheet, using an orientation molding apparatus in Example 1, and the specific implementation steps are as follows:

[0053] S1. Ingredients: 100g addition silicone oil (vinyl silicone oil 55g, mixture of 44.9 g of hydrogen-containing silicone oil and mixture of platinum catalyst), 75 g of carbon fiber powder (length of 0.1 mm in length) and 300 g of spherical alumina, mixed stirring 30 min, vacuum sprinkling 5 min after 5 min, forming a fluid composition having a viscosity of 200,000 mPa · s;

[0054] S2. Orientation Molding: Place the fluid composition obtained in step S1 in the rotor symmetric material of the orientation molding device, and the angular velocity of the drum is 70 r / min for circumferential motion, during the circumferential motion, the composition is subject to centrifugation In the gap of the drum and the sleeve from the opening opening opening, the spacing o...

Example Embodiment

[0058] Example 3

[0059] This embodiment provides a method of preparing a directed thermally conductive sheet, using an orientation molding apparatus in Example 1, and the specific implementation steps are as follows:

[0060] S1. Ingredients: 100g reactive silicone oil (vinyl silicone oil 55g, mixture of 44.9 g of hydrogen-containing silicone oil and a mixture of 0.1 g of platinum catalyst), 120 g of carbon fiber powder (length of 0.1 mm, diameter is 15 μm), 300 g of spherical alumina and 50g spherical Aluminum nitride, mixed for 30 min, and the fluid composition having a viscosity of 650,000 mPa · s was formed after vacuum derivation of 5 min.

[0061] S2. Orientation Molding: Place the fluid composition obtained in step S1 in the rotor symmetric material of the orientation molding device, and the angular velocity of the drum is 90 r / min for circumferential movement, during circumferential motion, the composition is subject to centrifugation In the gap of the drum and the sle...

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Abstract

The invention belongs to the field of heat-conducting fin preparation technologies and semiconductor heat dissipation, and particularly discloses a preparation method of a directional heat-conducting fin, which comprises the following steps: S1, preparing a fluid composition for the heat-conducting fin; s2, the fluid composition obtained in the step S1 is placed in an orientation forming device, high-speed shearing force of circular motion is applied to the fluid composition layer by layer, so that the heat-conducting filler in the fluid composition is oriented in the shearing direction, oriented thin-layer compositions are formed, the thin-layer compositions are collected in a mold layer by layer, a continuous multi-layer collection body is formed, and the multi-layer collection body is obtained. S3, carrying out thermocuring on the multi-layer convergence body to obtain an oriented composition block; and S4, slicing the oriented composition block along a direction vertical to the orientation to obtain the oriented heat-conducting sheet. The convergence body prepared by the method is good in orientation, few in defect and high in efficiency, the heat-conducting fin obtained by slicing treatment has high orientation, high heat conductivity and uniformity, and meanwhile, the heat-conducting fin can be well applied to a semiconductor heat dissipation device.

Description

technical field [0001] The invention relates to the preparation technology of a heat conduction sheet and the field of semiconductor heat dissipation, in particular to a preparation method of an oriented heat conduction sheet and a semiconductor heat dissipation device. Background technique [0002] With the development of 5G technology, the power density of chips continues to increase, which puts forward higher requirements for the heat dissipation of chips. In heat dissipation components, thermally conductive silicone gaskets are usually used to reduce the interface thermal resistance between the chip and the heat sink and improve heat dissipation efficiency. [0003] At present, conventional thermally conductive silica gel gaskets are realized by filling isotropic spherical thermally conductive fillers (aluminum oxide, aluminum nitride, zinc oxide, etc.) in the silica gel matrix. Due to the low intrinsic thermal conductivity of spherical ceramic fillers, the gasket It is...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K7/06C08K7/18C08J5/18C09K5/14C08K7/00C08K3/22C08K3/28C08K3/38B29C35/02H01L23/373
CPCC08J5/18C09K5/14B29C35/02H01L23/3737C08J2383/07C08J2483/05C08K7/06C08K7/18C08K7/00C08K2003/2227C08K2003/282C08K2003/385
Inventor 任泽明吴攀王号廖骁飞贺超任泽永
Owner GUANGDONG SUQUN NEW MATERIAL CO LTD
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