Clip copper sheet and strip

A strip and copper sheet technology, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problem of excessive bubbles in the adhesive solder paste, insufficient heat dissipation capacity of the clip copper sheet, and electrical performance and reliability of the product. To improve electrical performance and reliability, rapid conduction and divergence, and excellent electrical performance

Pending Publication Date: 2022-03-08
华羿微电子股份有限公司
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  • Summary
  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a clip copper sheet and a strip, which is used to solve the problem that the heat dissipation capacity of the existing clip copper sheet is insufficient in small packaging, and when bonding, the large bonding area easily leads to excessive generation of adhesive solder paste Bubbles, leading to poor electrical performance and reliability of the product

Method used

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  • Clip copper sheet and strip
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  • Clip copper sheet and strip

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Embodiment Construction

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0045] figure 2 A schematic diagram of the front structure of the clip copper sheet provided by the embodiment of the present invention; image 3 Schematic diagram of the back structure of the clip copper sheet provided by the embodiment of the present invention; Figure 4 It is a schematic diagram of the connection structure of the clip copper sheet provided by the embodiment of the present invention. The following combination Figure 1 ~ Figure 4 As an e...

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Abstract

The invention provides a clip copper sheet and a strip, and relates to the technical field of packaging and manufacturing of power semiconductor devices. The problems that an existing clip copper sheet is insufficient in heat dissipation capacity during small packaging, adhesive solder paste is prone to generating too many bubbles due to the large bonding area, and the electrical performance and reliability of a product are poor are solved. The clip copper sheet comprises a heat dissipation frame which is arranged around a chip bonding part, and one side of the heat dissipation frame is connected with a connecting part; wherein the height of the upper surface of the chip bonding part is lower than that of the upper surface of the heat dissipation frame; and the first U-shaped groove is formed in one side, far away from the connecting part, of the heat dissipation frame, extends into the chip bonding part and extends into a BUS wire of the S pole of the chip.

Description

technical field [0001] The invention relates to the technical field of packaging and manufacturing of power semiconductor devices, in particular to a clip copper sheet and strip. Background technique [0002] The lead frame has the functions of carrying chips, connecting internal chips and external circuit board electrical signals, installing and fixing electronic devices, etc. As a commonly used connection method between chips and frames, clip copper sheet welding replaces the standard wire bonding method between chips and pins to a certain extent, and can obtain unique package resistance, higher current flow, and better thermal conductivity. [0003] In the PPAK3×3 power device package, heat dissipation is mainly carried out through the heat sink on the back of the frame. In the existing clip design, the chip bonding part is an integral plane, such as figure 1 As shown, when the overall planar clip has a large power output, in order to increase the heat dissipation chann...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L23/367
CPCH01L23/4951H01L23/49565H01L23/3677H01L23/3672H01L2224/38H01L2224/40245H01L23/49524
Inventor 赵文涛张涛韩萌杨伊杰
Owner 华羿微电子股份有限公司
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