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Mainboard manufacturing process

A manufacturing process and motherboard technology, which is applied in the processing of insulating substrates/layers, printed circuit manufacturing, printed circuit secondary processing, etc. Loss and characteristic impedance, etc., to avoid hidden quality problems, reduce signal energy loss and characteristic impedance, and ensure the effect of factory quality

Pending Publication Date: 2022-03-18
中山市盈利佳电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a motherboard manufacturing process, which solves the problem that burrs may remain on the inner wall of the hole after mechanical drilling of the PCB, so that the burrs in the substrate hole will affect the transmission of the circuit, reducing the Increase the transmission speed of the signal in the circuit on the PCB board, increase the signal energy loss and characteristic impedance in the circuit, and reduce the quality of the PCB board after production

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] S1, CCL cutting;

[0041] Transport the selected copper clad laminate to the cutting equipment, and the cutting equipment will cut the copper clad laminate to the corresponding size according to the production process, so as to obtain the copper clad substrate;

[0042] S1-1. The cut copper-clad substrate is mechanically polished to remove the glass fibers left by the right angles on the four sides of the substrate during cutting. At the same time, the speed of the mechanical grinding plate is 2.5mm / min, and the thickness of the mechanical grinding plate is controlled at 6mm. The thickness of the mechanical grinding plate can be modified correspondingly according to different types of copper clad laminates. In this way, the occurrence of scratches in the post-production process can be reduced / The problem of scratching the board surface, try to avoid the problem of hidden quality of PCB board;

[0043] S1-2. Baking the trimmed substrate removes water vapor and organic...

Embodiment 2

[0061] S1, CCL cutting;

[0062] Transport the selected copper clad laminate to the cutting equipment, and the cutting equipment will cut the copper clad laminate to the corresponding size according to the production process, so as to obtain the copper clad substrate;

[0063] S1-1. The cut copper-clad substrate is mechanically polished to remove the glass fibers left by the right angles on the four sides of the substrate during cutting. At the same time, the speed of the mechanical grinding plate is: 3.2mm / min, and the thickness of the mechanical grinding plate is controlled at 6-18mm. The thickness of the mechanical grinding plate can be modified correspondingly according to different types of copper clad laminates. The problem of scratching / scratching the board surface avoids the problem of hidden quality of the PCB board as much as possible;

[0064] S1-2. Remove the water vapor and organic volatiles in the substrate by baking the trimmed substrate, and release the intern...

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Abstract

The invention relates to the technical field of mainboard production, and discloses a mainboard manufacturing process, which comprises the following specific operation steps: S1, copper-clad plate cutting, S2, drilling, S3, photosensitive film coating, S4, exposure of a circuit board coated with a photosensitive layer, S5, development, S6, etching, S7, film stripping, and S8, AOI detection. According to the manufacturing process of the main board, the copper surface is uniformly corroded by chemical substances such as sodium dithiodipropane sulfonate, impurities such as grease, oxide or burrs on the inner walls of the substrate holes are removed, in this way, the problem that burrs appear in the substrate holes in the drilling process is avoided, the cleanliness in the substrate holes is further improved, and the service life of the main board is prolonged. According to the utility model, the influence of burrs in the substrate hole on line transmission is avoided as much as possible, the transmission speed of signals in the circuit on the PCB is further improved, the energy loss and characteristic impedance of the signals in the circuit are reduced, and the quality of the produced PCB is guaranteed.

Description

technical field [0001] The invention relates to the technical field of motherboard production, in particular to a manufacturing process of a motherboard. Background technique [0002] With the rapid development of the electronics industry, electronic products and equipment are used more and more frequently in people's production and life, and the core components of electronic products are composed of various electronic components. The Chinese name of PCB is printed circuit board. In electronic components, it is used to form a predetermined circuit connection between electronic components, which plays the role of relay transmission and is a key electronic interconnection of electronic products. [0003] However, there are certain disadvantages in the current production process of PCB boards: PCB needs to drill holes on the substrate during the processing process, so that the conductive channel between the connection circuit layers is formed on the substrate, but the existing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/22
CPCH05K3/0047H05K3/0055H05K3/22H05K2203/0346H05K2203/025H05K2203/1194H05K2203/162
Inventor 覃凡
Owner 中山市盈利佳电子有限公司
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