Mold for small silicon rubber grid rib reinforced structure composite material cabin section
A silicone rubber and mold technology, applied in metal material coating process, ion implantation plating, coating, etc., can solve problems such as low hardness, difficult demoulding, easy corrosion, etc.
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Embodiment 1
[0014] The preparation method of the diamond-like micro-nano coating for silicone rubber mold mainly includes the following steps:
[0015] Use acetone, alcohol, and deionized water to ultrasonically clean the silicone rubber mold to remove surface grease and dirt, and dry it with hot air.
[0016] A dielectric barrier discharge reactor was used for plasma modification at room temperature. A mixture of high-purity silane and methane gas was introduced between the electrodes of the reaction chamber at a flow rate of 20mL / min, and the volume ratio of silane to methane was 0.6:1. A 10kHz, 25kV AC power is applied to the reactor to generate plasma containing Si and C at room temperature, and the mold is treated for 2 minutes.
[0017] Then it was transferred to the sputtering chamber, and the Al target and the graphite target were set opposite to each other. First, Ar ions bombarded the target for 4 minutes to clean and activate the target respectively; the vacuum degree of the sp...
Embodiment 2
[0022] The preparation method of the diamond-like micro-nano coating for silicone rubber mold mainly includes the following steps:
[0023] Use acetone, alcohol, and deionized water to ultrasonically clean the silicone rubber mold to remove surface grease and dirt, and dry it with hot air.
[0024] A dielectric barrier discharge reactor was used for plasma modification at room temperature. A mixture of high-purity silane and methane gas was introduced between the electrodes of the reaction chamber at a flow rate of 35 mL / min, and the volume ratio of silane to methane was 0.8:1. A 10kHz, 20kV AC power is applied in the reactor to generate plasma containing Si and C at room temperature, and the mold is treated for 2 minutes.
[0025] Then it was transferred to the sputtering chamber, and the Al target and the graphite target were set opposite to each other. First, Ar ions bombarded the target for 3 minutes to clean and activate the target respectively; the vacuum degree of the s...
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