Novel silica gel hot-pressing buffer material for module lamination and preparation method thereof

A technology of buffer material and thermal conductive material, applied in the field of hot-pressed buffer material, can solve the problems of compressive capacity, elasticity, toughness, oil penetration resistance, poor service life, high friction coefficient, and high frequency of wire changing, so as to increase the surface roughness. The effect of increasing thermal conductivity, reducing heat loss

Pending Publication Date: 2022-04-05
镇江中垒新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Most of the existing hot-pressed buffer materials are kraft paper or pure silica gel products, which have disadvantages such as high friction coefficient, low thermal conductivity, no pressure resistance, easy damage, high frequency of line changes during use, and high production costs. For example, the application publication number is The invention patent of CN110001164A relates to a hot-pressed cushioning material, which is composed of glass fiber cloth, Teflon cloth and knitted non-woven fabric. Poor permeability and service life, therefore, the present invention relates to a new type of hot-pressed buffer material, which improves the above-mentioned defects to a certain extent

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A new type of silicone heat-pressing buffer material for module pressing, which is made of modified silicone polymer added with nano-scale heat-conducting materials and thermoplastic polyester backing film. The overall thickness is 5mm, and modified with nano-scale heat-conducting materials. The film thickness of the silicone polymer is 0.2mm-0.45mm.

[0037] The nano-scale thermal conductive material selects alumina powder with a thermal conductivity close to 1W / mk. In terms of parts by mass, the amount of alumina powder added is 8% of the total amount of modified silica gel polymer, and the added alumina powder is a mass ratio of 1 : 1 3000 mesh alumina powder and 5000 mesh alumina powder are mixed.

[0038] Modified silicone polymers include 74.5% base methyl vinyl silica gel, 21% white carbon black, 1% blocked silicone oil, 0.5% hydroxyl silicone oil, 2% methyl silicone oil, 1% stearic acid, base methyl vinyl The mole fraction of the vinyl content in the base silic...

Embodiment 2

[0041] A method for preparing a novel silica gel hot-pressing cushioning material for module pressing, which is used to prepare a novel silica gel hot-pressing cushioning material for module pressing as described in Example 1, comprising the following steps:

[0042] S1. Mixing to obtain silica gel-based glue

[0043] Put semi-dry colloidal viscous base material methyl vinyl silica gel, blocked silicone oil, hydroxy silicone oil, methyl silicone oil and stearic acid into the kneader for mixing. The mixing temperature is within the range of 60±10°C and the mixing time is Be 45 minutes, obtain the initial sizing material that mixes homogeneously;

[0044] S2. Mixing to obtain thermally conductive base glue

[0045] Add white carbon black and nano-scale heat-conducting materials to the initial rubber compound obtained in step S1, raise the temperature in the internal mixer to 70±10°C, control the air pressure to 1.5 times the atmospheric pressure, and mix for 30 minutes to obtai...

Embodiment 3

[0053] Compared with Example 1, the difference of this example is that: the addition amount of aluminum oxide powder, a nanoscale heat-conducting material, is 9% of the total amount of the modified silica gel polymer; the modified silica gel polymer includes 71% of the base material A Vinyl silica gel, 25.5% white carbon black, 0.35% blocked silicone oil, 3.5% hydroxyl silicone oil, 5.5% methyl silicone oil, 0.2% stearic acid; modified silica gel with nano-scale thermal conductive materials added to the new silica gel hot pressing buffer material The film thickness of the polymer is 0.2mm-0.45mm.

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Abstract

The invention provides a novel silica gel hot-pressing buffer material for module pressing and a preparation method, and belongs to the technical field of hot-pressing buffer materials, the novel silica gel hot-pressing buffer material for module pressing is formed by pressing a modified silica gel polymer added with a nanoscale heat conduction material and a thermoplastic polyester bottom film; the preparation method comprises the following steps: S1, mixing to obtain silica gel base rubber; S2, mixing to obtain heat-conducting base rubber; S3, preserving heat to obtain a modified silica gel material; S4, coloring the modified silica gel material; the hot-pressing buffer material has the characteristics of extremely high compression resistance, compression uniformity, rebound capability, recovery capability, buffer performance, tear resistance, high temperature resistance, high-speed heat transfer performance, heat stability, no powder on the surface, no oil leakage, no damage to hot-pressing products and the like; and the production efficiency of the bonding process of the liquid crystal module and the quality of the liquid crystal module can be indirectly improved.

Description

technical field [0001] The invention relates to a novel silica gel heat-pressed cushioning material for module pressing, which belongs to the technical field of heat-pressed cushioning materials. Background technique [0002] Due to the rapid development of power measurement and control terminals, numerical control systems, human-machine interfaces, electronic measurement, automotive electronics, and data acquisition, people's corresponding demand for liquid crystal modules is also increasing. In simple terms, liquid crystal modules are screens and The combination of backlight components, the principle of liquid crystal display is that the backlight components emit uniform surface light, and the screen processes these surface lights in units of pixels, displays them as specific images, and finally transmits them to people's eyes. [0003] The production process of the liquid crystal module generally involves the bonding process. The bonding process is used to connect the cir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/04C08K7/26C08K3/22B32B9/00B32B9/04B32B27/36B32B37/06B32B37/10
Inventor 贾忠杰倪泽
Owner 镇江中垒新材料科技有限公司
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