Assembling system for welding surface-mounted components

A technology for assembling systems and patch components, which is applied in the direction of assembling printed circuits, welding equipment, and auxiliary devices with electrical components to achieve the effects of improving welding quality, avoiding bridging, and improving welding quality.

Active Publication Date: 2022-04-08
重庆宇隆光电科技股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the deficiencies in the use of the existing component assembly equipment proposed in the background technology, the present invention provides an assembly system for patch component welding, which has the functions of avoiding component misalignment, reducing air bubbles in solder paste, and preventing solder paste from The advantages of flow, solve the problems raised in the above background technology

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  • Assembling system for welding surface-mounted components
  • Assembling system for welding surface-mounted components
  • Assembling system for welding surface-mounted components

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] see figure 1 , an assembly system for patch component welding, including a main controller 1, a solder paste printing machine, a placement machine and a reflow soldering machine 3, the main controller 1 includes a placement controller 101, a transfer controller 102, Adsorption controller 103, fixed blowing controller 104 and frequency setter 105, the solder paste printing machine is matched with the printing plate 2, and the solder paste printing machin...

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Abstract

The invention relates to the technical field of electronic components, and discloses an assembly system for patch component welding, which comprises a main controller, a solder paste printing machine, a chip mounter and a reflow soldering machine, the main controller comprises a patch positioning controller, a transmission controller, an adsorption controller, a constant blowing controller and a frequency setter, the solder paste printing machine is matched with a printing plate, and the chip mounter is matched with the frequency setter. The printing plate comprises a glue solution printing plate and a glue solution printing plate, the chip mounting positioning controller is electrically connected with the chip mounter, the output end of the chip mounter is connected with a conveying belt, and the conveying belt is electrically connected with the conveying controller. According to the invention, after the solder paste printing plate is used for printing the solder paste, the glue solution printing plate is used for printing the glue solution on the plate, and the solidified glue solution is used for enclosing the solder joints coated with the solder paste, so that the solder paste can be prevented from melting and flowing to cause short circuit caused by connection of the solder joints; in addition, by utilizing the limiting effect of the colloid on the element, the dislocation probability of the element can be reduced, thereby avoiding the welding defect problem and improving the welding quality.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to an assembly system for patch component welding. Background technique [0002] Surface mount technology is a new generation of electronic assembly technology, which compresses traditional electronic components into devices with only a few tenths of the volume, thereby realizing high density, high reliability, miniaturization, and low cost of electronic product assembly. and automation of production. The process method of assembling components to printing is called SMT process, and the related assembly equipment is called SMT equipment. The SMT process mainly has three basic operation steps: coating, placement, and welding. Coating is to apply solder paste to the PCB board, and the related equipment for coating is a printing machine; Mounting is to mount components on the PCB board, and the equipment needed is a placement machine; reflow soldering is a part of solde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/00B23K3/08H05K3/34
CPCY02P70/50
Inventor 王晓娜
Owner 重庆宇隆光电科技股份有限公司
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