Diamond/block copper substrate diffusion bonding process and structure based on diamond indirect stretching structure

Abstract

The invention discloses a diamond / block copper substrate diffusion bonding process and structure based on a diamond indirect stretching structure. The structure mainly comprises a cuboid block copper substrate, and a three-dimensional diamond film which is arranged in an array mode and is in a geometric figure shape and a cross shape and is used for fixing the diamond film. The diffusion bonding process comprises the following steps: carrying out mechanical polishing treatment on a block copper substrate, carrying out plasma cleaning, sputtering an alloy solder on the surface, applying temperature and pressure to a diamond film and the block copper substrate in a vacuum environment to realize diffusion bonding of the diamond film and the block copper substrate, opening the block copper substrate in a displacement / force / heat / electricity manner to drive the diamond film to stretch, and carrying out diffusion bonding on the diamond film and the block copper substrate. And the strain is indirectly generated. The thickness of the alloy solder layer can be uniform and controllable, the shear strength and bonding area of diffusion bonding are improved, the reliability of diffusion bonding is improved, the geometric figure structure is adjusted to adapt to the to-be-stretched film, and the universality of the diamond film is improved while efficient and indirect stretching of the diamond film is achieved.

Description

technical field [0001] The invention relates to the field of diamond composite materials and diffusion bonding technology, in particular to a diamond / block copper substrate diffusion bonding technology and structure based on a diamond indirect tensile structure. Background technique [0002] Diffusion bonding of diamond / bulk copper substrate based on diamond indirect tensile structure is a kind of thermocompression bonding. Firstly, metal materials with high diffusivity such as gold, copper or aluminum are spin-coated on the wafers and blocks to be bonded, and then heated and pressed to bond the block copper and the diamond film to be bonded together. Diffusion is the result of metal atoms mixing with each other, resulting in extremely high bonding strength and enabling hermetic packaging. [0003] At present, in the field of diamond composite materials, in the preparation process of diamond and metal composite materials, in order to improve the bonding strength between dia...

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Problems solved by technology

[0003] At present, in the field of diamond composite materials, in the preparation process of diamond and metal composite materials, in order to improve the bonding strength between diamond and metal, boron and its compound layer are often introduced between diamond and metal, but in the block that needs to be bonded When laying metal materials on the surface, the traditional method of spin coating will cause uneven thickness of the solder layer and the overall thickness of the solder layer will become thicker, which is not good for the overall bonding, so the thickness of the solder layer needs to be controlled

[0004] In addition, cleaning the bonding surface by traditional wet process will bring organic particles to stick to dirt, which will cause unevenness to the flatness of the bonding interface and affect the effect of diffusion bonding.

At the same time, on the issue of diamond film stretching, traditional methods cannot realize the stretching of diamond films in batches, and the types of tensile samples are single, so a structure and process that can stretch diamond films in batches is needed

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