Rigid-flexible fused capacitive flexible MEMS ultrasonic transducer and preparation method thereof

An ultrasonic transducer, capacitive technology, applied in the direction of electric solid devices, piezoelectric/electrostrictive/magnetostrictive devices, instruments, etc., can solve the difficulty in realizing high-density flexible CMUTs two-dimensional transducer array micromachining , It is impossible to solve the problems of the mutual restriction of the design of the flexible performance of the transducer frequency design, and the difficulty of realizing the design of the high density/high filling factor transducer array element, so as to improve the output sound pressure and receiving sensitivity, stable working performance, and prevent bending deformation.

Pending Publication Date: 2022-04-29
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method can also be used to develop flexible CMUTs array elements, it is difficult to achieve high-density / high-fill factor transducer array design, which limits the improvement of transducer ultrasonic output sound pressure, receiving sensitivity, and imaging resolution.
[0005] To sum up, although the existing research has made some progress in the design and preparation of flexible CMUTs, the existing research has not been able to solve the mutual constraints between the transducer frequency design and its structural flexibility performance design.
In addition, it is difficult to realize the microfabrication of high-density flexible CMUTs two-dimensional transducer arrays

Method used

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  • Rigid-flexible fused capacitive flexible MEMS ultrasonic transducer and preparation method thereof
  • Rigid-flexible fused capacitive flexible MEMS ultrasonic transducer and preparation method thereof
  • Rigid-flexible fused capacitive flexible MEMS ultrasonic transducer and preparation method thereof

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Embodiment 1

[0041] like figure 1 As shown, the rigid-flexible capacitive flexible MEMS ultrasonic transducer of this embodiment includes a flexible upper electrode 1, a rigid vibrating membrane 2, a groove 3, a cavity 4, a flexible pillar 5, a rigid lower electrode 6, a flexible base 7 and a flexible The conductive layer 8; wherein the rigid vibrating film 2, the flexible pillar 5 and the rigid lower electrode 6 are sequentially arranged from top to bottom and seal the cavity 4 together; the area where the rigid lower electrode 6 and the rigid vibrating film 2 contact the flexible pillar 5 It is penetrated by grooves 3 in the thickness direction, the grooves 3 are used as gaps between the rigid vibrating membranes 2 of adjacent transducing units, and the grooves 3 are used as gaps between the rigid lower electrodes 6 of adjacent transducing units. The flexible upper electrode 1 , the rigid vibrating membrane 2 , the cavity 4 and the rigid lower electrode 6 have the same shape;

[0042] A...

Embodiment 2

[0062] figure 2 Shown is a schematic diagram of another rigid-flexible fusion capacitive flexible MEMS ultrasonic transducer of the present invention, which is the variable structure of the rigid-flexible capacitive flexible MEMS ultrasonic transducer in Embodiment 1, and the variable structure is the same as figure 1 The difference in the structure of the shown embodiment 1 is that there is no need to set the conductive layer 8, and the material of the flexible substrate 7 is directly replaced by flexible conductive materials such as ITO, PEDOT:PSS, so as to realize the electrical connection between adjacent lower electrodes 6 . In the preparation process, this embodiment is similar to Embodiment 1, except that in step (7), PI is directly spin-coated on the rigid lower electrode 6 to form a flexible substrate 7, and then the steps in Embodiment 1 are carried out (9)-step (11); this embodiment is the same as other steps in the preparation process of embodiment 1, and will no...

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Abstract

The invention discloses a rigid-flexible fused capacitive flexible MEMS ultrasonic transducer and a preparation method thereof. A vibration film and a lower electrode of the transducer are made of rigid materials; the base and the supporting columns are made of flexible materials. The vibration film and the lower electrode are provided with grooves in areas corresponding to the surface of the pillar, and penetrate through the thickness directions of the vibration film and the lower electrode. According to the MEMS ultrasonic transducer, high resonant frequency is ensured by utilizing the rigid vibration film, and flexible design of the frequency of the MEMS ultrasonic transducer is realized; the flexibility of the MEMS ultrasonic transducer is realized by utilizing the flexible substrate and the supporting column, and the problem that the sensor frequency and the flexible design are mutually restricted is solved; a two-stage series vibration system is formed by the flexible supporting columns and the rigid thin film, so that the output sound pressure and the receiving sensitivity are improved; the rigid lower electrode and the rigid vibration film are utilized to reduce the change of the opposite area between the upper electrode and the lower electrode in the vibration process, and the stability of the working frequency, the electromechanical coupling coefficient, the receiving/transmitting sensitivity and other performance is improved. The preparation of the miniaturized and high-density two-dimensional flexible ultrasonic transducer is realized by utilizing an MEMS (Micro Electro Mechanical System) process.

Description

technical field [0001] The present invention relates to flexible electronics, MEMS and ultrasonic transducer technologies, in particular to a flexible CMUTs with a hard film-soft substrate structure and a preparation method thereof, specifically a rigid-flexible capacitive flexible MEMS ultrasonic transducer and its preparation method. Background technique [0002] Ultrasonic technology is widely used in medical and health, industrial non-destructive testing, chemical production, military sonar and other fields due to its non-invasive, penetrating and biocompatibility properties. Ultrasonic transducers are used to transmit and receive ultrasonic waves. They are the basic components for the implementation of ultrasonic technology and play a decisive role in the performance of the entire ultrasonic system. Capacitive Micromachined Ultrasonic Transducers (CMUTs) are one of the important research directions of MEMS ultrasonic transducers, and they form MEMS ultrasonic transduce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/02B81B7/00B81C1/00
CPCB81B7/0045B81B7/02B81B7/007B81C1/00269B81B2201/02
Inventor 李支康吉田赵立波赵一鹤袁佳炜秦韶辉石璇李梓璇马琦蒋庄德
Owner XI AN JIAOTONG UNIV
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