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Epoxy resin copper-clad plate and preparation method thereof

A technology of epoxy resin and epoxy resin solution, used in epoxy resin glue, chemical instruments and methods, other household appliances, etc., can solve the problems of affecting the performance and quality of copper clad laminates, poor effect, lack of flame retardant performance, etc. , to achieve good flame retardancy, improve flame retardancy, heat resistance and working temperature promotion effect

Pending Publication Date: 2022-05-06
安徽鸿海新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process avoids the situation that thin copper is easily broken due to tension, and realizes the preparation of copper clad laminates with excellent thermal conductivity, and the copper foil is thinner during the preparation process, which can improve production efficiency and yield.” The copper clad laminates prepared by the above patent documents Although it has a certain effect of heat conduction, its effect is not good. At the same time, it lacks good flame retardancy, which affects the performance and quality of the prepared copper clad laminate.

Method used

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  • Epoxy resin copper-clad plate and preparation method thereof
  • Epoxy resin copper-clad plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Please refer to figure 1 As shown, an epoxy resin copper clad laminate includes a prepreg 10, both sides of the prepreg 10 are laminated with copper foil 20, and the prepreg 10 is made by intruding glass fiber cloth into modified epoxy resin glue and pretreatment in an oven.

[0043] Please refer to figure 2 Shown, the present invention also provides a kind of preparation method of epoxy resin copper clad laminate, comprises the following steps:

[0044] Step 1, prepare modified epoxy resin glue.

[0045] Prepare modified epoxy resin glue, comprise the following steps:

[0046] 101), adding the epoxy resin solution into the mixer, and adding thermally conductive fillers into the mixer, and stirring for 25 minutes under the condition that the rotation speed is 1100r / min.

[0047]102), add flame retardant, diaminodiphenyl sulfone and boron trifluoride triethylphosphine to the mixer in step 101), and stir for 20min under the condition of 1500r / min at a rotating speed, ...

Embodiment 2

[0059] An epoxy resin copper-clad laminate provided in this embodiment and its preparation method are roughly the same as in Embodiment 1, the main difference being:

[0060] In step 101), stirring for 27min under the condition that the rotating speed is 1150r / min;

[0061] In step 102), under the condition that the rotating speed is 1700r / min, stir for 25min to prepare modified epoxy resin glue;

[0062] In the preparation method of the epoxy resin solution: under the condition that the rotating speed is 900r / min, stir for 11min;

[0063] In the method of preparing the flame retardant: Stir at 85°C for 20 minutes to obtain a mixed solution, adjust the pH of the mixed solution to 5; polymerize at 77°C for 5 hours to obtain a polymer, mix the polymer with water and ethanol Washed 6 times, and then vacuum dried for 48 hours to obtain a flame retardant.

[0064] The emulsifier is fatty acid soap;

Embodiment 3

[0066] An epoxy resin copper-clad laminate provided in this embodiment and its preparation method are roughly the same as in Embodiment 1, the main difference being:

[0067] In step 101), stirring for 30min under the condition that the rotation speed is 1200r / min;

[0068] In step 102), under the condition that the rotating speed is 2000r / min, stir for 30min to prepare modified epoxy resin glue;

[0069] In the preparation method of the epoxy resin solution: under the condition that the rotating speed is 1000r / min, stir for 12min;

[0070] In the method of preparing the flame retardant: stir at 90°C for 20 minutes to obtain a mixed solution, adjust the pH value of the mixed solution to 5; polymerize at 80°C for 5 hours to obtain a polymer, mix the polymer with water and ethanol Washed 8 times, and then vacuum dried for 48 hours to obtain a flame retardant.

[0071] The emulsifier is sodium lauryl sulfate;

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Abstract

The invention relates to the technical field of copper-clad plates, in particular to an epoxy resin copper-clad plate and a preparation method thereof. Comprising a prepreg, copper foils are compounded on the two surfaces of the prepreg, and the prepreg is prepared by immersing glass fiber cloth into modified epoxy resin glue and performing pretreatment through a drying oven; the heat-conducting filler is added into the epoxy resin solution, the heat-conducting filler has excellent heat conductivity, the epoxy resin solution is modified after the heat-conducting filler is mixed into the epoxy resin solution, so that the epoxy resin solution has a heat-conducting function, and meanwhile, the flame retardant is prepared by preparing the polymer and forming a microporous capsule structure; the flame retardant is used as a material of the epoxy resin copper-clad plate, the heat resistance and the working temperature of the epoxy resin copper-clad plate are promoted, the flame retardance is further improved, the prepared epoxy resin copper-clad plate further has good flame retardance, and the quality of the prepared epoxy resin copper-clad plate is effectively improved.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates, in particular to an epoxy resin copper clad laminate and a preparation method thereof. Background technique [0002] With the continuous development of science and technology, people's living standards are gradually improving, and the demand for electronic products is gradually increasing. At the same time, it can also be found that the replacement of electronic products is getting faster and faster. Without the development of the electronics industry, the application of electronic products will become more and more extensive, and the electronic information industry has gradually entered a golden age of rapid development. As the basis of printed circuit boards and electronic products, copper clad laminates will also maintain rapid development. [0003] In the patent document with the Chinese patent application number CN202110774947.8, "A Thermally Conductive Double-sided Copper Cla...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/02
CPCB32B5/02B32B15/20B32B15/14B32B7/12B32B37/1284B32B38/164B32B37/06B32B37/10C09J163/00C09J11/04C09J11/06C09J11/08C09J7/21H05K1/0366H05K1/036H05K3/00B32B2250/40B32B2262/101B32B2307/3065B32B2457/08C08K2003/385C08K2003/222C08K2003/2227C08L33/12C08K3/38C08K3/22C08K5/5399C08K13/02
Inventor 苏晓渭苏汉森李勇军
Owner 安徽鸿海新材料股份有限公司
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