Method for enhancing interface heat transfer between metal material and organic material

A technology of metal materials and organic materials, which can be used in metal material coating processes, chemical instruments and methods, heat exchange materials, etc., and can solve the problems of limited effect of interface strengthening heat transfer.

Pending Publication Date: 2022-05-24
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method only starts from the perspective of phonons, and the main heat carriers inside the metal are electrons, so the effect on enhancing heat transfer at the interface is limited.

Method used

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  • Method for enhancing interface heat transfer between metal material and organic material
  • Method for enhancing interface heat transfer between metal material and organic material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] like figure 1 As shown, a sandwich structure material is provided, which is in the form of a flat plate, including a metal material 1, an electro-acoustic coupling material 2 and an organic material 3; the electro-acoustic coupling material 2 is in the middle of the metal material 1 and the organic material 3. .

[0043] Wherein, the electro-acoustic coupling material 3 is liquid metal gallium.

[0044] The metal material 1 can be pure metals such as copper, iron, nickel and their alloys;

[0045] The organic material 3 can be high molecular polymer, silicone oil, etc.;

[0046] The metal material 1 is connected with the electro-acoustic coupling material 2 by metal bonds or van der Waals force; specifically, the metal material 1 can be immersed in the electro-acoustic coupling material 2 and then placed in a high-temperature furnace for 10 minutes, so that the two A metal bond is formed at the interface of the metal material 1; the electro-acoustic coupling material...

Embodiment 2

[0050] like figure 2 As shown, the metallic material is dispersed in the organic material matrix, including metallic material 1 , electro-acoustic coupling material 2 and organic material 3 . In this embodiment, the electro-acoustic coupling material 2 is first attached to the surface of the metal material 1 , and then the metal material 1 is dispersed in the organic material 3 . The material selection and connection method are the same as those in the first embodiment.

Embodiment 3

[0052] 1. Preparation of copper powder / gallium indium / polydimethylsiloxane composites

[0053] First, immerse 20g copper powder (800 mesh) in 30mL, 1mol / L hydrochloric acid for 10 minutes at room temperature to remove the surface oxide layer; then, pour 110g gallium indium alloy into the solution and stir at room temperature for 10 minutes to make A layer of liquid metal was plated on the surface of the copper powder; then the mixture of liquid metal and copper powder was taken out and dried to completely remove the moisture; the dried mixture was added to 21 g of polydimethylsiloxane, stirred thoroughly for 10 minutes, and placed After evacuating in a vacuum drying oven for 30 minutes, it was heated at 120° C. for 2 hours for curing.

[0054] 2. Preparation of copper powder / polydimethylsiloxane composites

[0055] At room temperature, soak 89g copper powder (800 mesh) in 50mL, 1mol / L hydrochloric acid for 10 minutes to remove the surface oxide layer; then take out the copper...

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Abstract

The invention discloses a method for enhancing heat transfer of an interface between a metal material and an organic material, and belongs to the field of enhanced heat transfer. According to the method, an electro-acoustic coupling material is used at a metal/organic interface and serves as a bridge for connecting electron and phonon heat conduction, electron heat conduction is mainly used between a metal material and the electro-acoustic coupling material, phonon heat conduction is mainly used between an organic material and the electro-acoustic coupling material, electron-phonon interface heat transport is enhanced, and the thermal conductivity of the electro-acoustic coupling material is improved. And metal/organic interface enhanced heat transfer is realized. The method disclosed by the invention is beneficial to enhancing the heat transfer performance of the metal/organic interface and improving the performance of a thermal interface material, a nanofluid and a solid-liquid phase change material.

Description

technical field [0001] The invention relates to the field of strengthening heat transfer, in particular to a method for strengthening the interface heat transfer between a metal material and an organic material. Background technique [0002] Heat transfer at metal / organic interfaces is widely used in the fields of energy generation, transformation and transmission. Thermal interface materials are based on organic materials, and their thermal conductivity is increased by adding high thermal conductivity fillers to fill gaps, and metal micro-nano particles are one of the commonly used high thermal conductivity fillers. A large number of interfaces are formed between metal micro-nano particles and organic materials, resulting in the limitation that a large number of metal particles are doped and the thermal conductivity of thermal interface materials is limited. Nanofluid is the addition of high thermal conductivity particles to organic liquids such as water or oil to increase...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14C23C26/00C23C30/00
CPCC09K5/14C23C30/00C23C26/00Y02E60/14
Inventor 张旭东曹炳阳
Owner TSINGHUA UNIV
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