Aluminum-based phase change heat storage alloy composite material and preparation method thereof

Abstract

The invention relates to an aluminum-based phase change heat storage alloy composite material and a preparation method thereof. The composite material is formed by compounding an aluminum alloy and a phase change heat storage alloy, and the aluminum alloy serves as a continuous base body and has the functions of a structural material and a packaging material and the function of a heat conduction channel; the bismuth-based alloy is in a discontinuous particle shape and has a heat storage function. The composite material comprises the following components in percentage by volume: 40-70% of aluminum alloy and 30-60% of bismuth-based phase change heat storage alloy, and the outer layer of the composite material is integrally coated with an aluminum alloy layer. According to the aluminum-based phase change heat storage alloy composite material disclosed by the invention, the design of integrating a structural function and a heat storage function is realized, the aluminum-based phase change heat storage alloy composite material is particularly suitable for a heat dissipation occasion with relatively high limitation on a packaging space, the thermal response rate is high, and the heat dissipation efficiency is high. The requirement for space is small, and overall design of equipment is facilitated.

Description

technical field [0001] The invention relates to an aluminum-based phase-change heat storage alloy composite material and a preparation method thereof, belonging to the technical field of phase-change heat storage materials. Background technique [0002] The heat dissipation problem of electronic equipment has become the main technical bottleneck restricting its development. Statistics show that the failure rate of electronic devices will double for every 10 °C increase in temperature of electronic devices, and the failure rate will increase for every 25 °C increase in temperature. 10 times. 55% of the failures of electronic devices are caused by temperature, so the problem of heat dissipation of high-power electronic devices needs to be solved urgently. At present, the main idea to solve the heat dissipation of electronic equipment is to quickly conduct heat away from the heat source, which mainly relies on heat sink materials with high thermal conductivity and low expansio...

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Problems solved by technology

[0002]The heat dissipation problem of electronic equipment has become the main technical bottleneck restricting its development. Statistics show that the failure rate of electronic equipment will increase every time the temperature of electronic equipment rises by 10°C 1 times, the failure rate will increase by 10 times for every 25°C increase in temperature

55% of electronic device failures are caused by temperature, so the heat dissipation problem of high-power electronic equipment needs to be solved urgently

In actual use, any phase-change heat storage material cannot simultaneously act as a structural material, because the phase-change material will change from a solid state to a liquid state when storing heat, thus losing its basic strength

Therefore, the phase change material needs to be packaged as a whole and attached to the structural material, which not only increases the complexity of the device, but also occupies the packaging space

Moreover, because the thermal conductivity of heat storage alloys is often not high, the overall package also limits the thermal response rate of heat storage alloys.

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