Semiconductor packaging structure

Abstract

The invention relates to the technical field of packaging structures, and provides a semiconductor packaging structure which further improves the heat dissipation effect, is good in heat dissipation uniformity, can well prevent the local temperature of a packaged semiconductor from being too high, is high in coating structure strength of die casting epoxy resin, and comprises a substrate, a chip, a heat conduction outer plate and a plurality of heat conduction side plates. The substrate is provided with a plurality of via holes, the substrate is provided with a large number of solder balls, the top end of the substrate is provided with an isolation layer, the chip is arranged on the isolation layer, the substrate is provided with a plurality of contacts, the contacts are electrically connected with the chip through internal wires, the substrate is provided with die casting epoxy resin, and the chip is packaged in the die casting epoxy resin. The heat-conducting outer plate is arranged on the die casting epoxy resin, a plurality of transverse heat-conducting transmission plates and a plurality of vertical heat-conducting transmission plates are arranged between the heat-conducting outer plate and the chip, a plurality of heat-conducting side plates are respectively arranged at the front end, the rear end, the left end and the right end of the die casting epoxy resin, and side heat-conducting transmission plates are arranged between the heat-conducting side plates and the chip.

Description

technical field [0001] The invention relates to the technical field of packaging structures, in particular to a semiconductor packaging structure. Background technique [0002] As we all know, a semiconductor refers to a material whose electrical conductivity is between conductors and insulators at room temperature. Most of the current electronic products, such as computers, mobile phones or the core units of digital recorders, are closely related to semiconductors. Due to the large number of semiconductors As electronic components are used in equipment, the importance of semiconductors is very huge from the perspective of technology or economic development. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is more Among the various semiconductor materials, the most influential one in commercial applications, in practical application, most of them will be processed with a semiconductor packaging structure, which not only protects ...

AI Technical Summary

Problems solved by technology

[0003] After retrieval, the Chinese patent published on August 31, 2016 with the publication number CN205542742U discloses a semiconductor packaging mechanism with anti-scratch and high heat dissipation functions, which is roughly described as, including a substrate with multiple The penetrating holes and a packaging layer are located above the substrate. A chip accommodating space is formed in the packaging layer for accommodating multiple chips arranged in multiple groups. Multiple pins are stretched out around each chip to Extending out of the packaging layer, the plurality of pins of the packaging layer pass through the corresponding holes on the substrate, and a plurality of contacts are formed on the other side of the substrate, so that external signals can be input to the plurality of chips. A cover plate is located on Above the encapsulation layer, it is used to cover the encapsulation layer, and a polymer coating is a layer formed by coating organic or inorganic polymer materials on the top of the cover plate, and is tightly attached to the cover plate Above, to form a high degree of protection for the cover, the polymer coating has the effect of heat dissipation and anti-scratch, and provides a high degree of toughness for the entire semiconductor packaging mechanism, so that it will not be easily broken when it is hit by an external force. It is in use At the same time, although it can assist in realizing the interactive heat dissipation of internal and external temperatures to a certain extent, the thermal conductivity between layers of cladding still needs to be improved.

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