Chemical polishing solution for rapid polishing and preparation method thereof

Abstract

The invention relates to the technical field of chemical machinery, and particularly discloses a chemical polishing solution for rapid polishing and a preparation method thereof.The chemical polishing solution is mainly composed of, by weight, 15%-45% of grinding materials, 0.3%-1.2% of oxidizing agents, 1%-3% of pH regulators, 0.3%-1.8% of chelating agents, 0.4%-1.6% of surfactants and the balance deionized water; wherein the grinding material is a mixture obtained by mixing SiO2 hydrosol, KCl and hydroxyethyl methylacrylate according to the mass ratio of (8-12): (2-5): 1; the grinding material, the oxidizing agent, the pH regulator, the chelating agent and the surfactant cooperate with one another to jointly influence the surface quality of the polished germanium wafer, the prepared polishing solution with high performance can remove polishing damage on the surface of the germanium wafer, and the surface of the germanium wafer is flat.

Description

technical field [0001] The present application relates to the technical field of chemical mechanics, and more specifically relates to a fast polishing chemical polishing liquid and a preparation method thereof. Background technique [0002] A solar cell is a photoelectric semiconductor sheet that converts light energy into electrical energy. According to different materials, it can be divided into silicon solar cells, polymer multilayer modified electrode solar cells, nanocrystalline solar cells, plastic solar cells, etc. Compared with silicon For solar cells, germanium single crystals have the advantages of high mechanical strength, good structural integrity, low price, and easy access to large-scale single crystals with complete structures, so they are widely used. [0003] Germanium is an important indirect transition semiconductor material, which has high hole mobility and electron mobility, and is widely used in the aerospace field. During the preparation of germanium ...

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Problems solved by technology

[0006] In order to improve the problem of poor surface roughness of germanium wafers, the first purpose of the application is to provide a chemical polishing solution for fast polishing

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