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Polyimide film for graphite flake, preparation method thereof, and graphite flake prepared therefrom

A technology of polyimide film and graphite sheet, applied in the field of graphite sheet and polyimide film, can solve the problems of increasing manufacturing cost and high power consumption, and achieve the effect of good thermal conductivity and reducing manufacturing cost.

Pending Publication Date: 2022-06-21
PI ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Fabrication of graphite sheets by graphitization of polyimide films typically requires high temperatures of 2,800°C or higher, which results in high power consumption and thus increased manufacturing costs

Method used

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  • Polyimide film for graphite flake, preparation method thereof, and graphite flake prepared therefrom
  • Polyimide film for graphite flake, preparation method thereof, and graphite flake prepared therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] First, 50 g of pyromellitic anhydride as a dianhydride monomer, 50 g of 4,4'-diaminodiphenyl ether as a diamine monomer, 1 g of boron nitride (3M company) as a metal compound, and 300 g as an organic solvent The dimethylformamides are mixed together and then polymerized to prepare a polyamic acid solution.

[0074] After that, 100 g of the prepared polyamic acid solution was mixed with 20 g of acetic anhydride as a dehydrating agent, 3 g of β-picoline as an imidizing agent, and 15 g of dimethylformamide, thereby preparing a solution having a final viscosity of 300,000 cP Polyimide precursor composition.

[0075] After that, the prepared polyimide precursor composition was cast to a thickness of 80 μm on a SUS plate (100SA, Sandvik Co., Ltd.) using a doctor blade, and then dried at 100° C. for 5 minutes, thereby forming a gel film. Next, the gel film was separated from the SUS plate, then heat-treated at 300° C. for 5 minutes, and then heat-treated at 500° C. for 5 minu...

Embodiment 2 to 5 and comparative example 1

[0077] A polyimide film was produced in the same manner as in Example 1 except that the amount of the metal compound was changed as listed in Table 1.

[0078] Evaluation example: Measurement of thermal conductivity of graphite sheets (unit: W / m·K)

[0079] Each of the polyimide films produced in Examples and Comparative Examples was heated to 1,000° C. under nitrogen using an electric furnace at a heating rate of 1° C. / min, and then maintained at the temperature for 3 hours to carbonize the polyimide films. Next, the carbonized polyimide film was heated to the temperature shown in Table 1 at a heating rate of 20°C / min under argon, and then the temperature was maintained for 3 hours to graphitize the polyimide film, thereby producing graphite piece.

[0080] Then, the in-plane thermal diffusivity of the fabricated graphite sheets was measured by a laser flash method using a thermal diffusivity tester (LFA 467, Netzsch Co.), and then the measured value of the in-plane therma...

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Abstract

Disclosed herein are a polyimide film for a graphite sheet, a method of manufacturing the same, and a graphite sheet manufactured using the same. The polyimide film is prepared by imidizing a polyamic acid formed by a reaction between a dianhydride monomer and a diamine monomer, in which the reaction is performed in the presence of a metal compound, and the polyamic acid forms a chelate with a metal ion.

Description

technical field [0001] The present invention relates to a polyimide film for a graphite sheet, a manufacturing method thereof, and a graphite sheet manufactured using the same. More particularly, the present invention relates to a polyimide film for graphite sheets that can provide good thermal conductivity while reducing manufacturing costs, a method for manufacturing the same, and a graphite sheet manufactured using the same. Background technique [0002] Recently, with the reduction in weight, size, and thickness, and the increase in the degree of integration, electronic devices suffer from increased heat generation. The heat generated in electronic equipment can lead to failure, malfunction and shortened life of electronic equipment. Therefore, thermal management of electronic equipment is becoming an important issue. [0003] Graphite sheets have higher thermal conductivity than metal sheets such as copper and aluminum, and are attracting attention as heat-dissipating...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08G73/10C08K3/38C04B35/524C04B35/622
CPCC04B35/622C04B35/524C08K3/38C08J5/18C08J2379/08C01B32/205C08G73/1071C08G73/105C08G73/1003C08G73/1021C04B35/62218C08G73/1067C08G73/1042C04B2235/48C04B2235/9607C08K2003/385C01P2006/32C08G73/1032
Inventor 郑炯燮元东荣
Owner PI ADVANCED MATERIALS CO LTD