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Integrally-formed inductor and preparation method thereof

An inductance and integrated technology, applied in the direction of transformer/inductor coil/winding/connection, coil manufacturing, etc., can solve the problems of increasing cost, sacrificing the magnetic characteristics of integrated inductance, and reducing the density of inductance in one-piece molding, so as to ensure stable storage performance, avoiding the decline of magnetic properties, and improving the effect of cracking

Pending Publication Date: 2022-06-24
KUNSHAN CITONG NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the above two methods will not only increase the cost, but also the medium-temperature curing agent is prone to partial cross-linking, resulting in a decrease in the inductance density of the integral molding in the subsequent pressing process, thus sacrificing the magnetic properties of the integral molding inductor

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  • Integrally-formed inductor and preparation method thereof
  • Integrally-formed inductor and preparation method thereof
  • Integrally-formed inductor and preparation method thereof

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preparation example Construction

[0034] In one aspect of the present invention, a method for preparing an integrally formed inductor is provided, comprising the following steps:

[0035] After the coil is embedded in the soft magnetic composite material and pressed into shape, it is baked and cured; the temperature of baking and curing is at least divided into 3 temperature gradients below 80°C for staged baking and curing, and the holding time of each temperature gradient is ≥0.5 h.

[0036] In the low temperature stage of baking and curing (below 80°C), the monolithic inductors are baked and cured in stages by using multiple gradient heating modes, so that the adhesive in the monolithic inductors can be fully cross-linked and cured, so that the monolithic inductor can be integrated. Molded inductors provide higher strength and improved cracking.

[0037] In some embodiments, the temperature for baking and curing below 80° C. may be divided into at least three temperature gradients for baking and curing, an...

Embodiment 1

[0056] According to mass parts, 100 parts of FeSiCr-C soft magnetic alloy powder and 3.5 parts of resin binder J1 were taken respectively to prepare a soft magnetic composite material. Then at room temperature, powder metallurgy process is used to make soft magnetic composite material into one-piece inductor with model type 0630-100. Then according to figure 1 The curing curve shown is for baking and curing each type of 0630-100 one-piece integrated inductor. Depend on figure 1 It can be seen that the curing process in the low temperature curing stage (25 °C ~ 80 °C) is: 1) at 25 °C, at a heating rate of 2.5 °C / min to 50 °C, and keep it for 30 minutes; 2) at a temperature of 1 °C / min The temperature was raised to 60°C at a rate and kept for 30 minutes; 3) the temperature was raised to 80°C at a heating rate of 2°C / min, and the temperature was kept for 40 minutes. The DSC curing curve of cured resin adhesive J1 is as follows figure 2 shown. Depend on figure 2 It was fou...

Embodiment 2

[0058] According to mass parts, 100 parts of RTE carbonyl iron powder and 3.5 parts of resin binder J2 were taken respectively to prepare a soft magnetic composite material. Then at room temperature, powder metallurgy process is used to make soft magnetic composite material into one-piece inductor with model type 0630-100. Then according to image 3 The curing curve shown is for baking and curing each type of 0630-100 one-piece integrated inductor. Depend on image 3 It can be seen that the curing process in the low temperature curing stage (25 °C ~ 80 °C) is: 1) at 25 °C, at a heating rate of 2.5 °C / min to 50 °C, and keep it for 30 minutes; 2) at a temperature of 1 °C / min The rate was heated to 60°C and kept for 30min;

[0059] 3) The temperature was raised to 80°C at a heating rate of 2°C / min, and the temperature was maintained for 40 minutes. The DSC curing curve of cured resin adhesive J2 is as follows Figure 4 shown. Depend on Figure 4 It was found that the initi...

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Abstract

The invention relates to the technical field of integrally-formed inductor preparation, in particular to an integrally-formed inductor and a preparation method thereof. The preparation method of the integrally formed inductor comprises the following steps: embedding the coil in the soft magnetic composite material, carrying out compression molding, and then carrying out baking and curing; the baking and curing temperature is below 80 DEG C and is divided into at least three temperature gradients for staged baking and curing, and the heat preservation time of each temperature gradient is larger than or equal to 0.5 h. According to the preparation process, the low-temperature curing stage (below 80 DEG C) is set to be multi-gradient curing, and the heat preservation time and the heating rate are adjusted, so that the adhesive can be more sufficiently crosslinked and cured, higher strength is provided for the integrally-formed inductor, and the cracking phenomenon of the integrally-formed inductor is improved.

Description

technical field [0001] The present invention relates to the technical field of manufacturing of integrally formed inductors, and in particular, to an integrally formed inductor and a manufacturing method thereof. Background technique [0002] Integrated inductors are more and more widely used due to their advantages of miniaturization, strong anti-electromagnetic interference performance, low noise, and high frequency. The so-called one-piece inductor is mainly composed of metal soft magnetic composite material and metal copper coil. Usually, the coil winding is embedded in the metal soft magnetic powder by powder metallurgy process, and then the adhesive is cured by baking. Among them, the metal soft magnetic composite material is composed of soft magnetic powder and binder. The binder contributes to blocking the eddy current transfer between the powders and reducing the loss. At the same time, it can also ensure the bonding force between the soft magnetic powders after the...

Claims

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Application Information

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IPC IPC(8): H01F41/04H01F27/28
CPCH01F41/04H01F27/28Y02P10/25
Inventor 吕先松郭峰汪贤周志雷
Owner KUNSHAN CITONG NEW MATERIAL TECH CO LTD
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