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Positive photosensitive resin composition and cured film prepared therefrom

A technology of photosensitive resin and composition, which is applied in the direction of photomechanical equipment, optics, photoplate making process of pattern surface, etc., can solve the problem of unimproved sensitivity, and achieve the effects of improving sensitivity, promoting penetration, and increasing inhibition efficiency

Pending Publication Date: 2022-07-01
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the sensitivity has not improved to a satisfactory level

Method used

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  • Positive photosensitive resin composition and cured film prepared therefrom
  • Positive photosensitive resin composition and cured film prepared therefrom
  • Positive photosensitive resin composition and cured film prepared therefrom

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0147] Preparation Example 1: Acrylic Copolymers (A-1 to A-6)

[0148] A flask equipped with a cooling pipe and a stirrer was charged with 200 parts by weight of propylene glycol monomethyl ether acetate (PGMEA) as a solvent, and the temperature of the solvent was raised to 60°C while the solvent was slowly stirred. Next, 9.91 parts by weight of styrene, 4.51 parts by weight of glycidyl methacrylate, 16.38 parts by weight of methacrylic acid, and 69.21 parts by weight of dicyclopentyl methacrylate were added thereto, followed by step by step over 5 hours. 3 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile) as a radical polymerization initiator was added dropwise to carry out a polymerization reaction for 3 hours while maintaining the temperature. As a result, an acrylic copolymer (A-1) having a solid content of 23.50% by weight and a weight average molecular weight of about 9,000 to 11,000 was obtained. In addition, acrylic copolymers (A-2 to A-6) were prepared in the...

preparation example 2

[0149] Preparation Example 2: Acrylic Copolymers (A-7 to A-10)

[0150] A flask equipped with a cooling pipe and a stirrer was charged with 200 parts by weight of PGMEA as a solvent, and the temperature of the solvent was raised to 70°C while the solvent was slowly stirred. Next, 19.76 parts by weight of styrene, 28.50 parts by weight of methyl methacrylate, 26.97 parts by weight of glycidyl methacrylate, 11.70 parts by weight of methacrylic acid, and 13.07 parts by weight of methyl acrylate were added thereto, Subsequently, 3 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile) as a radical polymerization initiator was added dropwise over 5 hours to perform polymerization. As a result, an acrylic copolymer (A-7) having a solid content of 33.00% by weight and a weight average molecular weight of about 9,000 to 11,000 was obtained. In addition, acrylic copolymers (A-8 to A-10) were prepared in the same manner according to the monomer compositions shown in Table 1 below. ...

preparation example 3

[0151] Preparation Example 3: Siloxane Copolymer (B-1)

[0152] A reactor equipped with a reflux condenser was charged with 20 parts by weight of phenyltrimethoxysilane, 30 parts by weight of methyltrimethoxysilane, 20 parts by weight of tetraethoxysilane, 15 parts by weight of deionized water, and 15 parts by weight of PGME. After this time, the mixture was stirred at reflux in the presence of 50 ppm of phosphoric acid catalyst for 6 hours, cooled, and then diluted with PGMEA. As a result, a siloxane copolymer having a solids content of 30% by weight and a weight average molecular weight of about 6,000 to 11,000 was obtained.

[0153] The alkali dissolution rate (ADR) of the siloxane copolymers was measured and shown in Table 2 below. Specifically, the siloxane copolymer was diluted with PGMEA to a concentration of 17% by weight solids and cured at 105°C for 90 seconds to form a thickness of coating film. Then, the dissolution rate / sec was measured using a 1.5 wt% aqueou...

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Abstract

The present invention relates to a positive photosensitive resin composition and a cured film prepared therefrom. The positive photosensitive resin composition in which an acrylic copolymer and a siloxane copolymer are used together while introducing a large volume monomer into the acrylic copolymer, promoting permeation of a developer, and while increasing inhibition efficiency of an acid group to produce an effect of improving sensitivity.

Description

technical field [0001] The present invention relates to a positive photosensitive resin composition and a cured film prepared therefrom. More particularly, the present invention relates to a positive-type photosensitive resin composition that provides excellent sensitivity, and a cured film prepared therefrom for use in liquid crystal displays, organic EL displays, and the like. Background technique [0002] In thin film transistor (TFT) type display devices such as liquid crystal display devices, inorganic protective films made of, for example, silicon nitride have been used as protective films for protecting and insulating TFT circuits. However, since such an inorganic protective film has a problem that it is difficult to enhance the aperture ratio due to its high dielectric constant, the demand for an organic insulating film having a low dielectric constant has been increasing. [0003] Typically, a photosensitive resin, which is a polymer compound that reacts chemically...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/039H05K1/02
CPCG03F7/039H05K1/02C08F220/1806G03F7/0757G03F7/0233G03F7/0226C09D133/06C08F220/14C08F220/1811C08F220/325G03F7/022C08L33/08C08L33/10C08L33/14C08L83/04C08K5/315C08K5/1515
Inventor 李垠泳郑周永任珍奎
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC