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Preparation method of POSS-CuPc-SiO2 modified epoxy resin composite material

A technology of poss-cupc-sio2 and epoxy resin, which is applied in the field of preparation of POSS-CuPc-SiO2 modified epoxy resin composite materials, can solve the problems of high dielectric loss, poor filler compatibility, and high filler concentration.

Pending Publication Date: 2022-07-29
陈全辉
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The rapid development of the electronics industry relies heavily on the development of dielectric materials, and traditional dielectric materials still have problems such as low dielectric constant, high dielectric loss and low energy storage density, which can no longer meet the needs of electronics. Requirements for device miniaturization, integration, flexibility and high performance
[0003] Among the two types of high-dielectric composite materials that are mainly studied at present: conductive nanoparticles / polymer composites still have problems such as high dielectric loss, low percolation threshold, and extremely poor breakdown strength; ceramic nanoparticles / polymer composites The material also has problems such as excessive filler concentration, poor filler compatibility, and poor mechanical properties of composite materials.
These problems have severely limited their practical application in dielectric materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A POSS-CuPc-SiO 2 The preparation method of the modified epoxy resin composite material comprises the following steps:

[0034] Step S1, polydopamine-silicon dioxide (PDA-SiO 2 ) synthesis of hybrid monomers:

[0035] 20g of SiO with an average particle size of 1um 2 The particles were dispersed in 150 mL of a 10 mM Tris-HCl aqueous solution, adjusted to pH=8.5, sonicated for 1 h in an ice bath, 10 g of dopamine hydrochloride was added, sonicated for 1 h, centrifuged, and dispersed with ethanol to obtain PDA-TiO 2 hybrid monomer;

[0036] Step S2, polyaminated CuPc-SiO 2 Synthesis of Hybrid Dielectric Monomers:

[0037] 10g PDA-SiO 2 Hybrid monomer and 18 g amino copper phthalocyanine (NH 2 -CuPc) was added to 100 mL of Tris-HCl solution with a concentration of 10 mmol, adjusted pH=8.5, controlled the reaction temperature to 35 °C, and stirred the reaction at 300 r / min for 24 h to obtain polyaminated CuPc-SiO 2 Hybrid dielectric monomer;

[0038] Step S3, POSS-...

Embodiment 2

[0043] A POSS-CuPc-SiO 2 The preparation method of modified epoxy resin composite material comprises the following steps:

[0044] Step S1, polydopamine-silicon dioxide (PDA-SiO 2 ) the synthesis of hybrid monomer: its synthesis method is shown in embodiment 1;

[0045] Step S2, polyaminated CuPc-SiO 2 Synthesis of Hybrid Dielectric Monomers:

[0046] 5g PDA-SiO 2 Hybrid monomer and 10 g amino copper phthalocyanine (NH 2 -CuPc) was added to 100 mL of Tris-HCl solution with a concentration of 10 mmol, adjusted pH=8, controlled the reaction temperature to 30 °C, and stirred the reaction at 300 r / min for 30 h to obtain polyaminated CuPc-SiO 2 Hybrid dielectric monomer;

[0047] Step S3, POSS-CuPc-SiO 2 Synthesis of Hybrid Dielectric Monomers:

[0048] 4 g of polyaminated CuPc-SiO 2 Hybrid dielectric monomer and 15g of monofunctional 3-chloropropyl POSS were added into a three-necked flask with magnetic stirring, and at the same time, 0.2g of silica gel with an average pa...

Embodiment 3

[0052] A POSS-CuPc-SiO 2 The preparation method of modified epoxy resin composite material comprises the following steps:

[0053] Step S1, polydopamine-silicon dioxide (PDA-SiO 2 ) the synthesis of hybrid monomer: its synthesis method is shown in embodiment 1;

[0054] Step S2, polyaminated CuPc-SiO 2 Synthesis of Hybrid Dielectric Monomers:

[0055] 20g PDA-SiO 2 Hybrid monomer and 35 g amino copper phthalocyanine (NH 2 -CuPc) was added to 100 mL of Tris-HCl solution with a concentration of 10 mmol, adjusted pH=9, controlled the reaction temperature to 40 °C, and stirred the reaction at 300 r / min for 18 h to obtain polyaminated CuPc-SiO 2 Hybrid dielectric monomer;

[0056] Step S3, POSS-CuPc-SiO 2 Synthesis of Hybrid Dielectric Monomers:

[0057] 15 g of polyaminated CuPc-SiO 2 Hybrid dielectric monomer and 40g of monofunctional 3-chloropropyl POSS were added into a three-necked flask with magnetic stirring, and 2g of silica gel with an average particle size of 80u...

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Abstract

The invention relates to the technical field of EP dielectric material synthesis, and discloses a preparation method of a POSS-CuPc-SiO2 modified epoxy resin composite material, which comprises the following steps: carrying out Michael addition reaction on a phenyl functional group of a PDA-SiO2 hybrid monomer and an amino functional group of amino copper phthalocyanine (NH2-CuPc) to obtain a polyaminated CuPc-SiO2 hybrid dielectric monomer; the preparation method comprises the following steps: carrying out substitution reaction on an amino functional group of a multi-aminated CuPc-SiO2 hybrid dielectric monomer and a chlorine functional group of a monofunctional group 3-chloropropyl POSS to obtain a POSS-CuPc-SiO2 hybrid dielectric monomer; a POSS-CuPc-SiO2 hybrid dielectric monomer is used as a filler, E51 epoxy resin is used as a polymer matrix, and the POSS-CuPc-SiO2 modified epoxy resin composite material with high dielectric constant and low dielectric loss is prepared.

Description

technical field [0001] The invention relates to the technical field of EP dielectric material synthesis, in particular to a POSS-CuPc-SiO 2 Preparation method of modified epoxy resin composite material. Background technique [0002] The fast-developing electronics industry relies heavily on the development of dielectric materials, and traditional dielectric materials still have problems such as low dielectric constant, high dielectric loss, and low energy storage density, which can no longer satisfy electronic Device miniaturization, integration, flexibility and high performance requirements. [0003] Two types of high-dielectric composite materials are mainly studied at present: conductive nanoparticles / polymer composites still have problems such as excessive dielectric loss, small percolation threshold and extremely poor breakdown strength; ceramic nanoparticles / polymer composites The materials also have problems such as excessive filler concentration, poor filler compat...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08L83/04C08K9/10C08K3/36C08K5/00
CPCC08L63/00C08L83/04C08K9/10C08K3/36C08K5/0091
Inventor 陈全辉
Owner 陈全辉
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