Preparation process of anti-curling polyimide thin film

Abstract

The invention relates to the technical field of preparation of polyimide thin films, in particular to a preparation process of an anti-curling polyimide thin film. The preparation process comprises the following steps: preparation of calcium molybdate nanopowder, preparation of modified nanopowder, synthesis of polymer resin, resin regulation and film formation. The surfaces of calcium molybdate nanoparticles are modified through KH550, the nanoparticles are prevented from being agglomerated in the polymer resin through volume steric hindrance of a long chain organic part, meanwhile, the compatibility between inorganic nanoparticle calcium molybdate and an organic polymer is also improved, and thus the nanoparticles are more evenly dispersed in a polyimide substrate; and a continuous and complete three-dimensional network is formed in the KH550-CaMoO4 nanoparticle polyimide substrate, thus the rigidity of polymer molecular chains is enhanced, acting force between the molecular chains is enhanced, energy needed for bending and cracking of the polymer molecular chains at the high temperature is increased, and the prepared thin film is good in anti-curling performance.

Description

technical field [0001] The invention relates to the technical field of polyimide film preparation, in particular to a preparation process of an anti-curling polyimide film. Background technique [0002] Microelectronics technology is the foundation of the development of the information society and one of the symbols to measure the level of national science and technology and industrial development. The development of modern microelectronics industry puts forward higher and higher performance requirements for the materials used. As a high-performance polymer, polyimide is widely used because of its high thermal stability, excellent mechanical properties, good chemical resistance and electrical insulation, and low dielectric constant. Therefore, polyimide is widely used in aerospace, nuclear power, microelectronics and other industries, such as interlayer insulation materials for multilayer wiring, semiconductor integrated circuit packaging, buffer coating layers, α-particle s...

AI Technical Summary

Problems solved by technology

[0003] Conventional polyimide film is used in the insulation industry and basically meets the requirements for use, but if it is used in the flexible circuit or battery industry, it must be used for heating operations such as glue coating and soldering. As the temperature rises, the shape changes and the problem of curling and warping occurs, which affects the smooth progress of subsequent workpiece-to-hole installation or welding and bonding operations. Workpiece deformation, alignment deviation, or splicing light leakage often occur. In severe cases, batch scrapping or rework is required. Not only affects the construction schedule but also greatly increases the production cost