A kind of polyimide high temperature dielectric composite film and preparation method thereof

A polyimide and composite film technology, which is applied in the field of polyimide high-temperature dielectric composite film and its preparation, can solve the problems of insufficient high-temperature dielectric properties, and achieve excellent mechanical properties, good flexibility, and good heat dissipation. The effect of properties and dielectric properties on

Active Publication Date: 2021-01-19
WUHAN UNIV OF TECH
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to solve the problem that the high-temperature dielectric properties of existing polyimide film materials are not good enough, and to provide a polyimide composite film filled with molybdenum disulfide nanosheets and hexagonal boron nitride nanosheets. material, the film material has excellent flexibility, high temperature dielectric properties and thermal stability

Method used

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  • A kind of polyimide high temperature dielectric composite film and preparation method thereof
  • A kind of polyimide high temperature dielectric composite film and preparation method thereof
  • A kind of polyimide high temperature dielectric composite film and preparation method thereof

Examples

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Effect test

Embodiment 1

[0033] Preparation of hexagonal boron nitride nanosheets / polyimide binary composite film

[0034] 1) Weigh h-BN and urea in a mass ratio of 1:100, disperse them in 100 mL of water and stir evenly. The resulting mixture was sonicated in a sonicator for 8 hours and then centrifuged at 3000 rpm for 20 min. The supernatant was filtered with a 220 nm membrane, and the obtained solid matter was uniformly dispersed with deionized water and filtered again. After three times of dispersion (water dispersion) and filtration (same filter membrane), the few layers of BNNS on the filter paper were collected and dried in vacuum at 70°C for 8h.

[0035] 2) according to the mol ratio of PMDA: ODA is 1.002: 1 to feed, dissolve 10mmol ODA in NMP solvent, stir to weigh 10.02mmol PMDA after ODA is completely dissolved, add it in batches containing ODA within 30min. -In the four-necked flask of the NMP mixed solution, then place the four-necked flask in an ice-water bath device to ensure a low te...

Embodiment 2

[0039] Preparation of molybdenum disulfide nanosheets / hexagonal boron nitride nanosheets / polyimide ternary composite film

[0040] 1) Weigh molybdenum disulfide black powder and triethanolamine in a mass ratio of 1:100, mix and stir evenly. The resulting mixture was placed in a sonicator for sonication for 8 hours, then centrifuged at 3000 rpm for 20 min, and the supernatant was filtered with a 220 nm membrane, and the obtained solid matter was uniformly dispersed with deionized water and filtered again. After three times of dispersion (water dispersion) and filtration (with the same filter membrane), the few-layer molybdenum disulfide nanosheets on the filter paper were collected and dried in vacuum at 70°C for 8h.

[0041] 2) According to the method of Example 1, hexagonal boron nitride nanosheets (BNNS) and polyamic acid were prepared respectively.

[0042] 3) A certain amount of BNNS and molybdenum disulfide nanosheets were added to NMP solvent, ultrasonically dispersed f...

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Abstract

The invention provides a polyimide high-temperature dielectric composite film and a preparation method thereof. The composite film is formed by blending at least one of hexagonal boron nitride nanosheet and molybdenum disulfide nanosheet as well as polyimide. The mass fraction of the hexagonal boron nitride nanosheet is 6% to 12%, and the mass fraction of the molybdenum disulfide nanosheet is 1% to 2%. The introduction of a nanosheet filler not only improves the thermal properties of a polyimide film, but also improves the high temperature dielectric properties that a conventional PI film hasnot been involved. The composite film has the advantages of low dielectric loss, high breakdown strength, energy storage density and energy storage efficiency at normal temperature, and keeps low conductance loss and high breakdown field strength and energy storage density at the temperature of 150 DEG C.

Description

technical field [0001] The invention relates to the technical field of composite film materials, in particular to a polyimide high temperature dielectric composite film and a preparation method thereof. Background technique [0002] The increasing attention of electric energy storage has also greatly aroused scientists' interest in the research of flexible dielectric materials. In order to meet the application of emerging high energy density (UE)-capacitors in hybrid vehicles, electronic weapon systems, etc., advanced dielectric materials include high energy, high power density, good processing performance, environmental protection, flexible energy storage and other aspects. Performance puts forward higher requirements, especially in high temperature resistance. [0003] Polyimide (PI) refers to a class of polymers containing an imide ring (-CO-NH-CO-) on the main chain, among which polymers containing a phthalimide structure are the most important. As a special engineerin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08K7/00C08K3/38C08K3/30C08J5/18
CPCC08J5/18C08J2379/08C08K7/00C08K2003/3009C08K2003/385C08K2201/011
Inventor 胡国华吴丙钊王珊熊传溪
Owner WUHAN UNIV OF TECH
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