Flexible inductor and preparation method thereof

Abstract

The invention belongs to the field of flexible passive devices, particularly provides a flexible inductor and a preparation method thereof, and aims at solving the problems that an existing flexible passive inductor is relatively low in working frequency band, low in stress limit, difficult to adapt to more complex application environments and the like. The flexible inductor comprises a flexible substrate layer, a planar spiral metal layer, a flexible dielectric layer and a metal lead layer, parylene-N thin films with specific thicknesses are adopted as the flexible substrate and the flexible dielectric layer respectively, so that the dielectric constant is reduced, the cut-off frequency of the device is improved, and the mechanical performance of the device is improved; the embedded structure of the planar spiral metal layer on the flexible substrate and the embedded structure of the metal lead layer on the flexible dielectric layer are matched, so that the bonding strength between the metal and Parylene-N is enhanced, and the mechanical performance of the device is further improved; meanwhile, by adopting the preparation process of a silicon wafer carrier stripping method, the flexible inductor not only has good electrical properties and mechanical properties, but also has relatively strong temperature stability and biocompatibility, and the application prospect of the device is widened.

Description

technical field [0001] The invention belongs to the field of flexible passive devices, relates to a flexible inductor, and specifically provides a flexible inductor and a preparation method thereof. Background technique [0002] Flexible electronics is an emerging electronic technology that makes organic / inorganic material electronic devices on flexible / extensible substrates. Flexible electronics have the characteristics of lightness, thinness, bendability, foldability, and stretchability. It has great engineering application value. In recent years, a large number of scientific researchers have carried out research on flexible wireless communication systems, and flexible microwave monolithic integrated circuits have received extensive attention as sub-modules; high-performance flexible microwave monolithic integrated circuits require high-performance flexible passive As one of the basic flexible passive devices, flexible inductors play an important role in matching and filt...

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Problems solved by technology

[0003] Flexible inductors are realized by growing metal thin film inductor structures on flexible substrates. Flexible substrate materials are commonly used organic materials, such as: PET, PI, PDMS, etc., but their preparation process is not compatible with traditional processes, and there is thermal deformation. Photolithography problems such as poor alignment accuracy; at the same time, traditional dielectric layers such as Al 2 o 3 , HfO 2 The dielectric constant is relatively large, and the stress limit is low; therefore, the current flexible passive inductors have problems such as relatively low operating frequency band and low stress limit, and it is difficult to be suitable for more complex application environments; how to prepare a kind that can work stably at high Frequency, good mechanical properties, and flexible inductors with a variety of application scenarios have become the focus of research

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