Epoxy resin composite insulating material with mechanical damage targeted self-healing performance

A technology of epoxy resin and composite insulation, applied in microcapsule preparation, microsphere preparation and other directions, can solve the problems of safe operation of electrical equipment, reduce electronic sensitivity, threaten personnel, etc., and achieve a wide range of industrial application value, intrinsic electrical The effect of synergistic improvement in performance

Pending Publication Date: 2022-08-09
CHONGQING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing microencapsulation schemes focus on physical damage repair, relying on traditional external stimuli such as high temperature, humidity, and pH, which will reduce the sensitivity of electrons and even lead to insulation corrosion
2. The negative effects brought by the existing microcapsules, such as the deterioration of the mechanical and electrical properties of the matrix, are inevitable and unacceptable in the industrial application of insulating materials
3. The discharge of harmful comp

Method used

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  • Epoxy resin composite insulating material with mechanical damage targeted self-healing performance
  • Epoxy resin composite insulating material with mechanical damage targeted self-healing performance
  • Epoxy resin composite insulating material with mechanical damage targeted self-healing performance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Obtain an epoxy resin composite insulating material with mechanical damage-targeted self-healing performance, the composite insulating paper is formed by composite curing of microcapsules and epoxy resin materials, and obtains a target-repairing composite material mechanical damage function and Epoxy resin composite insulating material with synergistic improvement of intrinsic properties.

[0046] In this embodiment, the doping ratio of the microcapsules is determined according to the electrical performance test.

[0047] In this embodiment, the microcapsules are polyurethane microcapsules that are dual-triggered by ultraviolet light and moisture.

Embodiment 2

[0049] A preparation method of an epoxy resin composite insulating material with mechanical damage-targeted self-healing properties, comprising the following steps:

[0050] s1. Weigh the microcapsules and disperse them in 100 parts of E51 epoxy resin to obtain a mixture (the content of the microcapsules in the mixture is 0wt%, 1wt%, 2.5wt%, 5wt% and 10wt%), pour 80 parts of methyl hexahydrogen Phthalic anhydride, 5 parts of diethylenetriamine curing agent, and 2 parts of 2,4,6-tris(dimethylaminomethyl)phenol catalyst were mechanically stirred at room temperature at 500 rpm for ten minutes.

[0051] s2. After vacuum degassing, pour it into a stainless steel mold, and use a high-density directional magnetic field to drive the magnetic core microcapsules to move to the vulnerable area (upper surface), and the migration of the microcapsules is completed after 30 minutes.

[0052] s3. After removing the permanent magnet, cure at 90° C. for 2 hours, then raise the temperature to 11...

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Abstract

The invention discloses a preparation method of an epoxy resin composite insulating material with mechanical damage targeted self-healing performance, and belongs to the field of materials. The preparation method comprises the following steps: firstly, weighing microcapsules, dispersing the microcapsules in epoxy resin to obtain a mixture, adding methylhexahydrophthalic anhydride, a diethylenetriamine curing agent and a catalyst 2, 4, 6-tri (dimethylaminomethyl) phenol into the mixture, uniformly mixing, and reacting; carrying out vacuum degassing on a product obtained after the reaction is finished, pouring the product into a stainless steel mold, driving the magnetic core microcapsule to move towards an easily damaged area by utilizing a high-density directional magnetic field, and completing migration of the microcapsule after 20-40 minutes; and after the permanent magnet is removed, curing for 1-3 hours at 80-100 DEG C, then heating to 100-110 DEG C, continuing curing for 1-3 hours, and taking out the epoxy resin composite insulating sheet. The method is based on the self-repairing performance test of the epoxy resin composite insulating material, and the targeted mechanical damage repairing function of the epoxy resin composite insulating material is proved through a field emission scanning electron microscope and an inverted multi-photon confocal microscope.

Description

technical field [0001] The invention belongs to the technical field of preparation of novel micro-nano structure self-healing materials in insulating materials, and particularly relates to an epoxy resin composite insulating material with mechanical damage-targeted self-healing properties. Background technique [0002] As an important basic insulating material, epoxy resin is widely used in power equipment, electronic device packaging, military aviation and other fields due to its low manufacturing cost, good mechanical properties, and excellent insulating properties. However, during the long-term operation, it will be subject to the combined action of electrical, thermal, mechanical and other stresses, which will inevitably cause local cracking inside, resulting in the degradation of the insulation performance of the material or even premature failure. Inspired by the natural biological self-healing ability, self-healing technology has attracted extensive attention of schol...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L75/14B01J13/14
CPCC08L63/00B01J13/14C08L2205/18C08L2203/20C08L75/14
Inventor 司马文霞孙魄韬牛朝露袁涛杨鸣赵明克
Owner CHONGQING UNIV
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