Low-dielectric heat-conducting polyimide film and preparation method thereof

A polyimide film and low-dielectric technology, which is applied in the field of low-dielectric thermal conductivity polyimide film and its preparation, can solve problems such as reducing comprehensive performance, and achieve the effect of increasing thermal conductivity and high thermal conductivity.

Pending Publication Date: 2022-08-09
纳电(广东)材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the face of today's high-frequency and high-speed signal transmission requirements, traditional polyimide materials have been difficult to meet the needs. Therefore, without reducing the overall performance, the development of thermally conductive polyimide materials with low dielectric constant is a research hotspot.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A low-dielectric thermal conductivity polyimide film, in parts by weight, comprises the following raw materials:

[0034] Dianhydride monomer: 10 parts of benzophenone tetraacid dianhydride

[0035] Diamine monomer: 10 parts of 3,4-diaminodiphenyl ether

[0036] Solvent B: 100 parts of N-methylpyrrolidone

[0037] Thermally conductive filler: 0.1 part of submicron magnesium oxide

[0038] Coupling agent: 0.05 part of γ-aminopropyltrimethoxysilane

[0039] Auxiliary: 0.05 part of fusible polytetrafluoroethylene resin

[0040] Solvent A: 100 parts of methanol.

[0041] A preparation method of a low-dielectric thermal conductivity polyimide film, comprising the following steps:

[0042] 1) Disperse the submicron-level (0.03 μm) thermally conductive filler in solvent A, stir and disperse in a water bath at 50°C, add coupling agent, add auxiliary agent while stirring, stir and disperse, and keep warm for 6 hours to obtain a mixed solution; The mixed solution was lowere...

Embodiment 2

[0048] A low-dielectric thermal conductivity polyimide film, in parts by weight, comprises the following raw materials:

[0049] Dianhydride monomer: 15 parts of pyromellitic dianhydride

[0050] Diamine monomer: 15 parts of 4,4'-diaminodiphenyl ether

[0051] Solvent B: 150 parts of N,N-dimethylacetamide

[0052] Thermal filler: submicron spherical alumina 0.2 parts

[0053] Coupling agent: 0.1 part of γ-aminopropyltriethoxysilane

[0054]Auxiliary: 0.1 part of silica

[0055] Solvent A: 150 parts of ethanol.

[0056] A preparation method of a low-dielectric thermal conductivity polyimide film, comprising the following steps:

[0057] 1) Disperse the submicron-level (0.1 μm) thermally conductive filler in solvent A, stir and disperse in a water bath at 60°C, add coupling agent, add auxiliary agent while stirring, stir and disperse, keep warm for 10 hours to obtain a mixed solution; The mixed solution was lowered to room temperature, and vacuum-dried in a vacuum oven at ...

Embodiment 3

[0063] A low-dielectric thermal conductivity polyimide film, in parts by weight, comprises the following raw materials:

[0064] Dianhydride monomer: 12 parts of 4,4'-oxybisphthalic anhydride

[0065] Diamine monomer: 13 parts of 4,4'-diaminodiphenylmethane

[0066] Solvent B: 130 parts of N,N-dimethylformamide

[0067] Thermally conductive filler: 0.15 parts of submicron zinc oxide

[0068] Coupling agent: 0.08 part of N-β(aminoethyl)-γ-aminopropyltrimethoxysilane

[0069] Additives: silica, 0.08 part of fusible polytetrafluoroethylene resin

[0070] Solvent A: 130 parts of isopropanol.

[0071] A preparation method of a low-dielectric thermal conductivity polyimide film, comprising the following steps:

[0072] 1) Disperse the submicron-level (0.08μm) thermally conductive filler in solvent A, stir and disperse in a water bath at 55°C, add coupling agent, add auxiliary agent while stirring, stir and disperse, and keep warm for 8 hours to obtain a mixed solution; The mix...

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Abstract

The invention discloses a low-dielectric heat-conducting polyimide film and a preparation method thereof, and the low-dielectric heat-conducting polyimide film comprises the following raw materials by weight: 10 to 15 parts of a dianhydride monomer, 10 to 15 parts of a diamine monomer, 100 to 150 parts of a solvent B, 0.1 to 0.2 part of a heat-conducting filler, 0.05 to 0.1 part of a coupling agent, 0.05 to 0.1 part of an auxiliary agent, and 100 to 150 parts of a solvent A; the low-dielectric heat-conducting polyimide film is prepared by the following steps: preparing low-dielectric heat-conducting composite powder, synthesizing polyamide acid, filtering, discharging bubbles, pre-forming a film, and forming the film by imidization, thereby obtaining the low-dielectric heat-conducting polyimide film. According to the low-dielectric heat-conducting polyimide film obtained by the preparation method disclosed by the invention, the polyimide film obtained by adding the heat-conducting filler and the auxiliary agent has a relatively low dielectric constant and a relatively high heat conductivity coefficient.

Description

technical field [0001] The invention relates to the technical field of polyimide films, in particular to a low-dielectric thermal conductivity polyimide film and a preparation method thereof. Background technique [0002] With the rapid development of 5G, Internet of Things, advanced electronics and high-frequency communication technology, microelectronics, as a key technology, has become a hot spot in the world's high-tech competition. The power and wiring density of electronic components have increased significantly. The heat generated per unit volume increases sharply during operation. The resulting thermal build-up can cause signal delay, crosstalk, and power consumption between lines, seriously affecting the performance reliability and service life of the device. [0003] The polyimide film known as "gold film" has excellent performance, it is widely used in space technology, F, H class motor, electrical insulation, FPC (flexible printed circuit board), PTC electric he...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08G73/10C08J5/18C08K3/04C08K3/22C08K3/28C08K3/38C08K7/18C08K9/00C08K9/06
CPCC08J5/18C08G73/1071C08G73/1028C08J2379/08C08K9/06C08K2003/222C08K9/00C08K7/18C08K2003/2296C08K2003/282C08K2003/385C08K3/041C08K2201/011C08K3/042Y02P20/10
Inventor 朱向忠刘展宏梁先文涂悦封力行赖志强
Owner 纳电(广东)材料科技有限公司
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