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Encapsulant resin member for semiconductor, and semiconductor element

A photovoltaic and sealing resin technology, which is applied in photovoltaic power generation, electrical components, semiconductor/solid-state device components, etc., can solve the problems of appearance degradation and lower yield of solar cell components, and achieve the effect of preventing degradation

Inactive Publication Date: 2005-01-19
CANON KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These retained air bubbles degrade the appearance and are the cause of lower yield of solar cell modules

Method used

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  • Encapsulant resin member for semiconductor, and semiconductor element
  • Encapsulant resin member for semiconductor, and semiconductor element
  • Encapsulant resin member for semiconductor, and semiconductor element

Examples

Experimental program
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Effect test

example 1

[0059] (Preparation of photovoltaic element part)

[0060] The amorphous silicon (a-Si) solar cell part (photovoltaic element part) fabricated below is shown in Figure 2A and 2B in the structure. Specifically, an Al layer (5000 Å thick) and a ZnO layer (5000 Å thick) were sequentially formed on a clean stainless steel substrate 201 as the back reflection layer 202 by sputtering. Then, by plasma CVD method, from SiH 4 、PH 3 and H 2 The mixed gas forms the n-type a-Si layer, made of SiH 4 and H 2 The mixed gas forms the i-type a-Si layer, composed of SiH 4 , BF 3 and H 2 The mixed gas forms a p-type microcrystalline μc-Si layer, thereby forming a p-type microcrystalline μc-Si layer, thereby forming an n-layer 150 Å thick / i layer 4000 Å thick / p layer 100 Å thick / n layer 100 Å thick / i layer 800 Å thick / p layer 100 Å The tandem type a-Si photoelectric conversion semiconductor layer 203 is formed in a thick layer structure. Then by resistance heating at O 2 Evaporate in...

example 2

[0067] The same method as in Example 1 was used except that an electric field of 3 KV / mm was applied at the stage of preparing an EVA sheet (460 μm thick) as the front surface sealing resin, and no electric field was applied between the electrode 307 and the sheet 301 during the lamination operation Lamination operations were carried out and the assemblies thus obtained were evaluated.

example 3

[0069] A first EVA resin plate (230 μm thick) containing 1.0 parts by weight of a silane coupling agent relative to 100 parts by weight of EVA and not containing an ultraviolet absorber was placed on the photoelectric conversion element portion, containing 0.3 parts by weight of ultraviolet rays relative to 100 parts by weight of EVA Absorbent and a second EVA resin sheet (230 μm thick) without silane coupling agent are placed on the first sheet, the two resin sheets are bonded to form the front surface sealing resin, and the electrode 307 and the sheet 301 are bonded during the lamination operation. The lamination operation was performed in the same manner as in Example 1 except that no electric field was applied between them, and the assemblies thus obtained were evaluated.

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PUM

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Abstract

Provided is an encapsulant resin for a semiconductor that effectively functions even with a relatively small amount of an additive. The encapsulant resin for a semiconductor is characterized in that the additive has a concentration gradient in the direction of thickness of the encapsulant resin. Specifically, the concentration gradient of the additive is established in the direction of thickness of the encapsulant resin by stacking at least two types of organic polymer resins containing different contents of the additive to form the encapsulant resin or by applying an electric field to the encapsulant resin to effect electrophoresis of the polar additive in the encapsulant resin.

Description

technical field [0001] The present invention relates to a sealing resin member for semiconductors, and a semiconductor element sealed (closed) using a resin member, and particularly relates to sealing a photovoltaic element using a resin member. Background technique [0002] It is common practice to seal semiconductor elements such as photovoltaic elements, photodiodes, and the like with a transparent sealing resin. For example, a solar cell module is generally configured as a structure in which a photovoltaic element is sealed with a sealing resin between a front surface member and a rear surface member. [0003] In order to fill the unevenness of the surface of the photovoltaic element and to bond the element to the front surface member and the back surface member, sealing resin is used. The sealing resin is usually a transparent, thermoplastic, organic polymer resin. Typical examples are polyvinyl butyral (PVB) and ethylene vinyl acetate (EVA). Among them, because EVA ...

Claims

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Application Information

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IPC IPC(8): C08L101/00C08K3/00H01L23/29C08K5/00H01L23/31H01L31/04H01L31/02
CPCB32B17/04H01L23/293H01L2924/0002B32B17/10788H01L23/3107H01L2924/12044B32B17/10678Y02E10/50H01L2924/19041H01L31/048H01L31/0481H01L2924/00
Inventor 木曾盛夫片冈一郎山田聪塩塚秀则善光秀聪
Owner CANON KK
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