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Preparation method of low oxygen content microballon parent metal powder and its special equipment

A technology of solder powder and special equipment, which is applied in the field of preparation of microsphere solder powder with low oxygen content, which can solve the problems of difficulty in obtaining powder with particle size distribution and inability to classify powder, so as to prevent powder oxidation, low production cost and low oxygen content Effect

Inactive Publication Date: 2006-12-20
王崇琳
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The shortcomings of the above two documents are: it is difficult to obtain powders with more uniform particle size distribution and better sphericity, and it is not possible to directly classify powders with different particle sizes

Method used

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  • Preparation method of low oxygen content microballon parent metal powder and its special equipment
  • Preparation method of low oxygen content microballon parent metal powder and its special equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Preparation of Pb-Sn alloy medium particle size powder (74~104μm) in air:

[0027] Such as figure 1 As shown, the special equipment of this embodiment includes a melting bag (crucible) 1 placed in a closed atomizing container 9, an atomizer 2, a thermostat 3, a bearing 4 and a motor 5 that drives the atomizer to rotate, wherein The atomizer 2 is located below the melting bag 1 and is a rotary container with an open upper end. The thermostat 3 is installed on the bottom of the atomizer 2, and the bearing is installed on the rotating shaft of the atomizer. The outer side of the rotating shaft is covered with a water cooling chamber 6 and a motor 5 Placed in the water cooling chamber 6, the bottom of the atomizing container 9 is connected with the powder collecting chamber 7; the diameter of the atomizer is φ50mm, and the motor 5 is a high-speed motor driven by a belt.

[0028] Take 2 kg of Pb-61.9% Sn alloy, heat it to 250°C in a crucible with a leaky nozzle 8 to melt it...

Embodiment 2

[0030] Prepare Pb-Sn alloy fine-grained powder (44~74 μ m) in airtight container, and the difference with embodiment 1 is: as figure 2 As shown, the diameter of the atomizer is φ60mm, and the motor 5 is a high-speed motor coaxial with the atomizer.

[0031] In the airtight container, fill 0.1MPa high-purity nitrogen gas, the oxygen content of the gas is less than 100ppm, heat 20 kg of Pb-61.9% Sn alloy to 300°C and melt it, and use a coaxial high-speed motor to atomize the atomizer with a diameter of φ60mm Accelerate to 10,000 rpm, open the stopper and control the flow rate of the melt to 15-25 g / s, the obtained spherical powder has a particle size range of 44-74 μm, and the oxygen content of the powder is 80 ppm.

Embodiment 3

[0033] Prepare Pb-Sn alloy very fine-grained powder (30~50 μm) in airtight container, and difference with embodiment 2 is: in airtight container, be filled with 0.09MPa high-purity argon gas, the oxygen content of its gas is less than 100ppm , Heat 20 kg of Pb-61.9% Sn alloy to 320 ° C to melt, use a coaxial high-speed motor to accelerate the atomizer with a diameter of φ60 mm to 12000 rpm, and control the flow rate of the melt to 10 to 15 grams after opening the stopper / sec, the particle size of the obtained spherical powder ranges from 30 to 50 μm, and the oxygen content of the powder is 85 ppm.

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Abstract

A method for preparing the microspherial flux powder with low oxygen content includes such steps as smelting the raw materials of flux, pouring in high-speed rotating atomizer at 4000 rpm, centrigual atomizing to become superfine liquid drops, and condensing in the flying procedure. Its apparatus is composed of a sealed atomizing chamber, smelting ladle, atomizer, constant-temp unit and motor.

Description

technical field [0001] The invention relates to powder preparation technology, in particular to a method for preparing low-oxygen content microsphere solder powder and special equipment thereof. Background technique [0002] Today, many electronic and electrical equipment such as laptops, mobile phones, and cameras use solder paste to solder printed circuit boards. The main components of the solder paste are alloy-based solder powders such as Pb-Sn, Sn-Zn-Bi, and Sn-Ag-Cu. The three main technical requirements for this powder are: fine particle size, generally <200 mesh, that is, <74μm, and 325 mesh, that is, 44μm powder in many occasions; the shape is spherical; the oxygen content is less than 100ppm to ensure welding quality. At present, it is mainly manufactured by inert gas atomization method, that is, the alloy is melted and flowed out, sprayed into liquid droplets and condensed into powder with high-pressure gas. The main problem of this method is that the partic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F9/10B05B17/04B23K35/02B23K35/22
Inventor 王崇琳魏双祺宋积德姜文滨
Owner 王崇琳
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