Terminal with ruthenium layer and component with the same terminal

A technology of terminals and parts, which is applied in the field of terminals and parts with the terminals, can solve problems such as unexplained solutions, unspoken gold layer peeling problems, etc.

Inactive Publication Date: 2004-04-07
FCM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the relevant technical documents, there is no mention of the stripping

Method used

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  • Terminal with ruthenium layer and component with the same terminal
  • Terminal with ruthenium layer and component with the same terminal
  • Terminal with ruthenium layer and component with the same terminal

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0050] (Example 1)

[0051] This embodiment is a connector terminal in which a ruthenium layer and a gold layer as a surface metal layer are sequentially formed on a conductive substrate. The following reference figure 1 Explain it.

[0052] First, as the conductive base 101, a strip-shaped nickel with a thickness of 0.1 mm is press-processed into a connector shape, and the continuous connector terminal shape is cut into a length of 70 mm. After cutting, it was washed at 53°C for 3 minutes with a 50 g / l active agent (trade name: ACE CLEAN 30, manufactured by Okuno Pharmaceutical Co., Ltd.), and subjected to degreasing treatment. After washing with water several times, use 100g / l of active agent (trade name: NCL astoru, manufactured by Okuno Pharmaceutical Co., Ltd.) at 50°C and current density of 5.0A / dm 2 Rinse for 2 minutes under the conditions of, and conduct electrolytic degreasing treatment. Then, after washing with water several times, it was treated with 5% sulfuric acid a...

Example Embodiment

[0057] (Example 2)

[0058] This embodiment is a connector terminal in which a base layer, a ruthenium layer, and a gold layer as a surface metal layer are sequentially formed on a conductive substrate. The following reference figure 2 Explain it.

[0059] First, as the conductive substrate 201, a strip-shaped phosphor bronze with a thickness of 0.1 mm is pressed into a connector shape, and the continuous connector terminal shape is cut into a length of 70 mm. After cutting, it was washed at 53°C for 3 minutes with a 50 g / l active agent (trade name: ACE CLEAN 30, manufactured by Okuno Pharmaceutical Co., Ltd.), and subjected to degreasing treatment. After washing with water several times, use 100g / l of active agent (trade name: NCL astoru, manufactured by Okuno Pharmaceutical Co., Ltd.) at 50°C and current density of 5A / dm 2 Rinse for 2 minutes under the conditions of, and conduct electrolytic degreasing treatment. Then, after washing with water several times, it was treated with...

Example Embodiment

[0065] (Example 3)

[0066] This embodiment is a connector terminal in which a plurality of base layers, ruthenium layers, and a gold layer as a surface metal layer are sequentially formed on a conductive substrate. The following reference image 3 Explain it.

[0067] First, as the conductive base 301, a strip-shaped brass with a thickness of 0.1 mm is press-processed into a connector shape, and the continuous connector terminal shape is cut into a length of 70 mm. After cutting, it was washed at 53°C for 3 minutes with a 50 g / l active agent (trade name: ACE CLEAN 30, manufactured by Okuno Pharmaceutical Co., Ltd.), and subjected to degreasing treatment. After washing with water several times, use 100g / l of active agent (trade name: NC Lastoru, manufactured by Okuno Pharmaceutical Co., Ltd.) at 50°C and current density of 5A / dm 2 Rinse for 2 minutes under the conditions of, then electrolytic degreasing treatment. Then, after washing with water several times, it was treated with 5...

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Abstract

A terminal of the present invention includes a ruthenium layer (102) formed on conductive substrate (101) entirely or partially, and a surface metal layer (103) made of at least one of the metals selected from the group consisting of Au, Pt, Ag, Pd, Rh, Co, Ni, In and Sn, or made of an alloy containing at least one of the metals selected from the group, which is formed on the ruthenium layer (102) entirely or partially.

Description

technical field [0001] The present invention relates to terminals (such as connector terminals, relay terminals, slide switch terminals, solder terminals, etc.) used for the purpose of widening connection in electric, electronic products and semiconductor products or automobile parts and the like. In more detail, it is particularly suitable for terminals and terminals that are used in various applications (including both pluggable and non-pluggable applications) that require pluggability, heat resistance, corrosion resistance, and high hardness. Parts of the terminal (such as connectors, relays, slide switches, etc.). Background technique [0002] Conventionally, various terminals including connector terminals have been used in applications such as electrical, electronic products, semiconductor products, and automobile parts. However, especially in applications requiring contact reliability, terminals having a structure in which a Ni layer is formed on a conductive substrat...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01R13/03
CPCH01L2924/0002H01L23/49582H01L2924/01046H01R13/03H01L2924/01078Y10T428/12632Y10T428/12812Y10T428/12861Y10T428/12889Y10T428/12896H01L2924/00
Inventor 三浦茂纪
Owner FCM CORP
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