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Terminal with ruthenium layer and component with the same terminal

A technology of terminals and parts, which is applied in the field of terminals and parts with the terminals, can solve problems such as unexplained solutions, unspoken gold layer peeling problems, etc.

Inactive Publication Date: 2004-04-07
FCM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the relevant technical documents, there is no mention of the stripping problem of the gold layer, so the solution to the related problem is not described.

Method used

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  • Terminal with ruthenium layer and component with the same terminal
  • Terminal with ruthenium layer and component with the same terminal
  • Terminal with ruthenium layer and component with the same terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] This embodiment is a connector terminal in which a ruthenium layer and a gold layer as a surface metal layer are sequentially formed on a conductive substrate. Refer to the following figure 1 Describe it.

[0052] First, as the conductive substrate 101, a strip-shaped nickel having a thickness of 0.1 mm was press-worked into a connector shape, and the continuous connector terminal shape was cut into a length of 70 mm. After cutting, it was washed with 50 g / l of an active agent (trade name: ACE CLEAN 30, manufactured by Okuno Pharmaceutical Co., Ltd.) at 53° C. for 3 minutes to perform a degreasing treatment. Then, after washing with water several times, 100 g / l of active agent (trade name: NCL astoru, manufactured by Okuno Pharmaceutical Co., Ltd.) was used at 50° C. at a current density of 5.0 A / dm 2 Wash for 2 minutes under certain conditions, and perform electrolytic degreasing. Then, after washing with water several times, it was treated with 5% sulfuric acid at ...

Embodiment 2

[0058] This embodiment is a connector terminal in which a base layer, a ruthenium layer, and a gold layer as a surface metal layer are sequentially formed on a conductive substrate. Refer to the following figure 2 Describe it.

[0059] First, as the conductive substrate 201 , strip-shaped phosphor bronze having a thickness of 0.1 mm was press-worked into the shape of a connector, and the continuous connector terminal shape was cut into a length of 70 mm. After cutting, it was washed with 50 g / l of an active agent (trade name: ACE CLEAN 30, manufactured by Okuno Pharmaceutical Co., Ltd.) at 53° C. for 3 minutes to perform a degreasing treatment. Then, after washing with water several times, 100 g / l of active agent (trade name: NCL astoru, manufactured by Okuno Pharmaceutical Co., Ltd.) was used at 50° C. at a current density of 5 A / dm 2 Wash for 2 minutes under certain conditions, and perform electrolytic degreasing. Then, after washing with water several times, it was trea...

Embodiment 3

[0066] This embodiment is a connector terminal in which a plurality of underlayers, a ruthenium layer, and a gold layer as a surface metal layer are sequentially formed on a conductive substrate. Refer to the following image 3 Describe it.

[0067] First, as the conductive substrate 301 , a strip-shaped brass with a thickness of 0.1 mm was press-worked into the shape of a connector, and the continuous connector terminal shape was cut into a length of 70 mm. After cutting, it was washed with 50 g / l of an active agent (trade name: ACE CLEAN 30, manufactured by Okuno Pharmaceutical Co., Ltd.) at 53° C. for 3 minutes to perform a degreasing treatment. Then, after washing with water several times, use 100 g / l of active agent (trade name: NC Lastoru, manufactured by Okuno Pharmaceutical Industry Co., Ltd.) at 50 ° C and a current density of 5 A / dm 2 Wash for 2 minutes under certain conditions, and perform electrolytic degreasing. Then, after washing with water several times, it ...

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Abstract

A terminal of the present invention includes a ruthenium layer (102) formed on conductive substrate (101) entirely or partially, and a surface metal layer (103) made of at least one of the metals selected from the group consisting of Au, Pt, Ag, Pd, Rh, Co, Ni, In and Sn, or made of an alloy containing at least one of the metals selected from the group, which is formed on the ruthenium layer (102) entirely or partially.

Description

technical field [0001] The present invention relates to terminals (such as connector terminals, relay terminals, slide switch terminals, solder terminals, etc.) used for the purpose of widening connection in electric, electronic products and semiconductor products or automobile parts and the like. In more detail, it is particularly suitable for terminals and terminals that are used in various applications (including both pluggable and non-pluggable applications) that require pluggability, heat resistance, corrosion resistance, and high hardness. Parts of the terminal (such as connectors, relays, slide switches, etc.). Background technique [0002] Conventionally, various terminals including connector terminals have been used in applications such as electrical, electronic products, semiconductor products, and automobile parts. However, especially in applications requiring contact reliability, terminals having a structure in which a Ni layer is formed on a conductive substrat...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01R13/03
CPCH01L2924/0002H01L23/49582H01L2924/01046H01R13/03H01L2924/01078Y10T428/12632Y10T428/12812Y10T428/12861Y10T428/12889Y10T428/12896H01L2924/00
Inventor 三浦茂纪
Owner FCM CORP
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