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Resin curable with actinic energy ray, photocurable/thermosetting resin composition containing the same

An active energy ray, resin composition technology, applied in optics, opto-mechanical equipment, photo-engraving process of patterned surface, etc., can solve the problems of moisture absorption resistance, poor long-term reliability, etc., and achieve excellent photocurability, high The effect of balancing flexibility and toughness

Inactive Publication Date: 2004-05-19
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such poor moisture absorption resistance and long-term reliability are not limited to the above-mentioned packaging technologies, but also have problems in other aspects such as solder resists for general printed wiring boards, and interlayer insulation layers of multilayer wiring boards such as build-up boards.

Method used

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  • Resin curable with actinic energy ray, photocurable/thermosetting resin composition containing the same
  • Resin curable with actinic energy ray, photocurable/thermosetting resin composition containing the same
  • Resin curable with actinic energy ray, photocurable/thermosetting resin composition containing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0098] Hereinafter, the present invention will be specifically described by way of examples and comparative examples. Of course, the present invention is not limited to the following examples. The following "parts" and "%" are subject to mass unless otherwise stated.

Synthetic example 1

[0100] In the flask equipped with gas inlet pipe, stirring device, cooling pipe and thermometer, put 172 parts of 1,4-cyclohexenedioic acid and hydrogenated bisphenol A diglycidyl ether (Nippon Cyclohexene) of 176 grams / equivalent Oxygen resin company make, YL-6663) 880 parts, it stirred at 100 degreeC under nitrogen atmosphere. After that, 0.65 parts of triphenylphosphine was added, and the temperature in the flask was increased to 150° C., while maintaining at 150° C. for about 90 minutes to obtain an epoxy compound (A′) having an epoxy equivalent of 438 g / equivalent.

[0101] Next, the temperature in the flask was cooled to below 70° C., 780 parts of epichlorohydrin and 635 parts of dimethyl sulfoxide were added, and the temperature was raised to 70° C. while stirring and maintained. Thereafter, 150 parts of 96% sodium hydroxide were intermittently added for 90 minutes, and reacted for an additional 3 hours. After the reaction is terminated, distill most of the excess epic...

Embodiment 1 and comparative example 1、2

[0109] Using the varnishes obtained in Synthesis Example 1 and Comparative Synthesis Examples 1 and 2 above, the formulation components in Table 1 were kneaded with a three-roll machine to obtain photocurable and thermosetting resin compositions. Table 2 shows the characteristic values ​​of each composition.

[0110] Composition (parts by mass)

[0111] characteristics

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Abstract

An actinic energy ray-curable resin is obtained by reacting (c) an epihalohydrin with hydroxyl groups of a linear epoxy resin (A') which is a product of the polyaddition reaction of (a) a bifunctional hydrogenated bisphenolic epoxy compound with (b) a compound having at least two carboxyl groups in its molecule to obtain a polynuclear epoxy resin (A'') having epoxy groups in its terminal and side chain and further reacting (d) an unsaturated monocarboxylic acid with an epoxy group of the polynuclear epoxy resin (A'') to introduce a photopolymerizable unsaturated group therein and further reacting (e) a polybasic acid anhydride with a hydroxyl group of the polynuclear epoxy resin to introduce a carboxyl group therein. A photocurable and thermosetting resin composition capable of being developed with an aqueous alkaline solution is obtained by mixing this actinic energy ray-curable resin with a photopolymerization initiator, a diluent, and a polyfunctional epoxy compound. The resultant photocurable and thermosetting resin composition is useful as a solder resist for a printed circuit board, interlaminar insulating materials for a multi-layer printed circuit board, and the like.

Description

technical field [0001] The present invention relates to a linear active energy ray curable resin having a photopolymerizable unsaturated group and a carboxyl group, particularly a linear and alkali-soluble active energy ray curable resin containing regularly repeating cyclohexene rings. The present invention also relates to an alkali-developable photocurable / thermosetting resin composition using the above-mentioned active energy ray-curable resin, and a cured product thereof. More specifically, it is suitable for various purposes, especially permanent masks for printed wiring boards, interlayer insulation layers for multilayer wiring boards, etc. After irradiation with active energy rays, it is developed with a dilute alkali aqueous solution to form an image, and then activated Heat treatment after energy ray irradiation, or active energy ray irradiation after heat treatment, or final curing with heat treatment, can form low dielectric properties, adhesion, resistance to elect...

Claims

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Application Information

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IPC IPC(8): C08F283/10C08G59/14C08G59/42C08L15/00C08L51/08C08L63/10C09D5/25G03F7/038
CPCC08G59/1494C08L63/10C08L51/08C08F283/10C08L15/00C08G59/4292G03F7/038G03F7/0388C08L2666/02C08G59/1455
Inventor 峰岸昌司小川勇太
Owner TAIYO INK MFG
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