Substrate and its mfg. method, microlens, substrate, transmitting panel and rear projector
A manufacturing method and technology of microlenses, which are used in the manufacture of microstructure devices, lenses, instruments, etc.
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Embodiment 1
[0263] A substrate with a concave portion for a microlens equipped with a concave portion for a microlens was fabricated, and then a microlens substrate was fabricated using the substrate with a concave portion for a microlens in the following manner.
[0264] First, an alkali-free glass substrate having a rectangle of 1.2 m×0.7 m and a thickness of 5 mm was prepared.
[0265] The non-alkali glass substrate was soaked and heated to 30° C. in a cleaning liquid (ie, 4% by weight aqueous solution of ammonium bifluoride (containing a small amount of hydrogen peroxide solution)) to be cleaned, thereby cleaning its surface.
[0266] -1A- Next, a 0.2 µm-thick film (mask and rear surface protective film) containing chromium oxide and chromium (Cr) was formed on the non-alkali glass substrate by a spraying method.
[0267] -2A- Next, the mask was blasted to form a large number of initial holes in the central portion of the mask in an area of 113 cm x 65 cm.
[0268] Here...
Embodiment 2
[0280] First, an alkali-free glass substrate having a rectangle of 1.2 m×0.7 m and a thickness of 5 mm was prepared.
[0281] The non-alkali glass substrate was soaked and heated to 30° C. in a cleaning liquid (ie, 4% by weight aqueous solution of ammonium bifluoride (containing a small amount of hydrogen peroxide solution)) to be cleaned, thereby cleaning its surface.
[0282] -1B- Next, a silicon thin film (mask and rear protective film) having a thickness of 0.3 μm was formed on the alkali-free substrate by the CVD method.
[0283] -2B- Next, the mask was laser processed to form a large number of initial holes in the central portion of the mask in an area of 113 cm x 65 cm.
[0284] In this regard, laser processing was performed under the condition of 2 mW using the second harmonic of YAG laser.
[0285] In this way, initial holes are formed in a random pattern over the entire area of the above-mentioned mask. The average diameter of the initial pores is 8...
Embodiment 3
[0293] First, an alkali-free glass substrate having a rectangle of 1.2 m×0.7 m and a thickness of 5 mm was prepared.
[0294] The non-alkali glass substrate was soaked and heated to 30° C. in a cleaning liquid (ie, 4% by weight aqueous solution of ammonium bifluoride (containing a small amount of hydrogen peroxide solution)) to be cleaned, thereby cleaning its surface.
[0295] -1C- Next, a thin film (mask and rear surface protective film) consisting of a Cr layer and an Au layer (Cr—Au thin film) was formed on the non-alkali glass substrate by the CVD method. The thickness of the Cr layer was 0.01 μm, and the thickness of the Au layer was 0.2 μm.
[0296] -2C- Next, the mask was spray cleaned to form a large number of initial holes in the central portion of the mask in an area of 113 cm x 65 cm.
[0297] Here, at 4kg / cm 2 under the injection pressure and 40kg / m 2 The spray cleaning is carried out under the conditions of using glass beads with an average parti...
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